A wiring fixing device for semiconductor electrothermal film

Abstract

A wiring fixing device for semiconductor electrothermal films includes: a quantitative feeding assembly for quantitatively placing wiring blocks; and a fixing assembly disposed on the side of the quantitative feeding assembly for fixing the wiring blocks. The quantitative feeding assembly includes a storage bin and a discharge port. The storage bin has a discharge port configured to store multiple sets of wiring blocks. Multiple pressure blocks are disposed above the discharge port, configured to press the wiring blocks in the discharge port. This device uses pressure blocks to press the wiring blocks placed in the discharge port onto a fixing strip. A spacer is disposed on the upper surface of the lowest wiring block. A first telescopic device controls the extension and retraction of the spacer, which separates the lowest wiring block from the upper wiring blocks. A second telescopic device then pushes the wiring blocks to the center of the fixing platform via a push plate. Through the movement of the first and second fixing frames, the wiring blocks are ultimately fixed, preparing for subsequent wiring processing.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor electrothermal film wiring, specifically referring to a wiring fixing device for semiconductor electrothermal films. Background Technology

[0002] Semiconductor electrothermal film is a new type of electrothermal element based on semiconductor materials. Its core is to coat the surface of an insulating and heat-resistant substrate (such as polyester film, ceramics, etc.) with a nanoscale semiconductor solution. When electricity is applied, the film layer efficiently converts electrical energy into heat energy through the resistance effect.

[0003] Currently, the wiring process for semiconductor electrothermal films requires bonding special copper terminals and specific wires to the electrothermal film. In the wiring process of electrothermal films, conventional clamps have obvious defects in fixing the terminals: insufficient clamping force can easily cause the terminals to loosen after crimping, leading to poor contact of the copper strips, abnormal resistance, and the risk of local overheating. At the same time, the loading process requires repeated disassembly and reassembly of the clamps, which is cumbersome and increases the frequency of manual intervention. This not only reduces efficiency but may also lead to a decrease in conductivity due to terminal deformation or copper strip damage, ultimately affecting the reliability and safety of the finished product. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a wiring fixing device for semiconductor electrothermal film, which at least partially solves the above technical problems.

[0005] The technical solution adopted in this utility model is as follows: a wiring fixing device for semiconductor electrothermal film, and a quantitative feeding component for quantitatively placing the wiring block.

[0006] Furthermore, a fixing component is disposed on the side of the quantitative feeding component, and the fixing component is used to fix the wiring block for wiring.

[0007] Furthermore, the quantitative feeding component includes a storage bin and a discharge port. The storage bin has a discharge port inside, and the discharge port is configured to store multiple sets of wiring blocks.

[0008] Furthermore, the upper part of the feed port is provided with multiple sets of pressure blocks, which are configured to push the wiring block in the feed port.

[0009] Furthermore, a first telescopic device and a partition plate are provided. The first telescopic device is disposed on one side of the storage box, and a partition plate is provided inside the first telescopic device. The first telescopic device is configured to control the partition plate to extend and retract back and forth. The partition plate is used to insert into the side bending position of the wiring block to thereby separate the wiring block.

[0010] Furthermore, the size and model of the discharge port are consistent with those of the wiring block.

[0011] Furthermore, the quantitative feeding assembly also includes a second telescopic device, a telescopic column, a push plate, and a feeding track.

[0012] Furthermore, the second telescopic device is located below the first telescopic device and is located on one side of the storage box. The second telescopic device has a telescopic column inside, and a push plate is provided at the front end of the telescopic column. A guide rail groove with the same model and size as the push plate is provided at the bottom of the storage box. The push plate moves back and forth along the guide rail groove. A feeding rail is provided on one side of the push plate. The push plate is used to push the wiring block placed at the bottom of the discharge port into the feeding rail.

[0013] Furthermore, the quantitative feeding assembly also includes a conveying device, a slider, a chute, a connecting bar, and a slide rail.

[0014] Furthermore, conveying devices are provided on both sides of the storage box. The conveying devices have slide rails inside and sliders connected to the outside of the conveying devices. Connecting bars are movably provided inside the conveying devices, and the front end of each connecting bar is connected to the pressure block. The slider passes through the slide rail and connects with the connecting bar. Slide grooves are provided on both sides of the discharge port, and the width of the slide grooves is the same as that of the connecting bar. The conveying devices are configured to control the slider to move along the slide rail, thereby driving the connecting bar to move up and down.

