卷绕型电容器结构
By improving the structural design of the capacitor, especially the fit between the conductive leads and the water vapor barrier material layer, and the roughened inner surface of the capacitor casing, the problems of water vapor intrusion and structural strength of the wound capacitor have been solved, achieving better protection and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- APAQ TECH
- Filing Date
- 2025-06-10
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wound capacitors have shortcomings in terms of water and gas intrusion resistance and structural strength.
The design employs a capacitor winding assembly, encapsulation assembly, pin assembly, and carrier base. By combining the conductive pins with the surrounding water vapor barrier material layer and the roughened inner surface of the capacitor casing structure, the ability to prevent water vapor intrusion is enhanced, and the structural strength is improved.
It enhances the water and gas intrusion resistance of wound capacitors, improves the fit between the capacitor shell structure and the encapsulating colloid, and enhances the overall protective performance and stability of the structure.
Smart Images
Figure CN224519700U_ABST
Abstract
Claims
1. A wound capacitor structure, characterized by, The wound capacitor structure includes: A capacitor winding assembly, the capacitor winding assembly including a positive electrode winding conductive sheet and a negative electrode winding conductive sheet; A capacitor encapsulation assembly configured to encapsulate a capacitor winding assembly, the capacitor encapsulation assembly including a capacitor housing structure and a capacitor encapsulation colloid, the capacitor encapsulation colloid being accommodated within the capacitor housing structure and encapsulating the capacitor winding assembly. A capacitor lead assembly, the capacitor lead assembly including a first conductive lead electrically contacting the positive electrode wound conductive sheet and a second conductive lead electrically contacting the negative electrode wound conductive sheet; and A capacitor carrier base, the capacitor carrier base being configured to support the capacitor housing structure; The capacitor carrier base has a carrier portion configured to contact the capacitor encapsulation colloid. The carrier portion has two pin through holes and two surrounding water vapor barrier material layers, which are respectively disposed on the inner walls of the two pin through holes. The first conductive pin and the second conductive pin respectively pass through the two pin through holes of the base support portion and respectively cooperate with the two surrounding water vapor barrier material layers. The capacitor housing structure has a roughened inner surface that contacts the capacitor encapsulation colloid.
2. The wound capacitor structure of claim 1, wherein The capacitor housing structure has an encapsulation housing portion for accommodating the capacitor encapsulation colloid and a colloid abutment portion that bends inward from the encapsulation housing portion and contacts the capacitor encapsulation colloid, wherein the thickness of the encapsulation housing portion is equal to the thickness of the colloid abutment portion.
3. The wound capacitor structure of claim 1, wherein The capacitor carrier base has a base extension extending from the outer periphery of the base carrier portion, and the base extension is separate from the capacitor housing structure.
4. The wound capacitor structure of claim 1, wherein The capacitor carrier base has an adhesive layer disposed on the carrier portion of the base, and the adhesive layer is connected to the capacitor encapsulation colloid and is separate from the capacitor winding assembly.
5. The wound capacitor structure of claim 1, wherein The capacitor carrier base has an adhesive layer disposed on the carrier portion of the base, and the adhesive layer is connected to the capacitor encapsulation colloid and the capacitor winding assembly.