箱体等电位连接结构
By applying a conductive coating to the contact surfaces of components in an energy storage system, the structural redundancy and high cost of existing equipotential bonding schemes are resolved, achieving highly reliable and low-cost equipotential bonding and improving the safety and integration of the energy storage system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中汽新能(天津)电池科技有限公司
- Filing Date
- 2025-09-11
- Publication Date
- 2026-07-17
AI Technical Summary
Existing equipotential bonding schemes for energy storage systems suffer from structural redundancy, complex processes, high costs, and low integration, making it difficult to meet safety requirements under high-voltage environments.
A conductive coating with localized surface treatment is applied to the mechanical connection contact surfaces of components such as the enclosure assembly, enclosure cover, high-voltage plug-in fixing plate, and BMU maintenance panel to form an equipotential connection path, eliminating the need for traditional wire harnesses or metal connectors and achieving electrical conduction using existing structural components.
It achieves highly reliable equipotential bonding, simplifies assembly processes, reduces costs, improves safety, reduces the risk of electric shock and arc discharge, and meets the safety requirements of high-voltage environments.
Smart Images
Figure CN224520137U_ABST
Abstract
Claims
1. A tank equal potential bonding structure, characterized by comprising: a tank main body; a tank cover; a bonding terminal; a bonding conductor; and a bonding terminal cover. Includes enclosure assembly (5), enclosure cover (1), high voltage plug-in fixing plate (2) and BMU maintenance panel (3); On the mechanical connection contact surfaces of at least two of the enclosure assembly (5), enclosure cover (1), high voltage plug fixing plate (2) and BMU maintenance panel (3), there is a conductive coating area formed after local surface treatment and masking, and the conductive coating area constitutes an equipotential connection path between the components.
2. The box equal potential bonding structure according to claim 1, characterized in that: The housing assembly (5) includes a liquid cooling plate and a side beam. The conductive coating area is provided at the fixed connection point between the liquid cooling plate and the side beam, so that the liquid cooling plate and the side beam are connected at the same potential.
3. The box equal potential bonding structure according to claim 1, characterized in that: The conductive coating area is provided on the contact surface of the fixing point for connecting with the external container frame on the outer side beam of the box assembly (5).
4. The box equal potential bonding structure according to claim 1, characterized in that: The conductive coating area is provided between the contact surfaces of the cover (1) and the body assembly (5) in the connection area of the rivet bolts.
5. The box equal potential bonding structure according to claim 1, characterized in that: The conductive coating area is provided in the predetermined circular connection area between the contact surface of the box cover (1) and the high-voltage plug fixing plate (2).
6. The box equal potential bonding structure according to claim 1, characterized by: The cover (1) and the BMU maintenance panel (3) are connected by a rivet nut, and the contact area between the collapsible surface of the rivet nut and the BMU maintenance panel (3) is provided with the conductive coating area.
7. The tank equipotential bonding structure according to any one of claims 1 to 6, characterized in that: The local surface treatment masking is either electrophoretic masking or powder coating masking.
8. The tank equipotential bonding structure according to any one of claims 1 to 6, characterized in that: The conductive coating area is formed by conductive paint.
9. The tank equipotential bonding structure according to any one of claims 1 to 6, characterized in that: The conductive coating area meets the requirement of no red rust or corrosion after 20 hours of neutral salt spray testing.
10. A box-type equipotential bonding structure according to any one of claims 1 to 6, characterized in that: The total resistance of the equipotential bonding path is ≤10mΩ.