A multi-pin ceramic encapsulation housing for vacuum packaging
By using 4J29 iron-nickel-cobalt alloy material and Ag72Cu28 solder, the thermal stress problem of ceramic encapsulation shell during sintering was solved, improving airtightness and production efficiency, and reducing the probability of cracking and cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HONGGANG MICROELECTRONICS PACKAGING TECHNOLOGY CO LTD
- Filing Date
- 2025-09-20
- Publication Date
- 2026-07-17
AI Technical Summary
During the sintering process, the existing ceramic encapsulation tube shell is prone to cracking due to the significant difference in the thermal expansion coefficients between the ceramic insulator and the oxygen-free copper shell, resulting in poor airtightness.
The tube shell body is made of 4J29 iron-nickel-cobalt alloy material. The gap between the groove and the ceramic insulator is reduced to reduce thermal stress, and the airtightness is improved by welding with Ag72Cu28 solder.
This reduces the probability of cracks in ceramic insulators during sintering, improves airtightness and production efficiency, and reduces production costs.
Smart Images
Figure CN224520441U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of tube and shell packaging, and in particular to a multi-pin ceramic packaging tube and shell for vacuum packaging. Background Technology
[0002] A vacuum encapsulation package is a type of package used for packaging electronic devices. Its main characteristic is that the encapsulation is performed in a vacuum environment to ensure the stability and reliability of the device during long-term use. These packages typically have a multi-pin structure and are suitable for devices requiring high-density pin connections.
[0003] Currently, the preparation of the tube shell usually uses ceramic insulators as the insulating encapsulation material for the oxygen-free copper shell and pin package, and finally welds them together with the tube shell. The ceramic insulator uses alumina ceramic with an alumina content of 90%. Before sintering, the oxygen-free copper shell, pins and ceramic insulator are assembled and placed in a high-hardness graphite fixture. Then the whole assembly is placed in a tunnel furnace under a nitrogen-hydrogen protective atmosphere for sintering and glass sealing.
[0004] However, because the shell is made of oxygen-free copper (coefficient of linear expansion 17.8×10⁻⁻⁻⁶), 6 ℃⁻¹), the ceramic insulator is 90% alumina ceramic (linear expansion coefficient 6.7×10⁻ 6 The difference in linear expansion coefficients between the two is significant (℃⁻¹), which makes it easy for cracks to appear in ceramic insulators during sintering, resulting in poor airtightness. Utility Model Content
[0005] In order to reduce the probability of cracks appearing in ceramic insulators during the sintering of ceramic encapsulation shells, this application provides a multi-pin ceramic encapsulation shell for vacuum encapsulation.
[0006] This application provides a multi-pin ceramic encapsulation shell for vacuum packaging, employing the following technical solution: A multi-pin ceramic encapsulation shell for vacuum packaging includes a shell body, a ceramic insulator, and pins. The shell body has multiple through holes, and the ceramic insulator is snapped into the through holes. The pins pass through the ceramic insulator and are snapped in place. Multiple sets of grooves are formed on one side of the shell body. The grooves are coaxially arranged with the corresponding through holes. The depth of the grooves is less than the thickness of the shell body. There is a certain gap between the grooves and the ceramic insulator to facilitate the release of thermal stress on the ceramic insulator. The shell body is made of 4J29 iron-nickel-cobalt alloy material.
[0007] By adopting the above technical solution, multiple sets of pins and ceramic insulators are placed sequentially inside the casing. The casing body is made of 4J29 iron-nickel-cobalt alloy material with a thermal expansion coefficient close to that of ceramic insulators. This reduces the thermal stress generated during sintering between the casing body and the ceramic insulator. At the same time, some of the thermal stress between the casing body and the ceramic insulator is released through the gap between the groove and the ceramic insulator, reducing the probability of cracks appearing in the ceramic insulator during the sintering of the ceramic encapsulated casing.
[0008] Furthermore, the ceramic insulator includes a first ring and a second ring whose axes coincide. The first ring is snapped into a through hole, and the second ring is disposed in a groove. There is a certain gap between the second ring and the side wall of the groove. The diameter of the second ring is larger than that of the first ring. The side of the second ring closer to the first ring abuts against the bottom of the groove. The first ring and the second ring abut against each other and are integrally machined.
[0009] By adopting the above technical solution, the first ring is used to snap the ceramic insulator onto the tube shell body, the second ring is pressed against the bottom of the groove and used to limit the installation position of the ceramic insulator, and the gap between the second ring and the groove facilitates the release of thermal stress on the ceramic insulator, thereby ensuring the ceramic insulator is fixed while reducing the thermal stress on the ceramic insulator during sintering.