[0015] Furthermore, the quantitative feeding assembly also includes a fixing bar.

[0016] Furthermore, a fixing strip is provided at the bottom of the feeding port, which is used to support the wiring block.

[0017] Furthermore, the fixing component includes a fixing platform, a placement slot, a first fixing frame, and a second fixing frame.

[0018] Furthermore, the fixed platform has a placement groove inside, a first fixing frame is provided on the upper surface of the fixed platform, and a second fixing frame is provided on one side of the first fixing frame. The first fixing frame and the second fixing frame are used to fix the wiring block.

[0019] Furthermore, the fixing assembly also includes a first slide rail, a first connecting column, a first connecting block, a first hydraulic actuator, and a second hydraulic actuator.

[0020] Furthermore, a first slide rail is provided inside one side of the fixed platform, and a first connecting column is movably provided inside the first slide rail. The first connecting column is connected to the first fixed frame. A first connecting block is provided on one side of the first connecting column, and a first hydraulic actuator is provided at the lower part of the first connecting block. The first hydraulic actuator is used to drive the first fixed frame to move up and down. A second hydraulic actuator is provided outside the first hydraulic actuator. The second hydraulic actuator is configured to control the first fixed frame to move back and forth.

[0021] Furthermore, the fixing assembly also includes a second slide, a second connecting block, and a third hydraulic actuator.

[0022] Furthermore, a second slide is provided on the other side of the fixed platform, and a second connecting block is provided inside the second slide. The second connecting block is connected to the second fixed frame, and a third hydraulic device is provided at the lower part of the second connecting block. The third hydraulic device is used to drive the second fixed frame to move up and down.

[0023] Furthermore, the wiring fixing device for semiconductor electrothermal film proposed in this utility model includes an extrusion assembly, which is disposed on one side of the quantitative feeding assembly. The extrusion assembly is used to press the wiring block to complete the wiring process of the electrothermal film.

[0024] Furthermore, the extrusion assembly includes a hydraulic system, a hydraulic rod, and a pressure plate.

[0025] Furthermore, the lower part of the hydraulic system is provided with a hydraulic rod, and the lower part of the hydraulic rod is provided with a pressure plate. The shape of the pressure plate is consistent with that of the wiring block, and the pressure plate is used to squeeze the wiring block.

[0026] The beneficial effects achieved by adopting the above structure are as follows:

[0027] (1) The wire block placed in the feed port is pressed to the upper part of the fixed bar by the pressure block. The spacer plate is set on the upper surface of the bottom wire block. The first telescopic device controls the extension and retraction of the spacer plate. The spacer plate can separate the bottom wire block from the upper wire block. Then the second telescopic device pushes the wire block to the middle of the fixed platform by the push plate. Through the movement of the first fixed frame and the second fixed frame, the wire block can be fixed in the end, which is ready for subsequent wiring processing.

[0028] (2) The first and second fixed frames are driven to move upward by the first hydraulic device and the second hydraulic device respectively, which can frame the wiring block. Then the second hydraulic device controls the first fixed frame to move back and forth along the placement groove. Finally, the wiring block can be fixed between the first fixed frame and the second fixed frame by the back and forth movement of the first fixed frame. Attached Figure Description

[0029] Figure 1 This is a perspective view of a wiring fixing device for a semiconductor electrothermal film according to this utility model embodiment;

[0030] Figure 2 The three-dimensional quantitative feeding component proposed in this utility model embodiment Figure 1 ;

[0031] Figure 3 The three-dimensional quantitative feeding component proposed in this utility model embodiment Figure 2 ;

[0032] Figure 4 This is a front view of the quantitative feeding assembly proposed in this utility model embodiment;

[0033] Figure 5 The three-dimensional fixing component proposed in this utility model embodiment Figure 1 ;

[0034] Figure 6 The three-dimensional fixing component proposed in this utility model embodiment Figure 2 ;

[0035] Figure 7 This is a perspective view of the extrusion assembly proposed in this utility model embodiment.

[0036] Figure 8 This is a perspective view of the wiring block proposed in this utility model embodiment.

