散热模组和功率电感组件
The heat dissipation module design, which combines bottom and side heat dissipation modules, solves the heat dissipation and electromagnetic interference problems of power inductors, achieving efficient heat dissipation and electromagnetic compatibility, and expanding the scope of application.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAN SINGULARITY ENERGY TECH CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-07-17
AI Technical Summary
Existing power inductors suffer from heat dissipation and electromagnetic interference issues, which hinder miniaturization and cost control. In particular, their low heat dissipation efficiency in high-temperature environments affects operational stability and electromagnetic compatibility.
It adopts a dual heat dissipation module design, including heat dissipation modules with bottom and side heat dissipation modules, combined with a detachable and connectable shielding plate, and uses air cooling or liquid cooling structure for heat dissipation, and reduces electromagnetic interference through the shielding plate.
It improves the heat dissipation efficiency of power inductors, reduces temperature rise, extends service life, enhances electromagnetic compatibility, and reduces the system's sensitivity to electromagnetic interference.
Smart Images
Figure CN224519634U_ABST
Abstract
Claims
1. A heat dissipation module for use with a power inductor, characterized in that, The heat dissipation module includes: The first heat dissipation module is configured to be connected to the bottom wall of the power inductor; The second heat dissipation module includes a heat dissipation body and a shielding plate. The heat dissipation body is configured to be connected to the side wall of the power inductor. The shielding plate is detachably connected to the heat dissipation body. The shielding plate and the power inductor are located on both sides of the heat dissipation body.
2. The heat dissipation module according to claim 1, characterized in that, The heat dissipation body includes a first substrate and a fan installed on the first substrate. The first substrate is connected to the power inductor and the shielding plate. The first substrate has a first flow channel, and the fan is configured to guide airflow through the first flow channel.
3. The heat dissipation module according to claim 2, characterized in that, The first flow channel is provided with a plurality of first heat dissipation fins spaced apart; and / or, The first substrate is provided with a first connecting part, and the shielding plate is detachably connected to the first substrate through the first connecting part. The shielding plate is U-shaped and covers at least the side of the first substrate away from the power inductor.
4. The heat dissipation module according to claim 2, characterized in that, The first substrate is further provided with a second connecting portion, and the power inductor is detachably connected to the first substrate through the second connecting portion; and / or, The first base is further provided with a third connecting part, and the mating part is configured to be detachably connected to the first base through the third connecting part. The mating part includes at least one of the first heat dissipation module and the fixing structure.
5. The heat dissipation module according to claim 1, characterized in that, The heat dissipation body includes a second substrate and a liquid chiller. The second substrate is connected to the power inductor and the shielding plate. The second substrate has a second flow channel. The liquid chiller is located outside the second substrate and communicates with the second flow channel.
6. The heat dissipation module according to claim 5, characterized in that, The second flow channel is provided with a plurality of second heat dissipation fins spaced apart; and / or, The second substrate is provided with a fourth connecting part, and the shielding plate is detachably connected to the second substrate through the fourth connecting part. The shielding plate is U-shaped and covers at least the side of the second substrate away from the power inductor.
7. The heat dissipation module according to claim 5, characterized in that, The second substrate is further provided with a fifth connecting portion, through which the power inductor is detachably connected to the second substrate; and / or, The second substrate has an inlet and an outlet that communicate with the second flow channel. The inlet is provided with an inlet connector and the outlet is provided with an outlet connector.
8. The heat dissipation module according to claim 5, characterized in that, At least two of the second substrates are connected in series or in parallel between the inlet and outlet of the liquid chiller; The second substrate corresponds to the power inductor, or a portion of the second substrate is located between two adjacent power inductors.
9. The heat dissipation module according to any one of claims 1 to 8, characterized in that, Also includes: The power inductor includes an external heat dissipation housing, the heat dissipation component is in contact with the bottom wall of the first heat dissipation module and the heat dissipation housing, and / or the heat dissipation component is in contact with the side wall of the heat dissipation body and the heat dissipation housing.
10. A power inductance assembly, characterized by include: A power inductor, and a heat dissipation module as described in any one of claims 1 to 9.