[0010] Furthermore, a gasket is provided on the side of the second ring away from the first ring to enhance the airtightness between the ceramic insulator and the pin. The gasket is sleeved on the pin and pressed against the end face of the second ring. The gasket is made of 4J42 alloy material.
[0011] By adopting the above technical solution, the gasket fills the gap between the ceramic insulator and the pin, thereby improving the airtightness between the ceramic insulator and the pin.
[0012] Furthermore, the ceramic insulator is made of alumina ceramic with an alumina content of more than 95%.
[0013] By adopting the above technical solution, ceramic insulators made of alumina ceramics with an alumina content of more than 95% have finer internal ceramic grains and lower porosity, which improves the internal structure and bonding strength of the ceramic insulators, and ultimately improves the overall strength and sealing reliability of the ceramic insulators.
[0014] Furthermore, the pins are made of 4J29 copper-clad lead wire.
[0015] By adopting the above technical solution, the pins made of 4J29 copper-clad lead material can effectively meet the maximum current output of semiconductor lasers. At the same time, the pressure encapsulation process between 4J29 copper-clad lead material and alumina ceramic has high stability, which makes it easier to ensure the airtightness between the pins and ceramic insulators.
[0016] Furthermore, the shell body includes a base plate and a frame, and multiple sets of through holes are provided on the base plate. The base plate and the frame are integrally machined.
[0017] By adopting the above technical solution, the integrated processing of the base plate and frame eliminates the seam between the split base plate and frame, improves the overall airtightness, and reduces the steps of split processing, sintering and assembly, thereby reducing production costs.
[0018] Furthermore, a cover plate is provided on the side of the frame away from the bottom plate to seal the end face of the frame. A protrusion is provided on the side of the cover plate near the frame. The protrusion is snapped onto the inner wall of the frame. The cover plate is made of 4J42 alloy material.
[0019] By adopting the above technical solution, the raised structure facilitates mechanical locking, and the parallel sealing welding process improves the sealing efficiency of the cover plate. At the same time, the thermal expansion coefficients of 4J42 alloy material and 4J29 iron-nickel-cobalt alloy material are similar, reducing the probability of the cover plate falling off due to thermal cycling.
[0020] Furthermore, the pins, ceramic insulators, and gaskets are assembled and then sintered to form lead wire assemblies. Multiple sets of lead wire assemblies are sequentially installed into the casing and soldered using Ag72Cu28 solder.
[0021] By adopting the above technical solution, the pre-sintered lead assembly effectively reduces the number of times the casing body is exposed to heat, effectively avoiding the probability of material performance degradation caused by multiple high-temperature processing. At the same time, the welding of the lead assembly and the casing body is improved by using Ag72Cu28 solder.
[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. By assembling and sintering the leads, ceramic insulators, and gaskets into lead assemblies, and then placing multiple lead assemblies sequentially into the casing, the casing body is made of 4J29 iron-nickel-cobalt alloy material with a thermal expansion coefficient close to that of the ceramic insulator. This reduces the thermal stress generated between the casing body and the ceramic insulator during sintering. At the same time, some of the thermal stress between the casing body and the ceramic insulator is released through the gap between the groove and the ceramic insulator, reducing the probability of cracks appearing in the ceramic insulator during the sintering of the ceramic encapsulated casing. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the multi-pin ceramic encapsulation shell structure of this application, showing the structure without the cover plate installed; Figure 2 This is a schematic diagram of the exploded structure of the multi-pin ceramic encapsulation shell of this application; Figure 3 This is a schematic diagram of the assembly structure of the lead wire assembly before sintering in this application; Figure 4 This is a bottom view of this application; Figure 5 yes Figure 4 A cross-sectional schematic diagram of AA in the middle; Figure 6 yes Figure 5 Enlarged schematic diagram of section B.
[0024] Reference numerals: 1. Tube shell body; 11. Base plate; 111. Through hole; 112. Groove; 12. Frame; 2. Ceramic insulator; 21. First ring; 22. Second ring; 23. Mounting hole; 3. Gasket; 4. Pin; 5. Cover plate; 51. Protrusion. Detailed Implementation
[0025] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.
[0026] This application discloses a multi-pin ceramic encapsulation shell for vacuum packaging.
[0027] Reference Figure 1 and Figure 2 A multi-pin ceramic encapsulation housing for vacuum packaging includes a housing body 1, a ceramic insulator 2, and pins 4. The housing body 1 has multiple through holes 111. The ceramic insulator 2 is snapped into the through holes 111. The pins 4 pass through the ceramic insulator 2 and are snapped in place. Multiple sets of grooves 112 are formed on one side of the housing body 1. The grooves 112 are coaxially arranged with the corresponding through holes 111. The depth of the grooves 112 is less than the thickness of the housing body 1. There is a certain gap between the grooves 112 and the ceramic insulator 2 to facilitate the release of thermal stress on the ceramic insulator 2. The housing body 1 is made of 4J29 iron-nickel-cobalt alloy material.
