一种能够补偿制造误差的小型PCB射频板测试集束组件
By introducing an elastic pressure plate structure into the bundle assembly, manufacturing errors are compensated, the problem of unreliable contact between the cable outer conductor and the contact plate is solved, and reliable contact between the cable and the bundle housing and miniaturized design are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FUJIAN MICABLE ELECTRONIC TECH GRP CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-07-17
AI Technical Summary
In bundled assemblies, manufacturing errors in the height between the cable connection outer conductor end face and the connector shoulder, as well as the height of the bundled housing mounting connector, lead to unreliable contact between the cable outer conductor and the contact plate. Existing solutions are complex or costly.
The structure includes a bundled housing and an elastic pressure plate. The elastic pressure plate is placed at the opening of the placement cavity to cover all placement cavities. By compensating for manufacturing errors between the connector height and the placement cavity height through deformation, the reliability of contact between the cable outer conductor and the bundled housing is ensured.
Without increasing structural complexity and cost, reliable contact between the cable outer conductor and the bundled housing is achieved by compensating for manufacturing errors through the deformation of the elastic pressure plate, thus meeting miniaturization requirements and improving assembly efficiency.
Smart Images
Figure CN224520307U_ABST
Abstract
Claims
1. A small-sized PCB RF board test cluster assembly capable of compensating manufacturing errors, comprising a cluster shell and a pressing plate; a plurality of placement cavities are arranged side by side on the cluster shell, and the placement cavities are internally used for placing connectors, characterized in that: It also includes an elastic pressure plate, which is placed at the opening of the placement cavity and covers all placement cavities. The pressure plate is locked to the bundle housing to press the elastic pressure plate tightly. The elastic pressure plate compensates for manufacturing errors between the height of multiple connectors and the height of the placement cavity through deformation.
2. The compact PCB RF board test cluster assembly capable of compensating manufacturing errors of claim 1, wherein: The connector includes a solder cup and an inner conductor. The solder cup is soldered to the outer conductor of the cable, and the inner conductor is soldered to the inner conductor of the cable. Both the pressure plate and the elastic pressure plate have through holes for cables and welding cups to pass through, and the through holes on the pressure plate and the through holes on the elastic pressure plate are arranged opposite to each other.
3. A small footprint PCB RF board test cluster assembly capable of compensating for manufacturing errors as recited in claim 2, further comprising: The diameter of the through hole on the elastic pressure plate is smaller than the size of the cavity opening; the edge of the welding cup extends outward to form a shoulder, and the elastic pressure plate is tightly fitted to the shoulder of the welding cup.
4. The compact PCB RF board test cluster assembly capable of compensating manufacturing errors of claim 2, wherein: The pressure plate includes a first pressure plate and a second pressure plate, which are arranged in a mirror-symmetrical manner to form a through hole.
5. The compact PCB RF board test cluster assembly capable of compensating manufacturing errors of claim 4, wherein: The radial cross-section of the through hole is square.
6. The compact PCB RF board test cluster assembly capable of compensating manufacturing errors of claim 1, wherein: The pressure plate has a boss on the side facing the elastic pressure plate, the surface of the boss is in contact with the elastic pressure plate and the boss is embedded in the recess where the placement cavity is located.
7. A small footprint PCB RF board test cluster assembly capable of compensating for manufacturing errors as recited in claim 6, further comprising: The sum of the thickness of the boss and the thickness of the elastic pressure plate is not less than the depth of the recess.
8. The compact PCB RF board test cluster assembly capable of compensating manufacturing errors of claim 1, wherein: The thickness of the elastic pressure plate is 1.5 mm.