Laminated busbar modules and electrical equipment

Abstract

This disclosure provides a stacked busbar module and electrical equipment. The stacked busbar module includes multiple busbars, insulating components, and a filter board. The multiple busbars are stacked along a first direction and spaced apart from each other. Insulating components are disposed between adjacent busbars. The filter board is disposed on one side of the multiple busbars along the first direction. The filter board is electrically coupled to the multiple busbars. Using this arrangement, the stacked busbars can reduce the loop area, thereby suppressing electromagnetic radiation caused by current surges in the power loop, laying the foundation for suppressing common-mode and differential-mode interference. The synergistic effect between the interlayer distributed capacitance of the busbars and the filter board can further enhance the suppression capability for high-frequency differential-mode interference.

Description

Technical Field

[0001] The embodiments disclosed herein generally relate to the field of electrical equipment, and more particularly to a stacked busbar module and electrical equipment. Background Technology

[0002] In modern power electronic systems, the widespread use of high-frequency switching devices in equipment such as power quality management devices, new energy converters, electric vehicle drive systems, and data center power modules has led to increasingly severe electromagnetic interference (EMI) problems. In traditional solutions, EMI filtering circuits are independent of power transmission lines or copper busbars, which not only occupy a large amount of space but also introduce additional parasitic parameters due to complex wiring, reducing system efficiency and stability. Utility Model Content

[0003] In a first aspect of this disclosure, a stacked busbar module is provided. The stacked busbar module includes: a plurality of busbars stacked along a first direction and spaced apart from each other; an insulating member disposed between adjacent busbars of the plurality of busbars; and a filter board disposed on one side of the plurality of busbars along the first direction and electrically coupled to the plurality of busbars.

[0004] In some embodiments, the stacked busbar module further includes: a plurality of equipotential connectors, each electrically coupled between a corresponding busbar and a filter board in the plurality of busbars.

[0005] In some embodiments, each busbar includes a first portion and a second portion spaced apart from each other along a second direction, and the stacked busbar module further includes: a common mode inductor disposed on one side of the plurality of busbars along the first direction, and including a plurality of coils electrically connected between the first portion and the second portion of a respective busbar in the plurality of busbars.

[0006] In some embodiments, a first portion of each busbar includes an incoming terminal bent from the edge, and a second portion of each busbar includes an outgoing terminal bent from the edge.

[0007] In some embodiments, the first portion of each busbar further includes a first terminal, and the second portion of each busbar further includes a second terminal, the first terminal and the second terminal being electrically coupled to a corresponding coil in a common-mode inductor.

[0008] In some embodiments, the plurality of busbars includes a first busbar, a second busbar, a third busbar, and a fourth busbar arranged sequentially along a first direction, and the plurality of equipotential bonding members include a first equipotential bonding member electrically coupled between the first busbar and the filter plate, a second equipotential bonding member electrically coupled between the second busbar and the filter plate, a third equipotential bonding member electrically coupled between the third busbar and the filter plate, and a fourth equipotential bonding member electrically coupled between the fourth busbar and the filter plate. The second busbar, the third busbar, and the fourth busbar include a first through hole through which the first equipotential bonding member passes; the third busbar and the fourth busbar include a second through hole through which the second equipotential bonding member passes; and the fourth busbar includes a third through hole through which the third equipotential bonding member passes.

[0009] In some embodiments, the stacked busbar module further includes a plurality of fasteners coupled to opposite ends of the plurality of busbars.

[0010] In some embodiments, the filter plate is coupled to at least a portion of the fasteners among a plurality of fasteners.

[0011] In some embodiments, the insulating element includes an insulating film, and / or each busbar includes one of copper foil or aluminum foil.

[0012] In a second aspect of this disclosure, an electrical device is provided. The electrical device includes a laminated busbar module according to one aspect of this disclosure.

[0013] In embodiments of this disclosure, the stacked busbar module includes multiple busbars, insulating components, and a filter board. The multiple busbars are stacked along a first direction and spaced apart from each other. Insulating components are disposed between adjacent busbars. The filter board is disposed on one side of the multiple busbars along the first direction. The filter board is electrically coupled to the multiple busbars. Using this arrangement, the stacked busbars can reduce the loop area, thereby suppressing electromagnetic radiation caused by current surges in the power loop, laying the foundation for suppressing common-mode and differential-mode interference. Furthermore, the synergistic effect between the interlayer distributed capacitance of the busbars and the filter board can further enhance the suppression capability for high-frequency differential-mode interference.

