A glass passivation chip three-phase rectifier bridge

Abstract

This invention addresses the inconvenience of combining single-arm rectifier bridges when operating at high power in existing glass-passivated chip rectifier bridges. It provides a glass-passivated chip three-phase rectifier bridge, comprising glass-passivated diode chips, a ceramic copper-clad laminate, a base plate, and connecting bridges. The number of ceramic copper-clad laminates corresponds to the number of diode chips, and the area of ​​the ceramic copper-clad laminate is slightly larger than the bonding area of ​​the diode chips. One side of the ceramic copper-clad laminate is bonded to the base plate, and the other side is bonded to the diode chips. Connecting bridges are positioned between the corresponding diode chips and the ceramic copper-clad laminates. The structure is simple and easy to use.

Description

Technical Field

[0001] This utility model relates to the field of rectifier bridge technology, and in particular to a glass passivation chip three-phase rectifier bridge. Background Technology

[0002] Most current three-phase rectifier bridges employ a method of soldering single or multiple ceramic copper-clad laminates (CCLs) to diode chips, as illustrated in patent CN211046787U. With advancements in chip technology, glass passivated chips (GCLs), also known as glass passivated chips, have emerged. These are diode chips that utilize glass passivation technology to protect the PN junction, offering advantages such as strong corrosion resistance and long service life. However, the glass film covering the GCL is physically brittle and has poor deformation resistance. The CCL soldered to it deforms with temperature changes under high current and high heat generation conditions. The presence of the glass film limits the area of ​​the CCL and the current it can carry, meaning a single CCL can only support a limited number of GCLs, typically forming a single-arm rectifier bridge structure. Therefore, in traditional GCL three-phase rectifier bridge structures, achieving higher output current requires combining three or more single-arm rectifier bridges to achieve the rectification goal. However, this combination process involves wiring between different single-arm rectifier bridges, which is cumbersome, inconvenient, and increases connection uncertainty. Therefore, a three-phase rectifier bridge with passivated glass chips that is easy to use and requires no additional wiring is needed. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies and provide a glass passivation chip three-phase rectifier bridge.

[0004] To solve the above problems, the present invention adopts the following solution: A glass-passivated three-phase rectifier bridge includes glass-passivated diode chips, a ceramic copper-clad laminate, a base plate, and a connecting bridge. The number of ceramic copper-clad laminates corresponds to the number of diode chips, and the area of ​​the ceramic copper-clad laminate is slightly larger than the bonding area of ​​the diode chips. One side of the ceramic copper-clad laminate is bonded to the base plate, and the other side of the ceramic copper-clad laminate is bonded to the diode chips. The connecting bridge is disposed between the corresponding diode chips and the ceramic copper-clad laminate.

[0005] Furthermore, the ceramic copper-clad laminate is welded to the base plate; the ceramic copper-clad laminate is also welded to the diode chip.

[0006] Furthermore, the base plate is provided with six ceramic copper-clad plates, and six diode chips are correspondingly provided thereon.

[0007] Furthermore, the ceramic copper-clad plates are arranged in a 2*3 structure on the base plate.

[0008] Furthermore, the A-terminals of the three diode chips corresponding to the negative electrode output in the three-phase rectifier bridge are respectively connected to three islands set on the ceramic copper-clad plate through connecting bridges. These three islands, after being connected by connecting bridges, serve as the negative electrode output of the three-phase rectifier bridge.

[0009] Furthermore, the K-terminals of the three diode chips corresponding to the positive electrode output in the three-phase rectifier bridge are connected by a connecting bridge, and the connection serves as the positive electrode output of the three-phase rectifier bridge.

[0010] Furthermore, the diode chip has its K-terminal facing downwards and is bonded to the ceramic copper-clad laminate, while its A-terminal faces upwards.

[0011] Furthermore, a molybdenum sheet is also provided between the diode chip and the bridge.

[0012] Furthermore, it also includes electrodes, which are disposed on the corresponding ceramic copper-clad plate and connected to the diode chip; the electrodes are used to connect to external circuits.

[0013] Furthermore, it also includes a plastic housing, which is fixedly placed above the base, enclosing the ceramic copper-clad plate and diode chip on the base; the electrodes penetrate the plastic housing and are exposed on the outside of the plastic housing.

