小型化薄膜电容器
By designing a detachable pin structure and a water-cooling system, the problems of poor heat dissipation and the need for complete replacement of broken pins in film capacitors were solved, achieving efficient heat dissipation and reducing material waste.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN CITY XINYUAN ELECTRONICS CO LTD
- Filing Date
- 2024-12-25
- Publication Date
- 2026-07-17
AI Technical Summary
Existing film capacitors have poor heat dissipation, and broken leads require replacement of the entire capacitor, resulting in material waste and increased costs.
The design features a two-section pin structure, which dissipates heat through a thermally conductive metal block and a water-cooling system. It also employs a detachable connection method to enable timely heat dissipation and cooling.
It improves heat dissipation efficiency, reduces material waste and cost, enables pin removability, and lowers replacement costs.
Smart Images
Figure CN224519698U_ABST
Abstract
Claims
1. A miniaturized thin-film capacitor comprising a thin-film capacitor body (1) and a heat dissipation box (2), the heat dissipation box (2) being provided with a first through hole (3) at the bottom, and the thin-film capacitor body (1) being fixedly provided with two first pins (4) at the bottom, characterized in that: The heat sink (2) is fixed with a heat dissipation component for cooling the film capacitor body (1), and the first pin (4) is detachably mounted with a second pin (5) through a connecting component.
2. The miniaturized film capacitor of claim 1, wherein: The heat dissipation component is a second through hole (6), which is symmetrically opened on the four side surfaces of the inner wall of the heat dissipation box (2). Each of the two through holes (6) is fixed with a rubber sealing strip (7).
3. The miniaturized film capacitor of claim 2, wherein: The film capacitor body (1) has four sides with a heat-conducting metal block (8). The heat-conducting metal block (8) has a "convex" cross-section. The four protruding ends of the heat-conducting metal blocks (8) are respectively inserted into the four second through holes (6). The surface of the heat-conducting metal block (8) abuts against the surface of the rubber sealing strip (7). The rubber sealing strip (7) is in a compressed state.
4. The miniaturized film capacitor of claim 3, wherein: The heat dissipation box (2) has a water cooling cavity (9) inside, and the four second through holes (6) are all connected to the water cooling cavity (9).
5. The miniaturized film capacitor of claim 4, wherein: A cold water inlet pipe (10) is fixed at the bottom of the side end of the heat sink (2). The cold water inlet pipe (10) is connected to the water cooling cavity (9). A first cold water hose (11) is fixedly connected to the end of the cold water inlet pipe (10). A cold water outlet pipe (12) is fixed at the top of the side end of the heat sink (2). The cold water outlet pipe (12) is connected to the water cooling cavity (9). A second cold water hose (13) is fixedly connected to the end of the cold water outlet pipe (12).
6. The miniaturized film capacitor of claim 1, wherein: The connecting component is a threaded groove (14), which is formed at the bottom of the first pin (4), and the top of the second pin (5) is threaded to the inner surface of the threaded groove (14).
7. The miniaturized film capacitor of claim 1, wherein: The connecting component is a strip-shaped connecting hole (15), which is vertically opened at the bottom of the first pin (4).
8. The miniaturized film capacitor of claim 7, wherein: The top of the second pin (5) is provided with a fixing bolt (16), the end of the fixing bolt (16) passes through the strip-shaped connecting hole (15), and the end of the fixing bolt (16) is threaded with a matching nut (17).