[0037] The components include: 1. a quantitative feeding assembly; 2. a fixing assembly; and 3. an extrusion assembly.

[0038] 40. Feeding device; 50. Pushing device; 60. Distributing assembly; 11. Storage bin; 12. Feeding port; 13. Conveying device; 14. Slider; 15. Slide groove; 16. Pressing block; 17. Connecting strip; 18. Slide rail; 19. First telescopic device; 110. Partition plate; 111. Second telescopic device; 112. Telescopic column; 113. Limiting shaft; 114. Push plate; 115. Feeding track; 116. Fixing strip;

[0039] 21. Fixed platform; 22. Placement slot; 23. First fixed frame; 24. Second fixed frame; 25. First slide rail; 26. First connecting column; 27. First connecting block; 28. First hydraulic unit; 29. ​​Second hydraulic unit; 210. Second slide rail; 211. Second connecting block; 212. Third hydraulic unit;

[0040] 31. Support plate; 32. Hydraulic system; 33. Hydraulic rod; 34. Fixing plate; 35. Pressure plate;

[0041] 70. Wiring block.

[0042] The accompanying drawings are provided to further illustrate the embodiments of the present utility model and form part of the specification. They are used together with the embodiments of the present utility model to explain the present utility model and do not constitute a limitation thereof. Detailed Implementation

[0043] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0044] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown in the figure, this utility model proposes a wiring fixing device for semiconductor electrothermal film, including a quantitative feeding component 1, which includes a feeding device 40, a pushing device 50, a distributing component 60 and a fixing strip 116.

[0046] The feeding device 40 is used to collect the wiring blocks 70, the pushing device 50 can separate the wiring blocks 70, and the separating component 60 can push the wiring blocks 70 onto the upper surface of the fixed platform 21.

[0047] The feeding device 40 includes a storage bin 11, a feeding port 12, a conveying device 13, a slider 14, a chute 15, a pressure block 16, a connecting strip 17, and a slide rail 18. The pushing device 50 includes a second telescopic device 111, a telescopic column 112, a limiting shaft 113, a push plate 114, and a feeding track 115. The material distribution assembly 60 includes a first telescopic device 19 and a partition plate 110.

[0048] In this practical embodiment, the storage bin 11 has a discharge port 12 inside. The size and shape of the discharge port 12 are consistent with those of the wiring block 70. The discharge port 12 extends from the upper part to the lower part of the storage bin 11. Slide grooves 15 are provided on both sides of the discharge port 12, and a set of pressure blocks 16 are provided on the upper part of the discharge port 12. The pressure blocks 16 can enter the discharge port 12. Connecting strips 17 are provided on both sides of the pressure blocks 16. The connecting strips 17 are movably disposed inside the conveying device 13, and the conveying device 13 is fixed on both sides of the storage bin 11. A slide rail 18 is provided inside the conveying device 13, and a slider 14 is movably disposed outside the conveying device 13. The slider 14 passes through the slide rail 18 and connects with the connecting strips 17. The conveying device 13 can drive the slider 14 to move back and forth along the slide rail 18, which in turn can drive the connecting strip 17 inside the conveying device 13 to move. The size of the connecting strip 17 is the same as that of the slide groove 15. When the connecting strip 17 moves downward, it can enter the slide groove 15. Therefore, the conveying device 13 can drive the pressure block 16 to move along the feed port 12. The wiring block 70 is stacked inside the feed port 12. As the pressure block 16 moves, the wiring block 70 will be pushed to the bottom of the feed port 12. A fixing strip 116 is provided at the bottom of the feed port 12. Finally, the wiring block 70 will be pushed to the top of the fixing strip 116. By storing the wiring block 70 in the feed port 12, it is convenient for subsequent wiring processing.

[0049] The wiring block 70 is used to connect the semiconductor heating film and the transmission line. A circular terminal is provided at the front end of the wiring block 70 for the connection of the transmission line. A pressure plate is provided on one side of the wiring block 70, and the wiring block 70 and the pressure plate are connected in an arc shape. The semiconductor heating film to be connected needs to place one side between the wiring block 70 and the pressure plate, and then the circular terminal is pressed to fit the pressure plate, thus completing the wiring process of the heating film. In the existing equipment, when the wiring block 70 is fixed by a conventional fixture during the wiring process of the heating film, it may become loose. Moreover, the wiring block 70 needs to be put back into the fixture during the feeding process. This process is not only complicated but may also cause unsuccessful wiring, affecting the finished product.

