一种提升散热效果的功率模块
By combining water cooling and air cooling in the inverter power module, the problem of insufficient heat dissipation is solved, achieving stable operation under high power density and meeting the heat dissipation requirements of compact design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUA TIANXIN INTELLIGENT IOT CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
AI Technical Summary
In the process of increasing power density, the existing inverter power modules have insufficient heat dissipation, which leads to an increase in IGBT junction temperature, affecting reliability and potentially damaging the devices. At the same time, the electrical clearances and creepage distances required by safety regulations limit the increase in power density.
By combining water-cooled radiators and air-cooled heat dissipation, IGBT modules are installed on both sides of the water-cooled radiator and connected by C-shaped composite busbars. Combined with partitioned arrangement of metal film capacitors and axial flow fans, hybrid heat dissipation is achieved, enhancing the heat dissipation effect.
While increasing power density, it effectively reduces the temperature of IGBT modules, ensuring stable device operation, meeting the heat dissipation requirements of compact design, and ensuring efficient operation of power modules.
Smart Images
Figure CN224520921U_ABST
Abstract
Claims
1. A power module with improved heat dissipation, comprising a box (1), a metal film capacitor, an IGBT module (3), characterized in that: The housing (1) is equipped with a water-cooled radiator (4), and multiple IGBT modules (3) are respectively installed on two sides of the water-cooled radiator (4). The IGBT modules (3) located on the two sides and corresponding positions are electrically connected to each other through a composite busbar (5) with a C-shaped structure. The enclosure (1) is also provided with a mounting plate (6) located on one side of the water-cooled radiator (4). A plurality of metal film capacitor arrays are arranged on the mounting plate (6). The plurality of metal film capacitors are divided into a first array group and a second array group. The conductive end of the first array group is connected to a first capacitor busbar (7). The conductive end of the second array group is connected to a second capacitor busbar (8). The first capacitor busbar (7) and the second capacitor busbar (8) are electrically connected. The second capacitor busbar (8) is electrically connected to the IGBT module (3) located on the first side of the water-cooled radiator (4). A busbar (9) is connected between every two IGBT modules (3) located on the second side of the water-cooled radiator (4). Each busbar (9) is connected to an AC copper busbar (10). The first capacitor busbar (7) is connected to a DC copper busbar (11) through a filter magnetic ring (12); The housing (1) is provided with an air inlet (13) on the side of the AC copper busbar (10) and an air outlet (14) on the side of the DC copper busbar (11). An axial flow fan (15) is installed inside the housing (1) at the air inlet (13).
2. The power module of claim 1, wherein: The IGBT module (3) located on the first side of the water-cooled radiator (4) is provided with a first circuit board, on which multiple absorption capacitors (16) are integrated. The first circuit board is electrically connected to the second capacitor busbar (8).
3. The power module of claim 2, wherein: The AC copper busbar (10) is equipped with a current sampling module (17).
4. The power module of claim 3, wherein: The power module (18) located on one side of the busbar (9) is installed inside the enclosure (1).
5. The power module of claim 4, wherein: An insulating film is pasted on the inner side of the box (1) at the location corresponding to the live device.
6. The power module of claim 5, wherein: At least the first capacitor busbar (7), the second capacitor busbar (8), the busbar (9), the AC copper busbar (10), and the DC copper busbar (11) are provided with heat shrink tubing or surface plastic coating.
7. The power module of any one of claims 1-6, wherein: Both the air inlet (13) and the air outlet (14) are provided with a honeycomb structure.
8. The power module of claim 7, wherein: The terminals of the AC copper busbar (10) and the DC copper busbar (11) both extend out of the housing (1).
9. The power module of claim 8, wherein: A waterproof cable connector (19) is installed on the housing (1) on one side of the air inlet (13).
10. The power module of claim 9, wherein: Two handles (20) are provided on each side of the box (1) at intervals, and the handles (20) are rotatably mounted on the box (1).