一种存储卡封装结构
By designing heat dissipation and limiting mechanisms, the heat dissipation problem of the memory card packaging structure under external force and vibration environments is solved, achieving efficient heat dissipation and dust protection, and extending the service life of the memory card.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 深圳市天创伟业科技有限公司
- Filing Date
- 2025-07-09
- Publication Date
- 2026-07-17
Smart Images

Figure CN224519512U_ABST
Abstract
Claims
1. A memory card package structure, characterized by: Includes a top shell (1), a bottom shell (2), a base plate (7), two memory cards (8), a heat dissipation mechanism, and two sets of limiting mechanisms: The substrate (7) is detachably connected to the inner cavity of the bottom shell (2), and the two storage cards (8) are symmetrically installed on the substrate (7). The top shell (1) and the bottom shell (2) are detachably connected. The top shell (1) has an installation groove (15) on its top, and the heat dissipation mechanism is detachably connected to the installation groove (15). The heat dissipation mechanism includes a fixed frame (20), two heat dissipation fins (10), two fixed plates (21), two thermally conductive silicone pads (22), a mounting frame (3), a heat dissipation mesh plate (9), a base plate (11), and a dustproof mesh (5). The fixed frame (20) is slidably inserted into the mounting groove (15). The base plate (11) is fixedly connected to the bottom of the fixed frame (20). Two through-holes (18) are symmetrically opened on the base plate (11). An opening (16) is opened in the mounting groove (15) at a position corresponding to the two through-holes (18). The fixing plate (21) is fixedly connected to the two openings (18) respectively. The bases of the two heat dissipation fins (10) are fixedly connected to the top of the two fixing plates (21) respectively. The two thermal conductive silicone pads (22) are fixedly connected to the bottom of the two fixing plates (21) respectively, and the two thermal conductive silicone pads (22) are respectively attached to the top of the two memory cards (8). The mounting frame (3) is detachably connected to the top of the fixing frame (20). The heat dissipation mesh plate (9) is fixedly connected to the inside of the fixing frame (20). The dustproof net (5) is adhered to the top of the heat dissipation mesh plate (9). The two sets of limiting mechanisms are respectively set at the front and rear ends of the fixed frame (20).
2. The memory card package structure of claim 1, wherein: Each set of limiting mechanisms includes two elastic protrusions (14), two limiting blocks (13), a first magnet (12), and a second magnet (19). The two elastic protrusions (14) are fixedly connected to one end of the fixed frame (20) near the two sides. The first magnet (12) is embedded in the middle of one end of the fixed frame (20). The two limiting blocks (13) are fixedly connected to the fixed frame (20) between the left and right sides of the first magnet (12) and the two elastic protrusions (14). The inner sidewall of the mounting groove (15) corresponding to the two elastic protrusions (14) is provided with two matching engagement holes (17). The inner sidewall of the mounting groove (15) corresponding to the two limiting blocks (13) is provided with two limiting grooves (4) corresponding to the two limiting blocks (13). The inner sidewall of the mounting groove (15) corresponding to the first magnet (12) is embedded with a second magnet (19), and the first magnet (12) and the corresponding second magnet (19) attract each other.
3. The memory card package structure of claim 2, wherein: The elastic protrusion (14) is made of POM plastic, and the dustproof net (5) is made of nylon dustproof net.
4. The memory card package structure of claim 3, wherein: The fixing plate (21) is made of copper.
5. The memory card package structure of claim 4, wherein: The mounting frame (3) is fixed to the top of the fixing frame (20) near the four corners by fixing bolts.
6. The memory card package structure of claim 5, wherein: The bottom size of the thermally conductive silicone pad (22) is the same as the top size of the memory card (8).
7. The memory card package structure of claim 6, wherein: The top shell (1) is provided with a buckle groove (6) in the middle of the top right side, and the buckle groove (6) is communicated with the mounting groove (15).