[0014] It should be understood that the content described in this section is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0015] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein:

[0016] Figure 1A perspective view of a stacked busbar module according to an embodiment of the present disclosure is shown;

[0017] Figure 2 A cross-sectional view of a stacked busbar module according to an embodiment of the present disclosure is shown;

[0018] Figure 3 A disassembled view of a stacked busbar module according to an embodiment of the present disclosure is shown, in which insulating components are illustrated;

[0019] Figure 4 A disassembled diagram of a stacked busbar module according to an embodiment of the present disclosure is shown, wherein insulating components are not shown; and

[0020] Figure 5 A disassembled view of a stacked busbar module according to an embodiment of the present disclosure is shown, wherein a first terminal block and a second terminal block are shown.

[0021] Explanation of reference numerals in the attached figures:

[0022] X, first direction; Y, second direction;

[0023] 10. Busbar; 11. First Part; 111. Incoming Terminal; 112. First Wiring Terminal; 12. Second Part; 121. Outgoing Terminal; 122. Second Wiring Terminal; 101. First Busbar; 102. Second Busbar; 103. Third Busbar; 104. Fourth Busbar; 105. First Through Hole; 106. Second Through Hole; 107. Third Through Hole;

[0024] 20. Insulating components;

[0025] 30. Equipotential bonding member; 301. First end; 302. Second end; 31. First equipotential bonding member; 32. Second equipotential bonding member; 33. Third equipotential bonding member; 34. Fourth equipotential bonding member;

[0026] 40. Filter board;

[0027] 50. Common-mode inductor; 51. Multiple coils; 52. Magnetic core;

[0028] 60. Fasteners. Detailed Implementation

[0029] Embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0030] The term "comprising" and its variations as used herein signify open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "at least partially based on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc., may refer to different or the same objects.

[0031] In some power electronic systems, in order to solve the electromagnetic interference problem caused by high-frequency switching devices, the filter circuit is independent of the power transmission line or copper busbar. This not only occupies a lot of space, but also introduces additional parasitic parameters due to complex wiring, thereby reducing system efficiency and stability.

[0032] This disclosure provides an embodiment of a stacked busbar module and an electrical device. The stacked busbar module includes multiple busbars, insulating components, and a filter board. The multiple busbars are stacked along a first direction and spaced apart from each other. Insulating components are disposed between adjacent busbars. A filter board is disposed on one side of the multiple busbars along the first direction. The filter board is electrically coupled to the multiple busbars. Using this arrangement, the stacked busbars can reduce the loop area, thereby suppressing electromagnetic radiation caused by current surges in the power loop, laying the foundation for suppressing common-mode and differential-mode interference. Furthermore, the synergistic effect between the interlayer distributed capacitance of the busbars and the filter board can further enhance the suppression capability for high-frequency differential-mode interference. The following will combine... Figures 1 to 5 The principles of this disclosure will be described in detail below.

[0033] like Figures 1 to 3 As shown, the stacked busbar module can be installed in a power electronic system. The stacked busbar module may include multiple busbars 10, insulators 20, and filter boards 40. Each busbar 10 has a flat plate structure, such as a rectangular metal plate with a certain length, width, and thickness. In other embodiments, the busbar 10 can also be made into other shapes of metal plates, such as curved metal plates, to meet spatial layout and electrical connection requirements. As an example, each busbar 10 can be either a copper plate or copper foil. In this way, utilizing the excellent conductivity of copper, resistance loss can be reduced, thereby improving current transmission efficiency.

[0034] As another example, each busbar 10 can also be an aluminum plate or aluminum foil. In this way, the low cost and high conductivity of aluminum plates or foil can be used to transmit current and electrical signals. Aluminum has a low density, is lightweight, and is less expensive, making it suitable for applications where weight and cost are critical.

[0035] like Figures 1 to 3As shown, multiple busbars 10 are stacked along a first direction X, and the multiple busbars 10 are spaced apart from each other. An insulating element 20 is provided between two adjacent busbars 10 to achieve electrical isolation between adjacent busbars 10.

[0036] As an example, the multiple busbars 10 may include a first busbar 101, a second busbar 102, a third busbar 103, and a fourth busbar 104. The first busbar 101, second busbar 102, third busbar 103, and fourth busbar 104 can be electrically coupled to corresponding circuits in a three-phase circuit and to the neutral circuit, respectively. Here, the number of insulators 20 can be three. The first insulator 20 is disposed between the first busbar 101 and the second busbar 102. The second insulator 20 is disposed between the second busbar 102 and the third busbar 103. The third insulator 20 is disposed between the third busbar 103 and the fourth busbar 104. In this way, not only can the electrical performance of the stacked busbar module be satisfied, but the space utilization and assembly convenience of the stacked busbar module can also be improved.

