一种大功率器件供电结构

By setting a detachable current-carrying unit on the other side of the PCB board, a three-dimensional power supply path is formed, which solves the problems of insufficient horizontal power supply capacity and high vertical power supply cost, and realizes an efficient and flexible power supply structure that is suitable for a variety of technical scenarios.

CN224520910UActive Publication Date: 2026-07-17XFUSION DIGITAL TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
XFUSION DIGITAL TECH CO LTD
Filing Date
2025-06-12
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In existing technologies, horizontal power supply methods are insufficient for power supply under high current, while vertical power supply methods are costly and increase the height of the single board, thus limiting the application scenarios of the chip.

Method used

By setting a detachable current-carrying unit on the other side of the PCB board, a three-dimensional power supply path is formed. The power supply and the device are electrically connected by detachable connectors and current-carrying components, forming a closed-loop power supply architecture that can adapt to different current requirements.

Benefits of technology

Without increasing the height of the single board, the power supply capacity and power density are improved, the flexibility and maintainability of the power supply system are enhanced, and costs and line losses are reduced.

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Abstract

本申请实施例提供一种大功率器件供电结构,包括第一PCB板;第一PCB板具有相对的第一表面和第二表面;设于第一表面的第一电源和第一器件;设于第二表面的第一通流单元;第一通流单元分别与第一电源、第一器件电连接,以形成使第一电源为第一器件供电的第一通流路径。本申请通过可拆卸的连接件和通流件构成通流单元,并将通流单元设置于水平供电单板的另一面,以通过通流单元提供的的新的通流路径实现电源对大功率器件的供电,使水平供电方式兼具了垂直供电的技术效果。
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Claims

1. A high power device power supply structure, characterized by, include: A first PCB board (100); the first PCB board (100) has opposing first surfaces (110) and second surfaces (120); A first power supply (200) and a first device (300) are disposed on the first surface (110); A first current-passing unit (400) is provided on the second surface (120); the first current-passing unit (400) is electrically connected to the first power supply (200) and the first device (300) respectively, so as to form a first current-passing path that enables the first power supply (200) to supply power to the first device (300).

2. The power supply structure for high power devices according to claim 1, wherein, The first flow-through unit (400) includes: A first connector (410) and a second connector (420) are disposed on the second surface (120); the first connector (410) is electrically connected to the first power supply (200); the second connector (420) is electrically connected to the first device (300); First flow passage element (430); the first flow passage element (430) is connected to the first connector (410) and the second connector (420) respectively.

3. The power supply structure for high power devices according to claim 2, wherein, The first power supply (200) includes an input port (210) and an output port (220); the first device (300) includes an input pin (310) and an output pin (320); The first flow-through unit (400) further includes: A third connector (440) and a fourth connector (450) are provided on the second surface (120); The second flow passage (460) is connected at both ends to the third connector (440) and the fourth connector (450) respectively. The first connector (410) is electrically connected to the output port (220), the second connector (420) is electrically connected to the input pin (310), the third connector (440) is electrically connected to the input port (210), and the fourth connector (450) is electrically connected to the output pin (320), so that the first power supply (200), the first current-passing element (430), the first device (300), and the second current-passing element (460) form a first current-passing loop for the first power supply (200) to power the first device (300).

4. The power supply structure for high power devices according to claim 2, wherein The first surface (110) is provided with a mounting member (500) for inserting the first device (300); the second connector (420) is electrically connected to the first device (300) through the mounting member (500).

5. The power supply structure for high power devices according to any one of claims 2 to 4, wherein, The first flow passage (430) is detachably connected to the first connector (410) and the second connector (420).

6. The power supply structure for high power devices according to claim 3, wherein The second flow passage (430) is detachably connected to the third connector (440) and the fourth connector (450).

7. The power supply structure for high power devices according to claim 5, wherein The first current-passing element (430) is a metal conductor or a cable.

8. The power supply structure for high power devices according to claim 5, wherein, The first flow-through component (430) is a second PCB board, and the second PCB board includes a filter component (431).

9. The power supply structure for high power devices according to claim 5, wherein, The first connector (410) is provided with a first latching part (411), and the second connector (420) is provided with a second latching part (421); the first flow passage member (430) is provided with a first latching part (432) for latching with the first latching part (411), and a second latching part (433) for latching with the second latching part (421).

10. The power supply structure for high-power devices according to claim 5, characterized in that, The first flow passage (430) is provided with a connecting part (4301); The first connector (410) and / or the second connector (420) include: Top connector (4101); Two elastic sheets (4102) are arranged opposite each other; one end of each elastic sheet (4102) is connected to the top connector (4101), and the other end extends away from the top connector (4101); the top connector (4101) and the two elastic sheets (4102) together form a receiving groove (4103) for the connection part (4301) to pass through; the receiving groove (4103) has a first opening (4104); when the elastic sheet (4102) is not under force, the width of the first opening (4104) is smaller than the cross-sectional diameter of the connection part (4301).

11. The power supply structure for high power devices according to claim 1, wherein, The first surface (110) is also provided with at least one second power supply (700), each of the second power supplies (700) being electrically connected to the first device (300) through a second current-passing unit (600) to form at least one second current-passing path that enables the second power supply (700) to supply power to the first device (300); the second current-passing unit (600) has the same structure as the first current-passing unit (400).