[0014] The beneficial effects of this utility model are as follows: By setting up ceramic copper-clad plates that correspond one-to-one with the passivated diode chips, and combining them with bridges, different diode chips can be connected. This ensures that the small-area ceramic copper-clad plates have minimal deformation under high current and high heat, preventing damage to the surface of the passivated chips. It is also convenient to use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of Example 1; Figure 2 This is a schematic diagram of removing the plastic outer shell in Example 1; Figure 3 This is a top view of Example 1 after the plastic shell has been removed; Figure 4 This is a schematic diagram of the explosive separation of the structure on the base plate of Example 1.

[0016] Figure labeling: 1. Diode chip; 2. Ceramic copper-clad laminate; 3. Base plate; 4. Connecting bridge; 5. Molybdenum sheet; 6. Island; 7. Electrode; 7. AC electrode R; 71. AC electrode S; 72. AC electrode T; 73. Positive electrode; 74. Negative electrode; 75. Plastic casing; 8. Detailed Implementation

[0017] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0018] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the figures only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0019] Example 1: like Figures 1-4 As shown, a glass-passivated chip three-phase rectifier bridge includes glass-passivated diode chips 1, a ceramic copper-clad laminate 2, a base plate 3, and a connecting bridge 4. The number of ceramic copper-clad laminates 2 corresponds to the number of diode chips 1. In this example, there are six ceramic copper-clad laminates 2 and six diode chips 1. The area of ​​the ceramic copper-clad laminate 2 is larger than the bonding area of ​​the diode chips 1, so that the diode chips 1 can be fully bonded to the ceramic copper-clad laminate 2, forming a stable electrical connection between the two. One side of the ceramic copper-clad laminate 2 is bonded to the base plate 3, and the other side of the ceramic copper-clad laminate 2 is bonded to the diode chips 1. In this example, both sides of the ceramic copper-clad laminate 2 are welded to the base plate 3 and the diode chips 1, respectively. The connecting bridge 4 is disposed between the corresponding diode chips 1 and the ceramic copper-clad laminate 2, and is used to combine the six diode chips 1 to form a three-phase rectifier bridge structure.

[0020] It also includes an electrode 7, which is disposed on the corresponding ceramic copper-clad plate 2 and connected to the diode chip 1; the electrode 7 is used to connect to the external circuit; specifically, it includes three input electrodes 7, AC electrode R71, AC electrode S72 and AC electrode T73, and two output electrodes 7, positive electrode 74 and negative electrode 75.

[0021] The ceramic copper-clad laminate 2 is arranged in a 2*3 structure on the base plate 3, with the K-terminal of the diode chip 1 facing downwards and attached to the ceramic copper-clad laminate 2, and the A-terminal facing upwards. In this example, combined with the attached... Figure 3The contents shown are arranged from top to bottom and from right to left, and are labeled as No. 1, No. 2, No. 3, No. 4, No. 5, and No. 6 respectively. Among the three input electrodes 7, the AC electrode R71 is soldered to the No. 2 ceramic copper-clad plate 2, and the K electrode of the No. 2 diode chip 1 is also soldered to the No. 2 ceramic copper-clad plate 2, thus connecting with the AC electrode R71. The K electrode of the No. 1 diode chip 1 is soldered to the No. 1 ceramic copper-clad plate 2, and the A electrode of the No. 1 diode chip 1 is connected to the No. 2 ceramic copper-clad plate 2 through the bridge 4. Similarly, the ceramic copper-clad plates 2 and diode chips 1 at positions 3 and 4, and positions 5 and 6 are connected to the AC electrode S72 and the AC electrode T73 respectively. Furthermore, the A-pole of the three diode chips 1 corresponding to the negative electrode 75 output in the three-phase rectifier bridge is connected to the three islands 6 set on the ceramic copper-clad plate 2 through the connecting bridge 4. These three islands 6, after being connected by the connecting bridge 4, serve as the negative electrode output of the three-phase rectifier bridge. In this example, they are the diode chips 1 corresponding to positions 2, 4, and 6. It should be noted that the islands 6 and the corresponding diode chips 1 are located on the same ceramic base plate of the ceramic copper-clad plate 2, saving space. The K-pole of the three diode chips 1 corresponding to the positive electrode 74 output in the three-phase rectifier bridge is connected by the connecting bridge 4. After being connected, they serve as the positive electrode output of the three-phase rectifier bridge. In this example, they are the diode chips 1 corresponding to positions 1, 3, and 5.