[0037] It should be noted that the figures, values, etc., mentioned above and elsewhere in this disclosure are exemplary and are not intended to limit the scope of this disclosure in any way. Any other suitable figures or values ​​are possible.

[0038] As another example, such as Figure 3 As shown, the insulating element 20 may include multiple pairs of insulating films. Each pair of insulating films is coupled to a corresponding busbar 10 among a plurality of busbars 10, and each pair of insulating films is coupled to a pair of opposite sides of the corresponding busbar 10. In this way, both sides of each busbar 10 can be covered, while facilitating processing and assembly.

[0039] As another example, the insulating element 20 may include multiple insulating sleeves. Each of the multiple insulating sleeves surrounds a corresponding busbar 10 among the multiple busbars 10. There are two layers of insulating material between adjacent busbars 10, thereby achieving electrical isolation between adjacent busbars 10. In this way, in some high-voltage or high-safety-level application environments, the insulating sleeves can provide higher insulation strength and protection level, thereby enhancing the safety of the laminated busbar module.

[0040] like Figures 1 to 3As shown, multiple busbars 10 in the stacked busbar module can form the electrode plates of the capacitor, while the insulating component 20 can form the dielectric, thereby creating an interlayer distributed capacitance between the multiple busbars 10 and the insulating component 20. Combined with mutual inductance characteristics, this effectively reduces the equivalent series inductance and equivalent series resistance of the busbars 10 themselves. Using this arrangement, the multiple busbars 10 and the insulating component 20 of the busbar module can construct a distributed low-inductance path at the physical level, thereby improving high-frequency response performance and reducing energy loss. Simultaneously, the stacked multiple busbars 10 can reduce the loop area, thereby suppressing electromagnetic radiation caused by current surges in the power loop, laying the foundation for suppressing common-mode and differential-mode interference. Since electromagnetic interference is usually closely related to the loop area formed by the current path, reducing this area can significantly reduce the level of radiated interference, thereby improving the electromagnetic compatibility of the system.

[0041] like Figures 1 to 3 As shown, a filter plate 40 is disposed on one side of a plurality of busbars 10 along the first direction X. The filter plate 40 is electrically coupled to the plurality of busbars 10. As an example, the filter plate 40 may include multiple capacitors. In this way, the synergistic effect between the interlayer distributed capacitance of the busbars 10 and the filter plate 40 can further enhance the suppression capability of high-frequency differential-mode interference. As an active filtering element, the filter plate 40, together with the parasitic capacitance formed by the busbars 10 themselves, constitutes a composite filtering network with a wide frequency range, thereby addressing complex electromagnetic interference problems.

[0042] Using this arrangement, the stacked busbar module can form a multi-stage filtering network by combining the low inductance characteristics of busbar 10 with the frequency selectivity of the filtering elements. For differential-mode interference, the low-pass filter formed by the interlayer capacitance and the parasitic parameters of busbar 10 takes priority. This multi-level, multi-mechanism collaborative filtering structure enables the stacked busbar module to exhibit good anti-interference performance in different frequency ranges, thereby improving the stability and reliability of the entire power electronic system.

[0043] In some embodiments, such as Figure 2 and Figure 3 As shown, the stacked busbar module also includes multiple equipotential bonding elements 30. Each of the multiple equipotential bonding elements 30 is electrically coupled between a corresponding busbar 10 and the filter board 40. The equipotential bonding elements 30 can establish a stable potential relationship between the filter board 40 and each busbar 10. In this way, by utilizing the potential equalization property of the equipotential bonding elements 30, differential mode interference between the filter board 40 and the multiple busbars 10 can be reduced.

[0044] In some embodiments, such as Figure 4As shown, each busbar 10 includes a first portion 11 and a second portion 12 spaced apart from each other along a second direction Y. The second direction Y forms an angle with the first direction X. For example, the second direction Y is perpendicular to the first direction X. The multilayer busbar module also includes a common-mode inductor 50. This common-mode inductor 50 is disposed on one side of the plurality of busbars 10 along the first direction X. The common-mode inductor 50 includes a plurality of coils 51. The plurality of coils 51 are electrically connected between the first portion 11 and the second portion 12 of the respective busbar 10. In this way, when faced with common-mode interference, the common-mode inductor can work in conjunction with the ground plane to guide the interference current to the ground, avoiding the impact of interference on the system. The interlayer distributed capacitance, the filter plate 40, and the common-mode inductor 50 enable the multilayer busbar module to maintain excellent electromagnetic interference suppression performance over a wide frequency range. Integrating the inductor components with the busbars 10 not only reduces the number of connecting wires required for traditional wiring and lowers the line impedance, but also utilizes the excellent heat dissipation characteristics of the busbars 10 to improve the reliability and stability of the inductor operation.

