一种板式连接件以及使用该连接件的手机后盖
By using plate-type connectors in electronic terminals and utilizing a combination of graphite films and microcapsule layers, the problems of uneven heat dissipation and overheating in electronic terminals have been solved, improving user experience and device lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 合肥金龙浩科技有限公司
- Filing Date
- 2025-09-01
- Publication Date
- 2026-07-17
AI Technical Summary
Electronic terminals often suffer from problems such as overheating, uneven heat dissipation, and lag when in standby mode, which leads to a reduced user experience and a shortened lifespan.
The device employs plate-type connectors, including a carrier and a heat treatment medium. The carrier has a storage space, and the heat treatment medium, such as graphite films and microcapsule layers, is used to absorb and dissipate heat, combined with phase change materials for heat dissipation management.
It improves the heat dissipation of electronic terminals, enhances the user experience, and extends their service life.
Smart Images
Figure CN224521073U_ABST
Abstract
Claims
1. A plate-type connection for transferring heat from an electronic terminal heat source, characterized in that, It includes a carrier and a heat treatment medium. The carrier can be installed adjacent to the terminal heat source. The carrier has a storage space (4), and the heat treatment medium is encapsulated in the storage space (4).
2. The panel connector according to claim 1, wherein The carrier specifically includes: a first substrate (1) and a second substrate (2). The first substrate (1) and the second substrate (2) are arranged in parallel and spaced apart, and a third adhesive layer (3) arranged in a ring between the first substrate (1) and the second substrate (2) encapsulates a storage space (4).
3. The panel connector according to claim 2, wherein The heat treatment medium encapsulated in the storage space (4) is specifically graphite, and the graphite encapsulated in the storage space (4) forms a graphite film (5).
4. The panel connector according to claim 3, wherein The graphite film (5) is bonded to the first substrate (1) through the first adhesive layer (6), and the graphite film (5) is bonded to the second substrate (2) through the second adhesive layer (7).
5. The panel connector of claim 3, wherein The first substrate (1) is a transparent layer, and there is an ink layer (8) between the first substrate (1) and the graphite film (5). The first substrate (1) has a transfer texture layer (9) on the side away from the graphite film (5).
6. The panel connector of claim 2, wherein The storage space (4) contains a microcapsule layer (10), and the microcapsule layer (10) contains microcapsules. The microcapsules are filled with a phase change material as a heat treatment medium. Preferably, the microcapsule layer (10) is formed by stacking multiple microcapsule unit layers (101) layer by layer. The microcapsule layer (10) is attached to the first substrate (1) or the second substrate (2). Preferably, the multiple microcapsule unit layers (101) are stacked layer by layer through printing process / coating process / adhesive process / spraying process to form the microcapsule layer (10). Preferably, the microcapsule layer (10) is attached to the first substrate (1) or the second substrate (2) through printing process / coating process / adhesive process / spraying process.
7. The panel connector of claim 2, wherein The storage space (4) contains a plurality of microcapsule unit layers (101) and a plurality of graphite unit layers (11) that fill the storage space (4). The microcapsules in the microcapsule unit layers (101) are filled with a phase change material as one of the heat treatment media. The plurality of graphite unit layers (11) have a plurality of graphite unit layers (11) that are connected in sequence as one of the heat treatment media. One of the plurality of graphite unit layers (11) is attached to the first substrate (1), and one of the plurality of graphite unit layers (11) is attached to the second substrate (2).
8. The panel connector according to claim 7, wherein Part of the microcapsule unit layer (101) is attached to the first substrate (1) / second substrate (2).
9. The panel connector according to claim 8, wherein The remaining microcapsule unit layer (101) is attached to the adjacent microcapsule unit layer (101).
10. A mobile phone back cover characterized in that, It includes a glass cover plate and a plate connector as described in any one of claims 1-9, wherein the plate connector is bonded to the glass cover plate.