[0022] A molybdenum sheet 5 is also provided between the diode chip 1 and the bridge 4 to maintain a stable connection between the bridge 4 and the diode chip 1.

[0023] It also includes a plastic housing 8, which is fixedly covered above the base, enclosing the ceramic copper-clad plate 2 and the diode chip 1 on the base; the electrode 7 penetrates the plastic housing 8 and is exposed on the outside of the plastic housing 8.

[0024] During implementation, ceramic copper-clad plates 2 are set up to correspond one-to-one with the passivated diode chips 1. In addition, bridges 4 are used to connect different diode chips 1. On the one hand, the small-area ceramic copper-clad plates 2 have small deformation under high current and high heat, and will not damage the surface of the passivated chips. On the other hand, it is convenient to use, and can achieve rectification effect by directly connecting to the circuit without the need for combination connection.

[0025] The above description is merely a specific example of this utility model and does not constitute any limitation on this utility model. Obviously, those skilled in the art, after understanding the content and principle of this utility model, may make various modifications and changes in form and details without departing from the principle and structure of this utility model. However, these modifications and changes based on the concept of this utility model are still within the protection scope of the claims of this utility model.

Claims

1. A glass passivated chip three-phase rectifier bridge comprising a glass passivated diode chip (1), characterized in that, It also includes a ceramic copper-clad laminate (2), a base plate (3), and a connecting bridge (4); wherein the number of ceramic copper-clad laminates (2) corresponds to the number of diode chips (1), and the area of ​​the ceramic copper-clad laminate (2) is larger than the bonding area of ​​the diode chip (1); one side of the ceramic copper-clad laminate (2) is bonded to the base plate (3), and the other side of the ceramic copper-clad laminate (2) is bonded to the diode chip (1); the connecting bridge (4) is disposed between the corresponding diode chip (1) and the ceramic copper-clad laminate (2).

2. A glass passivated chip three-phase rectifier bridge according to claim 1, characterized in that The ceramic copper-clad plate (2) is welded to the base plate (3); the ceramic copper-clad plate (2) is also welded to the diode chip (1).

3. The glass passivation chip three-phase rectifier bridge according to claim 1, characterized in that, The base plate (3) is provided with six ceramic copper-clad plates (2), and six diode chips (1) are provided accordingly.

4. A glass passivated chip three-phase rectifier bridge according to claim 3, characterized in that The ceramic copper-clad plate (2) is arranged in a 2*3 structure on the base plate (3).

5. A glass passivated chip three-phase rectifier bridge according to claim 4, characterized in that The A-pole of the three diode chips (1) corresponding to the negative electrode output in the three-phase rectifier bridge is connected to the three islands (6) set on the base plate (3) through the connecting bridge (4). The three islands (6) are connected by the connecting bridge (4) and serve as the negative electrode output of the three-phase rectifier bridge.

6. A glass passivated chip three-phase rectifier bridge according to claim 5, characterized in that The K-terminals of the three diode chips (1) corresponding to the positive electrode output in the three-phase rectifier bridge are connected by a connecting bridge (4) and then used as the positive electrode output of the three-phase rectifier bridge.

7. A glass passivated chip three-phase rectifier bridge according to claim 6, characterized in that The diode chip (1) has its K-pole facing down and is bonded to the ceramic copper-clad plate (2), while its A-pole faces up.

8. The glass passivation chip three-phase rectifier bridge according to claim 1, characterized in that, A molybdenum sheet (5) is also provided between the diode chip (1) and the bridge (4).

9. The glass passivation chip three-phase rectifier bridge according to claim 1, characterized in that, It also includes an electrode (7), which is disposed on the corresponding ceramic copper-clad plate (2) and connected to the diode chip (1); the electrode (7) is used to connect to the external circuit.

10. A glass passivated chip three-phase rectifier bridge according to claim 9, characterized in that It also includes a plastic housing (8), which is fixedly covered above the base, enclosing the ceramic copper-clad plate (2) and the diode chip (1) on the base; the electrode (7) penetrates the plastic housing and is exposed on the outside of the plastic housing (8).

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