[0045] In some embodiments, such as Figures 1 to 4 As shown, the first portion 11 of each busbar 10 includes an input terminal 111 bent from the edge. The second portion 12 of each busbar 10 includes an output terminal 121 bent from the edge. Each busbar 10 can be connected to an external input line via the input terminal 111, and each busbar 10 can also be connected to an output line via its output terminal 121. This arrangement simplifies the connection between the busbar 10 and the external circuit and reduces the need for additional wiring accessories.

[0046] In some embodiments, such as Figures 1 to 4 As shown, the input terminal 111 and the output terminal 121 may include connection holes for connecting to external lines. In this way, the input terminal 111 can be connected to an external input line via a threaded connection, and the output terminal 121 can be connected to an output line via a threaded connection, thereby improving assembly efficiency.

[0047] In some embodiments, such as Figures 2 to 5 As shown, the first portion 11 of each busbar 10 also includes a first terminal 112, and the second portion 12 of each busbar 10 also includes a second terminal 122. The first terminal 112 and the second terminal 122 are electrically coupled to corresponding coils in the common-mode inductor 50, respectively. Each coil includes two pins, one of which can be soldered to the first terminal 112, and the other pin can be soldered to the second terminal 122. This method not only reduces the complex wiring and connection steps required in traditional wiring methods but also ensures the reliability and stability of the electrical connection, reducing contact resistance and potential points of failure.

[0048] In some embodiments, such as Figure 2 and Figure 5 As shown, the multiple busbars 10 include a first busbar 101, a second busbar 102, a third busbar 103, and a fourth busbar 104 arranged sequentially along a first direction X. To achieve equipotential bonding, the stacked busbar module also includes multiple equipotential bonding elements 30. The multiple equipotential bonding elements 30 include a first equipotential bonding element 31, a second equipotential bonding element 32, a third equipotential bonding element 33, and a fourth equipotential bonding element 34. The first equipotential bonding element 31 is electrically coupled between the first busbar 101 and the filter board 40. The second equipotential bonding element 32 is electrically coupled between the second busbar 102 and the filter board 40. The third equipotential bonding element 33 is electrically coupled between the third busbar 103 and the filter board 40. The fourth equipotential bonding element 34 is electrically coupled between the fourth busbar 104 and the filter board 40.

[0049] To facilitate the arrangement of these equipotential bonding members 30, the second busbar 102, the third busbar 103, and the fourth busbar 104 are provided with first through holes 105 for the first equipotential bonding member 31 to pass through. The third busbar 103 and the fourth busbar 104 are provided with second through holes 106 for the second equipotential bonding member 32 to pass through. The fourth busbar 104 is provided with a third through hole 107 for the third equipotential bonding member 33 to pass through. The first equipotential bonding member 31 is electrically connected to the filter plate 40 after passing through the first through hole 105 on the second busbar 102, the third busbar 103, and the fourth busbar 104. The second equipotential bonding member 32 is electrically connected to the filter plate 40 after passing through the second through hole 106 on the third busbar 103 and the fourth busbar 104. The third equipotential bonding member 33 is electrically connected to the filter plate 40 after passing through the third through hole 107 on the fourth busbar 104. The fourth equipotential bonding member 34 is directly electrically connected between the fourth busbar 104 and the filter plate 40.

[0050] In this way, multiple equipotential bonding elements 30 can be arranged inside multiple busbars 10, thereby reducing the need for external wiring, reducing wiring complexity, and effectively reducing the occurrence of differential mode interference by reducing unnecessary wire length and number.

[0051] In some embodiments, such as Figure 1 and Figure 2 As shown, the stacked busbar module also includes multiple fasteners 60. The multiple fasteners 60 are coupled to the opposite ends of the multiple busbars 10. In this way, the multiple fasteners 60 can maintain the multiple busbars 10 in a stable positional relationship, preventing loosening or displacement between the busbars 10, thereby ensuring the stability and reliability of the electrical connection.