[0050] A first telescopic device 19 is provided on one side of the storage bin 11. Inside the first telescopic device 19 is a partition plate 110. The first telescopic device 19 can control the extension and retraction of the partition plate 110, and the partition plate 110 can extend into the discharge port 12. When the connector block 70 is pressed to the bottom of the discharge port 12 by the pressure block 16, the height of the partition plate 110 is higher than the lowest connector block 70. The height of the partition plate 110 is set between the penultimate and penultimate connector blocks 70. The first telescopic device 19 controls the extension and retraction of the partition plate 110, which can separate the penultimate and penultimate connector blocks 70, thus allowing the connector blocks 70 to be fed intermittently. A second telescopic device 111 is provided below the first telescopic device 19. Inside the second telescopic device 111 is a telescopic column 112. A limiting shaft 113 is provided at one end of the telescopic column 112, which can restrict the movement of the telescopic column 112. The telescopic column 112 has a push plate 114 at the other end, and a feeding track 115 is provided on the outside of the push plate 114. When the partition plate 110 separates the wiring block 70, the second telescopic device 111 controls the telescopic column 112 to move, thereby controlling the push plate 114 to move outward. At the bottom of the storage box 11, there is a guide rail groove with the same model and size as the push plate 114. The push plate 114 moves back and forth along the guide rail groove. When the push plate 114 moves outward, it can push the bottom wiring block 70 into the feeding track 115. The feeding track 115 is aligned with the upper surface of the fixed table 21. Finally, the wiring block 70 will be pushed to the fixed table 21 for fixing. The above operation can not only complete the fixed-point and timed feeding of the wiring block 70 in sequence, but also accurately deliver the wiring block 70 to the wiring position for fixing. This not only facilitates the subsequent wiring process and greatly improves the wiring efficiency, but also improves the wiring quality.

[0051] like Figure 1 , Figure 5 , Figure 6 and Figure 8 As shown in the figure, this utility model proposes a wiring fixing device for semiconductor electrothermal film, including a fixing component 2, which is disposed on the side of the quantitative feeding component 1. The fixing component 2 is used to fix the wiring block 70 for wiring.

[0052] The fixing component 2 includes a fixing platform 21, a placement slot 22, a first fixing frame 23, a second fixing frame 24, a first slide rail 25, a first connecting column 26, a first connecting block 27, a first hydraulic actuator 28, a second hydraulic actuator 29, a second slide rail 210, a second connecting block 211, and a third hydraulic actuator 212.

[0053] In this practical embodiment, the fixed platform 21 is provided with a set of placement slots 22, and a first fixed frame 23 and a second fixed frame 24 are respectively provided inside the placement slots 22. The first fixed frame 23 and the second fixed frame 24 can move inside the placement slots 22. A first slide rail 25 is provided on one side of the fixed platform 21. A first connecting column 26 is movably provided inside the first slide rail 25. A first connecting block 27 is provided at one end of the first connecting column 26. A first hydraulic device 28 is provided at the lower part of the first connecting block 27. The first connecting column 26 passes through the first slide rail 25 and connects with the first fixed frame 23. The first hydraulic device 28 drives the first connecting column 26 to move up and down, thereby driving the first fixed frame 23 to move up and down. A second hydraulic device 29 is provided outside the first hydraulic device 28. The second hydraulic device 29 can drive the first hydraulic device 28 to move back and forth. As the first hydraulic device 28 moves, it eventually drives the first fixed frame 23 to move back and forth. Furthermore, a second slide rail 210 is provided on the other side of the fixed platform 21. A second connecting block 211 is movably provided inside the second slide rail 210. The second connecting block 211 passes through the second slide rail 210 and connects with the second fixed frame 24. A third hydraulic device 212 is provided at the lower part of the second connecting block 211. The third hydraulic device 212 can drive the second fixed frame 24 to move up and down.

