A small-size, high-precision current sensing resistor structure

Abstract

This utility model discloses a small-size, high-precision current-sensing resistor structure, including a substrate material and a glue-feeding mechanism disposed on the substrate material. The substrate material has six rows of resistance value patterns evenly distributed, each resistance value pattern consisting of multiple adjustable resistor units connected in series. Multiple resistor bodies are arranged in parallel on the six rows of resistance value patterns, and each resistor body has a central connecting rib structure and a rib-free structure. This utility model discloses a small-size, high-precision current-sensing resistor structure that, by adopting a six-row adjustable resistance value pattern design, optimizing the central connecting rib structure, and improving the glue-feeding method for insulator encapsulation, improves material utilization and production efficiency, resulting in better product appearance quality.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to a small-size, high-precision current sensing resistor structure. Background Technology

[0002] In electronic circuits, current sensing resistors are used to accurately measure current, and their performance directly affects the accuracy and stability of current measurement. As electronic devices develop towards miniaturization and high precision, the requirements for the specifications and accuracy of current sensing resistors are also becoming increasingly stringent.

[0003] However, when using traditional small-size, high-precision current sensing resistor structures, the current sensing resistors are mostly single-row or four-row chip structures, resulting in low product manufacturing efficiency and material utilization. For example, the resistance adjustment is not flexible enough, making it difficult to meet the precise current measurement requirements of different application scenarios. The packaging process is not optimized enough, leading to low production efficiency and affecting the performance stability of the resistor. Utility Model Content

[0004] This utility model discloses a small-size, high-precision current sensing resistor structure, which aims to solve the technical problem that traditional small-size, high-precision current sensing resistor structures are mostly single-row or four-row sheet structures, resulting in low product manufacturing efficiency and material utilization.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A small-size, high-precision current sensing resistor structure, comprising a substrate material, and further comprising:

[0007] Adhesive feeding mechanism: The adhesive feeding mechanism is disposed on the substrate material;

[0008] The substrate sheet has six rows of resistance patterns evenly distributed. Each resistance pattern is composed of multiple adjustable resistor units connected in series. Multiple resistor bodies are arranged in parallel on the six rows of resistance patterns. Each resistor body has a central connecting rib structure and a rib-free structure.

[0009] In this solution, a six-row adjustable resistance pattern design is adopted. The adjustable resistance pattern enables flexible resistance adjustment. The two additional rows of products not only ensure that the product resistance can be adjusted, but also reduce waste of scrap materials and improve material utilization. A single piece of material can complete multi-row processing, shorten the production cycle, improve the setting of intermediate connecting ribs, remove unnecessary connecting materials, and the lightweight design balances mechanical strength and material saving, reducing packaging stress.

[0010] In a preferred embodiment, the glue dispensing mechanism includes six glue inlets located at the edge of the sheet substrate, the glue inlets being used in conjunction with the resistance pattern.

[0011] By adopting the above technical solution, multiple distributed injection ports are designed on the edge of the material sheet to avoid the resistive pattern area, prevent gate marks from remaining, reduce burrs, solve gate appearance defects, and improve product qualification rate.

[0012] As can be seen from the above, a small-size, high-precision current sensing resistor structure includes a substrate material and also includes:

[0013] Adhesive feeding mechanism: The adhesive feeding mechanism is disposed on the substrate material;

[0014] The substrate material has six rows of resistance patterns evenly distributed, each pattern consisting of multiple adjustable resistor units connected in series. Multiple parallel resistor bodies are arranged on the six rows of resistance patterns, each with a central connecting rib structure and a rib-free structure. This invention provides a small-size, high-precision current-sensing resistor structure that, through the use of a six-row adjustable resistance pattern design, optimizes the central connecting rib structure and improves the insulator encapsulation method, thereby increasing material utilization and production efficiency, and resulting in a better product appearance quality. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a small-size, high-precision current sensing resistor structure proposed in this utility model.

[0016] Figure 2 This is a schematic diagram of the resistor body structure of a small-size, high-precision current sensing resistor structure proposed in this utility model.

[0017] Figure 3 This is an enlarged structural diagram at point A of the small-size, high-precision current sensing resistor structure proposed in this utility model.

[0018] In the attached diagram: 1. Substrate material; 2. Resistance value diagram; 3. Resistor body; 4. Glue inlet; 5. Insulating groove; 6. Connecting ribs; 7. Rib removal. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] The small-size, high-precision current sensing resistor structure disclosed in this utility model is mainly used in scenarios where traditional small-size, high-precision current sensing resistor structures are mostly single-row or four-row sheet structures, resulting in low product manufacturing efficiency and material utilization.

[0021] Reference Figure 1 , Figure 2 and Figure 3 A small-size, high-precision current sensing resistor structure, comprising a substrate 1, and further comprising:

[0022] Glue feeding mechanism: The glue feeding mechanism is located on the substrate 1;

[0023] The substrate 1 has six rows of resistance patterns 2 evenly distributed on it. The resistance patterns 2 are composed of multiple adjustable resistor units connected in series. The six rows of resistance patterns 2 have multiple resistor bodies 3 arranged in parallel. The resistor bodies 3 have a middle connecting rib 6 structure and a rib-free structure 7 respectively.

