一种谐振器结构及陶瓷滤波器
By employing a resonator design with a dual-cavity coupling structure in the ceramic filter, the problems of weakened suppression effect in integrated filters and complex assembly in split filters are solved, achieving efficient suppression and a simplified process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU JAPIN TECH CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-07-17
AI Technical Summary
Existing ceramic filters have reduced suppression performance and are difficult to manufacture in integrated designs, while split designs have complex assembly processes, high production costs, and parasitic parameters introduced by the PCB affect high-frequency performance.
The resonator design employs a dual-cavity coupling structure. By designing a filter circuit on the resonator end face and utilizing the silver layer electrical connection of the first and second resonant units, a circuit connection independent of the PCB is formed, achieving electromagnetic coupling to enhance the suppression effect and simplify the process flow.
It achieves strong suppression effect and simplified process flow, avoids the complexity and high-frequency performance impact brought by PCB, and reduces production cost.
Smart Images
Figure CN224520170U_ABST
Abstract
Claims
1. A resonator structure, characterized by: include, At least one first resonant unit includes a first substrate, a first electrode region, a first resonant cavity, a first circuit printing surface, and a first ground plane; the first substrate has a first end face and a second end face along its length direction, the first circuit printing surface is disposed on the first end face, the first circuit printing surface is provided with a first silver layer, the first silver layer extends to a first side surface of the first substrate; the first electrode region is disposed on the bottom surface and the second side surface of the first substrate and extends to the first end face, the second side surface of the first substrate is opposite to the first side surface; At least one second resonant unit includes a second substrate, a second electrode region, a second resonant cavity, a second circuit printed surface, and a second ground plane; the second substrate has a third end face and a fourth end face along its length, the second circuit printed surface is disposed on the third end face, the second circuit printed surface is provided with an isolation silver layer, the isolation silver layer is disposed on the third end face and extends along the third end face to a first side face of the second substrate, the isolation silver layer is electrically connected to the first silver layer; the second electrode region is disposed on the bottom surface and the second side face of the second substrate and extends to the third end face, the first side face and the second side face of the second substrate are opposite to each other.
2. A resonator structure according to claim 1, characterised in that: The first resonant cavity includes a first resonant hole, which is disposed along the length direction of the first substrate, and the first silver layer is electrically connected to the first resonant hole.
3. A resonator structure as claimed in claim 1, characterised in that: The first ground plane includes a first end face ground silver layer, a first top face ground silver layer, a first bottom face ground silver layer and a first side face ground silver layer. The first end face ground silver layer is disposed on the second end face, the first top face ground silver layer is disposed on the top surface of the first substrate, the first bottom face ground silver layer is disposed on the bottom surface of the first substrate, and the first side face ground silver layer is disposed on the first side face and the second side face of the first substrate, respectively.
4. A resonator structure as claimed in claim 3, characterised in that: The first electrode region is insulated from the first ground plane.
5. A resonator structure as claimed in claim 1, characterized in that: The second circuit printing surface is provided with a second silver layer; the second resonant cavity includes a second resonant hole, the second resonant hole is disposed along the length direction of the second substrate, and the second silver layer is electrically connected to the second resonant hole.
6. A resonator structure as claimed in claim 1, characterized in that: The second ground plane includes a second end face ground silver layer, a second top face ground silver layer, a second bottom face ground silver layer, and a second side face ground silver layer. The second end face ground silver layer is disposed on the fourth end face, the second top face ground silver layer is disposed on the top surface of the second substrate, the second bottom face ground silver layer is disposed on the bottom surface of the second substrate, and the second side face ground silver layers are disposed on the first side face and the second side face of the second substrate, respectively.
7. A resonator structure as claimed in claim 6, characterised in that: The second electrode region is insulated from the second ground plane.
8. A resonator structure as claimed in claim 1, characterized in that: The first electrode region includes a first input port and a first output port; the second electrode region includes a second input port and a second output port.
9. A resonator structure as claimed in claim 5, characterised in that: The first silver layer and the second silver layer are welded together.
10. A ceramic filter characterized by: It includes at least one resonator structure as described in any one of claims 1-9.