[0028] Reference Figure 2 Pins 4 are fixedly mounted on ceramic insulator 2. Then, multiple pins 4 and the insulator are placed in designated through holes 111. Ceramic insulator 2 is made of alumina ceramic, and the tube shell body 1 is made of 4J29 iron-nickel-cobalt alloy material. The coefficient of thermal expansion of alumina ceramic is 6.7×10⁻⁻⁻⁶. 6 At ℃⁻¹, the coefficient of thermal expansion of 4J29 iron-nickel-cobalt alloy is 5.8 × 10⁻ 6The temperature is reduced to ℃⁻¹, which ultimately makes the coefficients of thermal expansion between the tube shell body 1 and the ceramic insulator 2 close, reducing the thermal stress generated during sintering between the tube shell body 1 and the ceramic insulator 2. At the same time, the gap between the groove 112 and the ceramic insulator 2 allows some of the thermal stress between the tube shell body 1 and the ceramic insulator 2 to be released, thereby reducing the force on the ceramic insulator 2 during sintering between the tube shell body 1 and the ceramic insulator 2, and reducing the probability of cracks in the ceramic insulator 2.
[0029] Reference Figure 2 and Figure 3 The ceramic insulator 2 comprises a first ring 21 and a second ring 22 whose axes coincide. The first ring 21 is snapped into the through hole 111, thereby improving the installation accuracy between the ceramic insulator 2 and the shell body 1. The second ring 22 is set in the groove 112. The first ring 21 and the second ring 22 abut against each other and are integrally machined. Both the first ring 21 and the second ring 22 have mounting holes 23 for fixing the pins 4. The diameter of the second ring 22 is larger than the diameter of the first ring 21, where the diameter of the first ring 21 is equal to the diameter of the through hole 111. This allows the side of the second ring 22 closest to the first ring 21 to press against the bottom of the groove 112. At the same time, the diameter of the second ring 22 is smaller than the diameter of the groove 112. There is a certain gap between the outer wall of the second ring 22 and the side wall of the groove 112, so that the thermal stress generated during the sintering of the ceramic insulator 2 and the shell body 1 can be released through the gap between the second ring 22 and the groove 112, thereby reducing the probability of cracks occurring during the sintering of the ceramic insulator 2.
[0030] Reference Figure 2 Since some grooves 112 are close to each other, by connecting the adjacent grooves 112 to each other, the connection strength between the adjacent grooves 112 is improved, thereby reducing the probability of deformation of the sidewalls between the adjacent grooves 112 during sintering.
[0031] Reference Figure 3 A gasket 3 is provided on the side of the second ring 22 away from the first ring 21. The gasket 3 is sleeved on the pin 4 and pressed against the end face of the second ring 22. The gasket 3 is used to enhance the airtightness between the ceramic insulator 2 and the pin 4. The gasket 3 is made of 4J42 alloy material. In order to improve the internal structure and bonding force of the ceramic insulator 2, and ultimately improve the overall strength and sealing reliability of the ceramic insulator 2, the ceramic insulator 2 in this embodiment is made of alumina ceramic with an alumina content of more than 95%.
[0032] Reference Figure 3Pin 4 is made of 4J29 copper-clad lead material. Pin 4, made of 4J29 copper-clad lead material, can effectively meet the maximum current output of semiconductor laser. At the same time, the pressure encapsulation process between 4J29 copper-clad lead material and alumina ceramic has high stability, which makes it easier to ensure the airtightness between pin 4 and ceramic insulator 2.
[0033] Reference Figure 1 and Figure 4 The tube shell body 1 includes a base plate and a frame 12. Multiple sets of through holes 111 are provided on the base plate 11 so that multiple sets of leads are vertically arranged on the base plate 11 through ceramic insulators 2. The frame 12 is fixedly installed on the upper surface of the base plate 11. In this embodiment, the base plate 11 and the frame 12 are integrally processed. Compared with the separate base plate 11 and frame 12, the integrally processed base plate 11 and frame 12 shorten the CNC machining cycle, improve the CNC machining efficiency, and also reduce the risk of air leakage caused by the sintering of the frame 12 and the base plate 11.
[0034] Reference Figure 5 and Figure 6 A cover plate 5 is provided on the side of the frame 12 away from the base plate 11 to seal the end face of the frame 12. A protrusion 51 is provided on the side of the cover plate 5 near the frame 12. The protrusion 51 is snapped onto the inner side wall of the frame 12. The cover plate 5 is made of 4J42 alloy material, which facilitates the parallel sealing welding between the tube shell body 1 and the ceramic insulator 2 and the pin 4, and provides good sealing conditions for the airtightness of the tube shell body 1.