[0054] When the connector block 70 is pushed onto the upper surface of the fixed platform 21 by the push plate 114, the first fixed frame 23 moves downward while the second fixed frame 24 remains protruding. After the connector block 70 is pushed to fit against the second fixed frame 24, the push plate 114 returns to the discharge port 12 position. At this time, the first hydraulic actuator 28 drives the first fixed frame 23 to move upward, and then the third hydraulic actuator 212 drives the first fixed frame 23 to move towards the second fixed frame 24. As the first fixed frame 23 moves, the connector block 70 placed inside it will be firmly fixed. The operator places the transmission line inside the circular terminal of the wiring block 70, places the semiconductor heating film between the wiring block 70 and the pressure plate, and then the pressure plate 35 in the extrusion assembly 3 will extrude the pressure plate and the circular terminal. As the pressure plate 35 extrudes, the wiring process of the semiconductor heating film is finally completed. Compared with the existing wiring fixing device, this utility model can not only perform precise feeding through the quantitative feeding assembly 1, but also completely fix the wiring block 70, which greatly saves operation steps and improves the quality and efficiency of wiring.

[0055] like Figure 1 , Figure 7 and Figure 8 As shown in the figure, this utility model proposes a wiring fixing device for semiconductor electrothermal film, including a pressing component 3. The pressing component 3 is disposed on one side of the quantitative feeding component 1. The pressing component 3 cooperates with the pressing wiring block 70 to complete the wiring process of the electrothermal film.

[0056] The extrusion assembly 3 includes a support plate 31, a hydraulic system 32, a hydraulic rod 33, a fixing plate 34, and a pressing plate 35.

[0057] In this practical embodiment, the fixing plate 34 is fixed to one side of the storage box 11, and the other end of the fixing plate 34 is provided with a support plate 31. The lower part of the support plate 31 is fixedly connected to the hydraulic system 32, and the lower part of the hydraulic system 32 is provided with a hydraulic rod 33. The bottom end of the hydraulic rod 33 is provided with a pressure plate 35, and the pressure plate 35 is located directly above the fixing platform 21. The shape of the pressure plate 35 is consistent with that of the wiring block 70. The hydraulic system 32 drives the hydraulic rod 33 to move up and down, which in turn drives the pressure plate 35 below it to move up and down. As the pressure plate 35 moves downward, the wiring block 70 placed between the first fixing frame 23 and the second fixing frame 24 can be pressed together, and the wiring process of the wiring block 70 is finally completed. After the wiring block 70 is completed, the operator removes the electric heating film after the wiring is completed. Then the quantitative feeding component 1 pushes the next wiring block 70 to the upper part of the fixing platform 21, and so on, until the wiring process of the wiring block 70 is finally completed.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0059] Although embodiments of the present utility have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present utility.

[0060] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited to this. In conclusion, if those skilled in the art are inspired by this description and, without departing from the inventive spirit of the present invention, design similar structures and embodiments to this technical solution, all such designs should fall within the protection scope of this invention.

Claims

1. A wiring fixing device for a semiconductor electrothermal film, characterized in that, include: A quantitative feeding assembly (1) is used to quantitatively complete the placement of the wiring block (70); A fixing component (2) is disposed on the side of the quantitative feeding component (1), and the fixing component (2) is used to fix the wiring block (70) for wiring. The quantitative feeding component (1) includes: The storage bin (11) and the discharge port (12) are provided inside the storage bin (11), and the discharge port (12) is configured to store multiple sets of wiring blocks (70). Pressing block (16), multiple sets of pressing blocks (16) are provided on the upper part of the feeding port (12), and the pressing block (16) is configured to push the connecting block (70) in the feeding port (12); The first telescopic device (19) and the partition plate (110) are provided. The first telescopic device (19) is located on one side of the storage box (11). The partition plate (110) is provided inside the first telescopic device (19). The first telescopic device (19) is configured to control the partition plate (110) to extend and retract back and forth. The partition plate (110) is used to insert into the side bending position of the wiring block (70) and thus to act as a partition for the wiring block (70).

2. The wiring fixing device for semiconductor electrothermal film according to claim 1, characterized in that: The size and model of the discharge port (12) are the same as those of the wiring block (70).

