加热膜连接结构
By integrating the heating film with the connecting wire and fixing it onto the PCB board, and using soldering and pad structures, the problems of large space occupation and low welding efficiency of the heating film are solved, achieving efficient space utilization and reliable welding of the battery module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LUOYANG E-ENERGY STORAGE & TRANSFORMATION SYST CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-07-17
AI Technical Summary
Existing heating films occupy a large space in batteries, have low welding efficiency, and are difficult to fix, affecting the spatial design and welding reliability of battery modules.
The heating film and connecting wire are integrated and fixed to the PCB board by soldering. The solder pads and insulating sealant are used to improve the soldering reliability and the wire exit method is changed to top exit.
It reduces the space occupied at the heating film connection, improves welding efficiency and reliability, and facilitates the space design and operation of the battery module.
Smart Images
Figure CN224519962U_ABST
Abstract
Claims
1. A heating film connecting structure, comprising a plurality of heating films (1) arranged between adjacent battery cells (2), and a PCB assembly above the battery cells (2) and the heating films (1), characterized in that: The upper end of the heating film (1) is integrally connected with a connecting wire (3) with an insulating sheath. The connecting wire (3) is connected to the resistance wire inside the heating film (1). The PCB board (4) of the PCB assembly is provided with a through hole (5) corresponding to the position of each heating film (1). The connecting wires (3) on adjacent heating films (1) pass through their corresponding through holes (5) and are welded together.
2. The heating film connection structure according to claim 1, characterized in that: A pad (6) is provided between two through holes (5), the pad (6) is fixed on the upper surface of the PCB board (4), and the connecting wire (3) is soldered to the pad (6).
3. The heating film connection structure according to claim 2, characterized in that: The connecting wire (3) is connected to the pad (6) by soldering, and an insulating sealant is applied after soldering.
4. The heating film connection structure according to claim 1, characterized in that: The width of the connecting wire (3) is 5 mm.
5. The heating film connection structure according to claim 2, wherein: The width of the pad (6) is greater than the width of the connecting wire (3).
6. The heating film connection structure according to claim 2, wherein: The width of the insulating skin on the outside of the connecting wire (3) is 10mm.