双端子片式电阻
By soldering terminals onto the electrode layer of the resistor chip and extending them from the package, the problem of vertical mounting of chip resistors is solved, achieving vertical mounting while avoiding interference between devices and preserving the chip characteristics of chip resistors.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GANZHOU SANDAS ELECTRONICS CO LTD
- Filing Date
- 2025-03-18
- Publication Date
- 2026-07-17
AI Technical Summary
Existing surface mount resistors are difficult to install vertically, and high-power surface mount resistors are prone to mutual interference when mounted on printed circuit boards.
A two-terminal chip resistor is designed to achieve vertical mounting by soldering terminals onto the electrode layer of the resistor chip and extending the terminals from one side of the package, while retaining the chip characteristics of the chip resistor.
This allows for vertical mounting of surface mount resistors, avoiding mutual interference between components and maintaining the chip characteristics of surface mount resistors.
Smart Images
Figure CN224519601U_ABST
Abstract
Claims
1. A two-terminal chip resistor, characterized by, It includes a resistor sheet, a set of terminals connected to the electrode layer of the resistor sheet, an encapsulation shell disposed on the resistor sheet, and the terminals extending to one side of the encapsulation shell; The resistor sheet includes a ceramic substrate, and an electrode layer, a resistance wire layer and a protective glass film layer are sequentially disposed on one surface of the ceramic substrate. Two electrode layers are respectively disposed at both ends of the length of the ceramic substrate, and a resistance wire layer is disposed between the two electrode layers and communicates with the electrode layers; a protective glass film layer covers the resistance wire layer. One end of the terminal is provided with a punching and bending connection part, and the other end is an outward extension part. The punching and bending connection part is connected to the electrode layer disposed on the ceramic substrate through a welding part. The welding part is a tin-immersed structure part or a solder structure part. The encapsulation shell covers the resistive sheet and the punched and bent connection portion of the terminal, and the outer extension portion of the terminal extends out of the encapsulation shell along one side of the length direction; The punching and bending connection portion forms several bending pieces on both sides along the thickness direction of the resistor sheet. The resistor sheet is disposed in the slot between the bending pieces, and one side of the bending piece is welded to the electrode layer.