[0024] In the specific working process, six rows of parallel resistance patterns 2 are integrated on a single wafer. The adjustable resistance patterns 2 enable flexible resistance adjustment. The two additional rows of products not only ensure that the product resistance can be adjusted, but also reduce waste of scrap materials and improve material utilization. Material utilization is increased by 30%. A single wafer can complete multi-row processing, shortening the production cycle. In the same production cycle, efficiency is increased by 20%. The six rows of adjustable resistance patterns 2 break through the traditional single-row / four-row limitations, improve the setting of the middle connecting ribs 6, remove unnecessary connecting materials 7, and optimize the packaging process.

[0025] Among them, the connecting rib 6 and the de-rib 7 are connected to the resistance pattern 2 through a rounded corner transition. The rounded corner transition design between the connecting rib 6 and the resistance pattern 2 improves mechanical strength. The de-rib 7 process in the middle of the resistor body 3 will form a hollow area. This hollow area runs through the thickness direction of the resistor substrate. The edge of the hollow area adopts a rounded corner transition design to avoid stress concentration and optimize the packaging process and heat dissipation effect to the greatest extent.

[0026] Among them, the resistor body 3 with connecting ribs 6 and the resistor body 3 with deribs 7 are distributed alternately. The connecting ribs 6 in the traditional structure refer to the connecting bridge structure between the chip array. The original solid connecting bridge is changed to an intermittent support structure, and the middle part is treated with deribs 7, so that the connecting ribs 6 and deribs 7 are distributed alternately. This optimizes the packaging process, reduces the use of packaging materials and process steps, and improves heat dissipation performance.

[0027] Reference Figure 2 and Figure 3 In a preferred embodiment, an insulating groove 5 is provided between each of the six rows of resistance value patterns 2, and the insulating groove 5 is located on the resistor body 3 with the ribs removed 7.

[0028] Specifically, an insulating groove 5 is set between each row of resistance value patterns 2. After the ribs 7 are removed from the resistor body 3, the insulating groove 5 will be formed, forming a high barrier layer to prevent short circuits between adjacent resistors.

[0029] Among them, the insulating groove 5 is filled with silicon dioxide. The insulating groove 5 formed by the silicon dioxide filling and the rib removal 7, after the ribs 6 are removed, the silicon dioxide forms an invisible support column to maintain the overall rigidity of the array structure.

[0030] Reference Figure 2 and Figure 3 In a preferred embodiment, the glue injection mechanism includes six glue inlets 4 located at the edge of the substrate 1, and the glue inlets 4 are used in conjunction with the resistance pattern 2.

[0031] Specifically, multiple distributed injection ports 4 are designed at the edge of the sheet to avoid the resistive pattern area, prevent gate marks from remaining, reduce burrs, solve gate appearance defects, and improve product appearance quality.

[0032] Among them, the glue inlet 4 adopts an insulating encapsulation glue inlet method. The new glue inlet method improves the appearance of the product by using an insulating encapsulation for the glue inlet 4. After the glue inlet is optimized, there are no visible defects in the gate.

[0033] Working principle: When in use, it adopts a six-row adjustable resistance graphic design 2, which significantly improves material utilization compared to the traditional four-row design; the structure of the middle connecting rib 6 is optimized, and the ribs of the resistor body 3 are partially removed 7 to reduce the impact on the insulator encapsulation and optimize the encapsulation process; the glue injection method is improved, and the insulator encapsulation glue is injected at the glue injection port 4 to improve the product appearance quality; the resistance value is precisely controlled by adjusting the graphic arrangement.

[0034] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. A small-size, high-precision current-sensing resistor structure comprising a web substrate (1), characterized in that, Also includes: Adhesive feeding mechanism: The adhesive feeding mechanism is provided on the substrate (1); The substrate material (1) has six rows of resistance patterns (2) evenly distributed. The resistance patterns (2) are composed of multiple adjustable resistor units connected in series. The six rows of resistance patterns (2) have multiple resistor bodies (3) arranged in parallel. The resistor bodies (3) are respectively provided with a middle connecting rib (6) structure and a rib-removed (7) structure.

2. The small-size high-precision current sensing resistor structure according to claim 1, wherein, Both the connecting rib (6) and the de-rib (7) are connected to the resistance pattern (2) through a rounded corner transition.

3. The small-size high-precision current sensing resistor structure according to claim 2, wherein, The resistor body (3) with the connecting rib (6) and the resistor body (3) with the derib (7) are interleaved.

4. The small size high precision current sense resistor structure of claim 1, wherein, Insulating grooves (5) are provided between the six rows of resistance value patterns (2), and the insulating grooves (5) are located on the resistor body (3) of the de-ribbed (7).

5. The small size high precision current sense resistor structure of claim 4, wherein, The insulating groove (5) is filled with silicon dioxide.

6. The small size high precision current sense resistor structure of claim 1, wherein, The glue feeding mechanism includes six glue inlets (4) located at the edge of the substrate (1), and the glue inlets (4) are used in conjunction with the resistance pattern (2).

7. The small-size high-precision current sensing resistor structure according to claim 6, wherein, The glue inlet (4) adopts an insulator-encapsulated glue inlet method.

Images