[0035] Reference Figure 5 and Figure 6 Before sintering, the shell body 1, leads, and gaskets 3 are machined and then ultrasonically cleaned to remove oil stains. They are then processed in a tunnel reduction furnace to enhance their oxidation and corrosion resistance. The leads 4 are then inserted into the ceramic insulator 2, with the gaskets 3 passing through the leads 4 and pressing against the end face of the ceramic insulator 2. The assembled leads 4, ceramic insulator 2, and gaskets 3 are then placed in a graphite fixture and sintered in a tunnel furnace under a nitrogen-hydrogen protective atmosphere. Brazing sintering is performed at a temperature of 800℃ and a furnace speed of 60mm / min to form lead assemblies. Multiple lead assemblies are then sequentially assembled into the shell body 1 and brazed. Ag72Cu28 solder is used for welding between the shell body 1 and the lead assemblies.
[0036] The working principle of this application embodiment is as follows: By assembling and sintering the pin 4, ceramic insulator 2, and gasket 3 into a lead assembly, and then placing multiple lead assemblies sequentially inside the casing body 1, the casing body 1 is made of 4J29 iron-nickel-cobalt alloy material with a thermal expansion coefficient close to that of the ceramic insulator 2. This reduces the thermal stress generated between the casing body 1 and the ceramic insulator 2 during sintering. At the same time, some of the thermal stress between the casing body 1 and the ceramic insulator 2 is released through the gap between the groove 112 and the ceramic insulator 2, reducing the probability of cracks appearing in the ceramic insulator 2 during the sintering of the ceramic encapsulated casing.
[0037] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A multi-pin ceramic encapsulation housing for vacuum encapsulation, comprising a housing body (1), a ceramic insulator (2), and pins (4), wherein the housing body (1) has a plurality of through holes (111), the ceramic insulator (2) is snapped into the through holes (111), and the pins (4) pass through the ceramic insulator (2) and are snapped in place, characterized in that: The shell body (1) has multiple sets of grooves (112) on one side. The grooves (112) are coaxially arranged with the corresponding through holes (111). The depth of the grooves (112) is less than the thickness of the shell body (1). There is a certain gap between the grooves (112) and the ceramic insulator (2) to facilitate the release of thermal stress on the ceramic insulator (2). The shell body (1) is made of 4J29 iron-nickel-cobalt alloy material.
2. The multi-needle ceramic package can for vacuum packaging according to claim 1, wherein: The ceramic insulator (2) includes a first ring (21) and a second ring (22) whose axes coincide. The first ring (21) is snapped into the through hole (111), and the second ring (22) is set in the groove (112). There is a certain gap between the second ring (22) and the side wall of the groove (112). The diameter of the second ring (22) is larger than the diameter of the first ring (21). The side of the second ring (22) close to the first ring (21) is pressed against the bottom of the groove (112). The first ring (21) and the second ring (22) abut against each other and are integrally processed.
3. The multi-needle ceramic package can for vacuum packaging according to claim 2, wherein: On the side of the second ring (22) away from the first ring (21), there is a gasket (3) for enhancing the airtightness between the ceramic insulator (2) and the pin (4). The gasket (3) is sleeved on the pin (4) and pressed against the end face of the second ring (22). The gasket (3) is made of 4J42 alloy material.
4. The multi-needle ceramic package can for vacuum packaging according to claim 1, wherein: The ceramic insulator (2) is made of alumina ceramic with an alumina content of more than 95%.
5. The multi-needle ceramic package can for vacuum packaging according to claim 1, wherein: The pin (4) is made of 4J29 copper-clad lead material.
6. The multi-needle ceramic package can for vacuum packaging according to claim 1, wherein: The shell body (1) includes a base plate (11) and a frame (12). Multiple sets of through holes (111) are provided on the base plate (11). The base plate (11) and the frame (12) are integrally processed.
7. A multi-needle ceramic package can for vacuum packaging according to claim 6, wherein: The frame (12) is provided with a cover plate (5) on the side away from the bottom plate (11) to seal the end face of the frame (12). The cover plate (5) is provided with a protrusion (51) on the side close to the frame (12). The protrusion (51) is snapped onto the inner side wall of the frame (12). The cover plate (5) is made of 4J42 alloy material.
8. The multi-needle ceramic package can for vacuum packaging according to claim 3, wherein: The pin (4), ceramic insulator (2) and gasket (3) are assembled and sintered to form lead wire assemblies. Multiple sets of lead wire assemblies are sequentially installed into the tube shell body (1) and welded with Ag72Cu28 solder.