[0052] In some embodiments, such as Figure 1 and Figure 2As shown, the filter plate 40 is coupled to at least a portion of the multiple fasteners 60. For example, the filter plate 40 can be secured to the fasteners 60 by bolts or other types of connectors. This not only improves the positional stability of the filter plate 40 but also enhances the robustness of the stacked busbar module. Securely fixing the filter plate 40 to the fasteners 60 reduces positional displacement due to vibration or other external forces, ensuring the quality of the electrical connection between the filter plate 40 and the busbar 10.

[0053] This disclosure also provides an electrical device. The electrical device includes a stacked busbar module as described above. The stacked busbar module of the electrical device includes a plurality of busbars 10, an insulating element 20, and a filter plate 40. The plurality of busbars 10 are stacked along a first direction X and spaced apart from each other. The insulating element 20 is disposed between adjacent busbars 10. The filter plate 40 is disposed on one side of the plurality of busbars 10 along the first direction X. The filter plate 40 is electrically coupled to the plurality of busbars 10. Using this arrangement, the stacked plurality of busbars 10 can reduce the loop area, thereby suppressing electromagnetic radiation caused by current surges in the power loop, laying the foundation for the suppression of common-mode and differential-mode interference. Furthermore, the synergistic effect between the interlayer distributed capacitance of the busbars 10 and the filter plate 40 can further enhance the suppression capability for high-frequency differential-mode interference.

[0054] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, and are not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technical improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A laminated busbar module, characterized in that, include: Multiple busbars (10) are stacked along a first direction (X), and the multiple busbars (10) are spaced apart from each other; An insulating element (20) is disposed between adjacent busbars (10) in the plurality of busbars (10); as well as A filter board (40) is disposed on one side of the plurality of busbars (10) along the first direction (X) and electrically coupled to the plurality of busbars (10).

2. The laminated busbar module according to claim 1, characterized in that Also includes: Multiple equipotential bonding elements (30) are electrically coupled between a corresponding busbar (10) in the multiple busbars (10) and the filter plate (40).

3. The laminated busbar module of claim 1, wherein, Each busbar (10) includes a first portion (11) and a second portion (12) spaced apart from each other along a second direction (Y), and the stacked busbar module further includes: A common-mode inductor (50) is disposed on one side of the plurality of busbars (10) along the first direction (X) and includes a plurality of coils (51) which are electrically connected between the first portion (11) and the second portion (12) of a respective busbar (10) in the plurality of busbars (10).

4. The laminated busbar module of claim 3, wherein, The first portion (11) of each busbar (10) includes an incoming terminal (111) bent from the edge, and the second portion (12) of each busbar (10) includes an outgoing terminal (121) bent from the edge.

5. The laminated busbar module of claim 4, wherein, The first portion (11) of each busbar (10) further includes a first terminal (112), and the second portion (12) of each busbar (10) further includes a second terminal (122), the first terminal (112) and the second terminal (122) being electrically coupled to a corresponding coil in the common mode inductor (50).

6. The laminated busbar module of claim 2, wherein, The plurality of busbars (10) includes a first busbar (101), a second busbar (102), a third busbar (103), and a fourth busbar (104) arranged sequentially along the first direction (X), and the plurality of equipotential bonding members (30) includes a first equipotential bonding member (31) electrically coupled between the first busbar (101) and the filter plate (40), a second equipotential bonding member (32) electrically coupled between the second busbar (102) and the filter plate (40), a third equipotential bonding member (33) electrically coupled between the third busbar (103) and the filter plate (40), and a fourth equipotential bonding member (34) electrically coupled between the fourth busbar (104) and the filter plate (40). The second busbar (102), the third busbar (103) and the fourth busbar (104) include a first through hole (105) through which the first equipotential connector (31) passes; The third busbar (103) and the fourth busbar (104) include a second through hole (106) through which the second equipotential connector (32) passes; The fourth busbar (104) includes a third through hole (107) through which the third equipotential connector (33) passes.

7. The laminated busbar module according to any one of claims 1 to 6, characterized in that Also includes: Multiple fasteners (60) are coupled to opposite ends of the multiple busbars (10).

8. The laminated busbar module of claim 7, wherein, The filter plate (40) is coupled to at least some of the plurality of fasteners (60).

9. The laminated busbar module according to any one of claims 1 to 6, characterized in that The insulating member (20) includes an insulating film, and / or each busbar (10) includes one of a copper foil or an aluminum foil.

10. An electrical device, characterized by Comprising: The laminated busbar module according to any one of claims 1 to 9.

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