3. The wiring fixing device for semiconductor electrothermal film according to claim 1, characterized in that: The quantitative feeding assembly (1) also includes a second telescopic device (111), a telescopic column (112), a push plate (114), and a feeding track (115). The second telescopic device (111) is located at the lower part of the first telescopic device (19), and the second telescopic device (111) is located on one side of the storage box (11). The interior of the second telescopic device (111) is provided with a telescopic column (112). The front end of the telescopic column (112) is provided with a push plate (114). The bottom of the storage box (11) is provided with a guide rail groove with the same model and size as the push plate (114). The push plate (114) moves back and forth along the guide rail groove. A feeding track (115) is provided on one side of the push plate (114). The push plate (114) is used to push the wiring block (70) placed at the bottom of the discharge port (12) into the feeding track (115).

4. The wiring fixing device for semiconductor electrothermal film according to claim 3, characterized in that: The quantitative feeding assembly (1) also includes a conveying device (13), a slider (14), a chute (15), a connecting bar (17), and a slide rail (18). The storage box (11) is provided with conveying devices (13) on both sides. The conveying device (13) is provided with a slide rail (18) inside. The conveying device (13) is connected to a slider (14) outside. The conveying device (13) is provided with a connecting strip (17) inside. The front end of each connecting strip (17) is connected to the pressure block (16). The slider (14) passes through the slide rail (18) and connects with the connecting strip (17). The discharge port (12) is provided with a slide groove (15) on both sides. The width of the slide groove (15) is the same as that of the connecting strip (17). The conveying device (13) is configured to control the slider (14) to move along the slide rail (18), thereby driving the connecting strip (17) to move up and down.

5. The wiring fixing device for semiconductor electrothermal film according to claim 4, characterized in that: The quantitative feeding assembly (1) also includes a fixing bar (116). The bottom of the feed port (12) is provided with a fixing strip (116), which is used to support the wiring block (70).

6. The wiring fixing device for semiconductor electrothermal film according to claim 1, characterized in that: The fixing component (2) includes a fixing platform (21), a placement slot (22), a first fixing frame (23), and a second fixing frame (24); The fixed platform (21) has a placement slot (22) inside, and a first fixing frame (23) is provided on the upper surface of the fixed platform (21). A second fixing frame (24) is provided on one side of the first fixing frame (23). The first fixing frame (23) and the second fixing frame (24) are used to fix the wiring block (70).

7. The wiring fixing device for semiconductor electrothermal film according to claim 6, characterized in that: The fixing component (2) also includes a first slide rail (25), a first connecting column (26), a first connecting block (27), a first hydraulic actuator (28), and a second hydraulic actuator (29); The fixed platform (21) has a first slide rail (25) inside one side, and a first connecting column (26) is movably provided inside the first slide rail (25). The first connecting column (26) is connected to the first fixed frame (23). A first connecting block (27) is provided on one side of the first connecting column (26). A first hydraulic device (28) is provided at the lower part of the first connecting block (27). The first hydraulic device (28) is used to drive the first fixed frame (23) to move up and down. A second hydraulic device (29) is provided on the outside of the first hydraulic device (28). The second hydraulic device (29) is configured to control the first fixed frame (23) to move back and forth.

8. The wiring fixing device for semiconductor electrothermal film according to claim 7, characterized in that: The fixing component (2) also includes a second slide (210), a second connecting block (211), and a third hydraulic actuator (212). The fixed platform (21) has a second slide (210) on the other side, and a second connecting block (211) is provided inside the second slide (210). The second connecting block (211) is connected to the second fixed frame (24). A third hydraulic device (212) is provided at the lower part of the second connecting block (211). The third hydraulic device (212) is used to drive the second fixed frame (24) to move up and down.

9. The wiring fixing device for semiconductor electrothermal film according to claim 8, characterized in that: It includes an extrusion assembly (3), which is disposed on one side of the quantitative feeding assembly (1). The extrusion assembly (3) is used to press the wiring block (70) to complete the wiring process of the electric heating film.

10. The wiring fixing device for semiconductor electrothermal film according to claim 9, characterized in that: The extrusion assembly (3) includes a hydraulic system (32), a hydraulic rod (33), and a pressing plate (35). The hydraulic system (32) is provided with a hydraulic rod (33) at the lower part, and a pressure plate (35) is provided at the lower part of the hydraulic rod (33). The shape of the pressure plate (35) is consistent with that of the wiring block (70), and the pressure plate (35) is used to squeeze the wiring block (70).

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