电感器件的组装结构

Abstract

本实用新型提供了一种电感器件的组装结构，包括壳体、电感组件和上层PCB板。电感组件包括电感PCB板、电感本体以及多个导接件。电感本体和多个导接件分别设置于电感PCB板的底面和顶面，电感PCB板固定壳体，电感本体容置于壳体。灌封胶灌封于容置空间内，且包覆电感本体。上层PCB板包括多个连接部通过多个导接件电连接至电感PCB板。多个连接部的每一个包括锁固件、固定孔和开槽，开槽环绕固定孔的部分外缘边设置，锁固件通过固定孔与相对应的导接件啮合时，连接部允许上下摆动公差高度。

Claims

1. An assembly structure for an inductor device, characterized in that, include: A housing includes a receiving space and an outer peripheral wall, wherein the outer peripheral wall forms an upward opening around the receiving space, and the receiving space communicates outward through the opening; At least one inductor assembly includes an inductor PCB board, an inductor body, and a plurality of conductive members, wherein the inductor body is disposed on the bottom surface of the inductor PCB board, the plurality of conductive members are disposed on the top surface of the inductor PCB board, the bottom surface of the inductor PCB board faces the opening and is fixed to the top of the outer peripheral wall, and the inductor body is accommodated in the accommodating space. A potting compound is poured into the receiving space and covers the inductor body; and An upper PCB board includes multiple connecting parts that are electrically connected to the inductor PCB board via multiple conductive members. Each of the multiple connecting parts includes a locking fastener, a fixing hole, and a slot. The slot is provided around a portion of the outer edge of the fixing hole. When the locking fastener engages with one of the corresponding multiple conductive members through the fixing hole, the multiple connecting parts are allowed to swing up and down by a tolerance height.

2. The assembled structure of inductive devices according to claim 1, wherein, The locking device is a fixing screw, and the tolerance height range is less than the thickness of the upper PCB board.

3. The assembled structure of inductive devices according to claim 1, wherein, The multiple connecting parts are in the shape of a rounded rectangle, and the slot is set along the rounded edge of the rounded rectangle and penetrates the upper PCB board.

4. The assembled structure of inductive devices according to claim 1, wherein, The multiple connecting parts are square or rectangular, and the slot is set along the three interconnected sides, penetrating the upper PCB board.

5. The assembled structure of inductive devices according to claim 4, wherein, The slots of any two adjacent connecting parts share a common side and penetrate the upper PCB board.

6. The assembled structure of inductive devices according to claim 1, wherein, The vertical projection of the plurality of conductive parts on the upper PCB board falls entirely within the vertical projection of the plurality of connecting parts on the upper PCB board.

7. The assembled structure of inductive devices of claim 1, wherein, The planar area of ​​the plurality of connecting parts is greater than the planar area of ​​the plurality of conductive parts.

8. The assembled structure of inductive devices of claim 1, wherein, The multiple conductive components are a current-conducting copper pillar, and the upper PCB board is a power PCB board.

9. The assembled structure of inductive devices according to claim 8, wherein, The guide copper pillar is cylindrical and has a top fixing hole, through which the locking fastener engages with the top fixing hole.

10. The assembled structure of inductive devices of claim 1, wherein, The inductor body and the plurality of conductive components are fixed to the inductor PCB board by soldering.

11. The assembled structure of inductive devices of claim 1, wherein, The inductor body is thermally coupled to the outer peripheral wall and the bottom of the housing.

12. The assembled structure of inductive devices of claim 1, wherein, The housing also includes a concave corner, which connects the outer peripheral wall and the bottom of the housing, and is arranged close to the at least one inductor when the at least one inductor is housed in the accommodating space to form a bottom heat dissipation channel.

13. The assembled structure of inductive devices of claim 1, wherein, The housing is an aluminum extrusion housing, including multiple heat dissipation fins that protrude from the outer surface of the housing and extend along a first direction.

14. The assembled structure of inductive devices according to claim 13, wherein, The at least one inductor component has an elongated structure and extends along the first direction, and the plurality of conductors are arranged along the first direction.

15. The assembly structure of an inductive device according to claim 13, wherein The housing also includes a partition extending along the first direction and dividing the accommodating space into two cavities. The at least one inductor component includes two sets of inductor components arranged along a second direction and respectively housed in the two cavities. The second direction is perpendicular to the first direction. The partition is thermally coupled to the two sets of inductor components to form an intermediate heat dissipation channel.

16. The assembled structure of inductive devices of claim 1, wherein, The housing also includes a positioning post disposed on the top mounting surface of the outer peripheral wall, and the inductor PCB board also includes a positioning hole, which is spatially relative to the positioning post. The positioning post and the positioning hole cooperate to position the inductor PCB board to the top of the outer peripheral wall.

17. The assembled structure of inductive devices of claim 1, wherein, The housing also includes a first screw hole, and the inductor PCB board includes a second fixing hole, which is spatially opposite to the first screw hole. A screw passes through the second fixing hole and engages with the first screw hole, so that the inductor PCB board is fixed to the top mounting surface of the outer peripheral wall.

18. The assembled structure of inductive devices of claim 1, wherein, The potting compound is injected into the accommodating space in liquid form through the opening, filling the gap between the inductor body and the housing. It is then baked and cured at high temperature, so that the inductor body is thermally coupled to the housing.

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