热沉及激光器
By setting up turbulence columns and independent flow channel structures within the heat sink channel, the fluid dynamics characteristics are optimized, solving the problems of low heat exchange efficiency and temperature non-uniformity in traditional microchannel heat sinks, and achieving a highly efficient heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DOGAIN LASER TECH (SUZHOU) CO LTD
- Filing Date
- 2025-10-17
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional microchannel heat sinks suffer from low heat transfer coefficients, uneven temperature distribution, and flow instability, especially at high heat flux densities, which can easily lead to flow boiling and channel blockage.
Design a heat sink structure in which the flow channels are arranged parallel to the heat dissipation surface, and turbulence columns are set in the flow channels to generate turbulence. The cooling medium enters each flow channel through the same inlet and is separated by independent guide channels and support baffles. The turbulence columns guide the flow of the medium in the flow channels to improve the heat exchange efficiency.
It significantly improves heat exchange efficiency, reduces average junction temperature and maximum temperature, optimizes temperature distribution uniformity, improves hydrodynamic characteristics, and solves the heat dissipation bottleneck of high-power devices.
Smart Images
Figure CN224520438U_ABST
Abstract
Claims
1. A heat sink, characterized by One outer wall of the heat sink forms a heat dissipation surface (1); The heat sink has an inlet (2) and an outlet (3) on its other outer side wall. The heat sink has multiple independent flow channels inside. The multiple flow channels are arranged in a direction parallel to the heat dissipation surface (1), and all the flow channels share the inlet (2) and outlet (3). Each of the flow channels is provided with multiple turbulence columns (41).
2. The heat sink of claim 1, wherein, The turbulence column (41) extends along a first direction, which is perpendicular to the heat dissipation surface (1). In the first direction, the turbulence column (41) includes a top end and a bottom end, which are respectively connected to the sidewalls on opposite sides of the flow channel; The cross-sectional shape of the turbulence column (41) on the first plane is teardrop-shaped, and the teardrop shape includes a large end and a small end. The direction of the large end toward the small end is consistent with the direction of medium flow in the flow channel, and the first plane is perpendicular to the first direction.
3. The heat sink of claim 2, wherein, The heat sink includes a heat sink plate (6) and a base (7), and the upper surface of the heat sink plate (6) forms the heat dissipation surface (1). The upper surface of the base (7) is provided with multiple guide grooves (4), the liquid inlet (2) and the liquid outlet (3) are both provided on the bottom surface of the base (7), and two adjacent guide grooves (4) are separated by a support partition (5) so that the multiple guide grooves (4) are independent of each other; All the flow channels (4) share the inlet (2) and outlet (3); one end of the support partition (5) is connected to the inlet (2) and the other end is connected to the outlet (3); the bottom end of the turbulence column (41) is connected to the bottom surface of the flow channel (4); The upper surface of the base (7) is connected to the lower surface of the heat sink (6), and the top of the turbulence column (41) is connected to the lower surface of the heat sink (6); the lower surface of the heat sink (6) and the flow guide groove (4) form the flow channel.
4. The heat sink of claim 3, wherein, The base (7) is welded to the heat sink (6), and the baffle column (41) is welded to the heat sink (6); There is a solder layer (10) between the upper surface of the base (7) and the lower surface of the heat sink (6), and between the top of the turbulence column (41) and the lower surface of the heat sink (6).
5. The heat sink of claim 4, wherein, The solder layer (10) is made of silver-copper solder.
6. The heat sink of any one of claims 3-5, wherein, The heat sink (6) includes a base layer (61) and a copper cladding layer (62) connected vertically, and the upper surface of the base layer (61) forms the heat dissipation surface (1). The base (7) is made of copper.
7. The heat sink of claim 2, wherein, The heat sink includes a heat sink plate (6) and a bottom cover (8), and the upper surface of the heat sink plate (6) forms the heat dissipation surface (1). The lower surface of the heat sink (6) is provided with multiple flow guide grooves (4), and two adjacent flow guide grooves (4) are separated by a support partition (5) so that the multiple flow guide grooves (4) are independent of each other; the top of the turbulence column (41) is connected to the bottom surface of the flow guide groove (4). The liquid inlet (2) and liquid outlet (3) are both located on the bottom cover (8); The upper surface of the bottom cover (8) is connected to the lower surface of the heat sink (6), and the bottom end of the turbulence column (41) is connected to the upper surface of the bottom cover (8) so that the upper surface of the bottom cover (8) and the flow guide groove (4) form the flow channel; one end of the support partition (5) is connected to the liquid inlet (2), and the other end is connected to the liquid outlet (3).
8. The heat sink of claim 7, wherein, The heat sink (6) includes a base layer (61) and a copper cladding layer (62) connected vertically, and the upper surface of the base layer (61) forms the heat dissipation surface (1). The flow channel (4) is disposed within the copper cladding layer (62).
9. The heat sink of claim 7, wherein, The bottom cover (8) is connected to a metal plate (9), and the metal plate (9) is provided with through holes corresponding to the liquid inlet (2) and the liquid outlet (3).
10. A laser characterized by, Includes the heat sink as described in any one of claims 1-9.