密封结构、上电极组件和半导体预清洗设备
By using an assembly chamber formed by a tray and cover in a semiconductor pre-cleaning device, combined with resilient seals, the wear problem caused by hard contact between ceramic parts and metal electrodes is solved, resulting in better sealing and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SICARRIER IND MACHINES CO LTD
- Filing Date
- 2025-05-14
- Publication Date
- 2026-07-17
AI Technical Summary
In existing semiconductor pre-cleaning equipment, the sealing performance of the upper electrode assembly is affected by the bolt tightening force and high temperature environment, which causes the ceramic part to make hard contact with the metal electrode, resulting in wear and sealing failure.
The assembly chamber formed by the tray and cover plate, combined with the first and second resilient seals, provides floating space for the ceramic parts in multiple directions, avoids hard contact, restricts contact through the resilient seals, ensures sealing effect, and reduces mechanical stress.
It improves the sealing effect of the upper electrode assembly, extends its service life, prevents wear and breakage of ceramic parts and metal electrodes, and ensures stable operation of the equipment.
Smart Images
Figure CN224519866U_ABST