发射机及卫星通信设备
By detecting the internal temperature of the transmitter and adjusting the fan speed, the static current of the high-power amplifier was stabilized, solving the problem of unstable transmitter performance at different temperatures and improving the quality of satellite communication.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WAVELAB TELECOM EQUIP (GZ) LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
Smart Images
Figure CN224521046U_ABST
Abstract
Claims
1. A transmitter, characterized by Includes a power amplifier unit, a microcontroller unit, a temperature sensor, and a fan; The power amplification unit includes a drive module, an attenuation module, a filter module, and a high-power amplifier. The output terminal of the drive module is connected to the input terminal of the attenuation module, the output terminal of the attenuation module is connected to the input terminal of the filter module, the output terminal of the filter module is connected to the input terminal of the high-power amplifier, the control terminal of the high-power amplifier is connected to the signal output terminal of the microcontroller unit, and the output terminal of the high-power amplifier is used to output the signal after signal processing. The microcontroller unit is connected to the control terminal of the high-power amplifier and provides the gate voltage to the high-power amplifier. The microcontroller unit is electrically connected to the temperature sensor and the fan. The microcontroller unit is used to collect the internal temperature of the transmitter through the temperature sensor. The fan is used to adjust its speed according to the control signal output by the microcontroller unit to adjust the temperature of the high-power amplifier of the transmitter.
2. The transmitter of claim 1, characterized in that The driving module includes an isolator, a first attenuator, a driving amplifier, and an equalizer. The output of the isolator is connected to the input of the first attenuator, the output of the first attenuator is connected to the input of the driving amplifier, the output of the driving amplifier is connected to the input of the equalizer, and the output of the equalizer is connected to the input of the attenuation module.
3. The transmitter of claim 2, characterized in that The driving module further includes a π-type attenuator, the input of which is connected to the output of the isolator, and the output of which is connected to the input of the first attenuator.
4. The transmitter of claim 1 or 2, characterized by The attenuation module includes a second attenuator, the input of which is connected to the output of the driving module, and the output of which is connected to the input of the filtering module.
5. The transmitter of claim 1, wherein, The filtering module includes a bandpass filter, the input of which is connected to the output of the attenuation module, and the output of which is connected to the input of the high-power amplifier.
6. The transmitter of claim 1 or 2, characterized by It also includes a heat dissipation substrate and multiple heat sinks. The power amplifier unit, the microcontroller unit and the temperature sensor are all disposed on the first side of the heat dissipation substrate. The multiple heat sinks are respectively disposed on the second side of the heat dissipation substrate. The second side is the side of the heat dissipation substrate opposite to the first side. The multiple heat sinks are used to form multiple ventilation channels on the second side of the heat dissipation substrate. The fan is located on one side of the heat sink and is used to blow air into the ventilation channels.
7. The transmitter of claim 6, characterized in that Multiple fans are provided, and the multiple fans are arranged side by side on one side of the heat sink corresponding to the microcontroller unit, and the height of the multiple heat sinks is adapted to the height of the fans.
8. The transmitter of claim 7, characterized in that The spacing between the multiple heat sinks is greater than or equal to 3 mm.
9. The transmitter of claim 6 or 7, characterized by An indium sheet is disposed between the high-power amplifier and the heat dissipation substrate, with the high-power amplifier and the heat dissipation substrate respectively attached to both sides of the indium sheet. The indium sheet is used to transfer the heat from the high-power amplifier to the heat dissipation substrate.
10. A satellite communication device, characterized by Includes the transmitter as described in any one of claims 1-9.