An integrated depth camera

Abstract

This application provides an integrated depth camera, comprising: a head assembly for projecting a structured light pattern beam onto a measured object and receiving the beam reflected back from the measured object to generate a structured light image; a processing assembly for processing the structured light image to acquire three-dimensional information of the measured object; and a housing comprising a front shell, a middle shell, and a rear shell arranged sequentially along a first direction, the first direction being parallel to the light emission direction of the structured light pattern beam projected by the head assembly onto the measured object; the middle shell comprising a first surface and a second surface arranged opposite to each other along the first direction; the inner surface of the front shell and the first surface forming a first receiving cavity for mounting the head assembly, and the inner surface of the rear shell and the second surface forming a second receiving cavity for mounting the processing assembly. This depth camera features an integrated structural design, is small in size, and is easy to install.

Description

Technical Field

[0001] This application relates to the field of camera technology, specifically to an integrated depth camera. Background Technology

[0002] Current depth camera architecture exhibits significant functional segmentation, with its core capabilities limited to depth image acquisition, unable to directly perform key image processing tasks such as feature extraction, dynamic analysis, and accuracy optimization. To enable downstream applications like action recognition and anomaly detection, it's essential to rely on "edge computing boxes" as complementary devices—these devices handle the core tasks of image processing and algorithm execution, forming a "split-type depth camera." While the split-type depth camera architecture allows for further processing of images acquired by the depth camera to meet downstream application needs, the independent structure of the depth camera and edge box leads to a significant increase in overall size, making it difficult to meet the requirements of miniaturization scenarios. Furthermore, the cost of carrying and transporting the split device increases significantly, directly limiting the expansion of application flexibility.

[0003] Therefore, developing a small, easy-to-install integrated depth camera has become an urgent problem to be solved. Utility Model Content

[0004] This application provides an integrated depth camera that is compact, small in size, and easy to install.

[0005] In a first aspect, an integrated depth camera is provided, comprising: a head assembly for projecting a structured light pattern beam onto a measured object and receiving the structured light pattern beam reflected back from the measured object to generate a structured light image; a processing assembly for processing the structured light image to obtain three-dimensional information of the measured object; and a housing comprising a front housing, a middle housing, and a rear housing arranged sequentially along a first direction, the first direction being parallel to the light emission direction of the structured light pattern beam projected by the head assembly onto the measured object; the head assembly and the processing assembly are respectively mounted on the front housing and the rear housing, and the middle housing is used to separate the head assembly and the processing assembly.

[0006] In the above implementation, by placing the head assembly in the first receiving cavity enclosed by the front and middle shells, and the processing assembly in the second receiving cavity enclosed by the middle and rear shells, the depth camera housing can simultaneously include both the head assembly and the processing assembly, enabling comprehensive implementation of key image processing tasks including depth image acquisition, feature extraction, dynamic analysis, and accuracy optimization. Furthermore, the middle shell can separate the head assembly and the processing assembly, achieving heat insulation. The depth camera designed above adopts a three-section integrated structure, resulting in a compact arrangement of components, reducing the depth camera's size, improving installation efficiency, and allowing heat from the head assembly and processing assembly to be transferred to the middle shell for improved heat dissipation.

[0007] In some implementations, the middle shell includes a side parallel to the first direction, with a perforated structure on the side for heat dissipation; and / or, the side has a non-perforated structure, through which the connecting line between the head assembly and the processing assembly passes.

[0008] In the above implementation, the heat generated during operation of the head assembly in the first receiving cavity and the processing assembly in the second receiving cavity can be transferred to the middle shell. By providing a perforated structure on the side of the middle shell, air can flow between the perforations to carry away heat, which is beneficial for further heat dissipation of the head assembly and processing assembly, improving the heat dissipation performance of the depth camera. The side of the middle shell may also include perforated and non-perforated structures. The non-perforated structure is used to protect the connection lines between the head assembly and the processing assembly; alternatively, the non-perforated structure includes through holes penetrating the front shell, middle shell, and rear shell to achieve through-hole fixation and integrated installation of the three components.

[0009] In some implementations, the front shell, middle shell, and rear shell of the depth camera are provided with through mounting holes along a first direction in the height direction. The depth camera also includes mounting posts for passing through the mounting holes to fix the front shell, middle shell, and rear shell together.

[0010] In the above implementation, the front shell, middle shell and rear shell are provided with mutually cooperating through holes, and can be fixed by mounting posts, thereby improving the overall installation efficiency.

[0011] In some implementations, the head assembly includes a projection module for emitting a structured light pattern beam toward the object under test and an acquisition module for acquiring the structured light pattern beam reflected back from the object under test and generating a structured light image; the processing assembly includes a computing board module and a main board module, the computing board module is used to receive the structured light image generated by the acquisition module and perform depth calculation to obtain a depth image of the object under test; the main board module is electrically connected to the computing board module and is used to process the depth image to obtain point cloud data and / or a three-dimensional model of the object under test.

[0012] In the above implementation, the head unit includes a projection module and a acquisition module. The projection module is used to emit a structured light pattern beam to the object under test, and the acquisition module is used to acquire the structured light beam reflected back by the object under test and generate a structured light image. The processing components in the second cavity include a computing board assembly and a motherboard assembly, both of which are located in the second cavity, which can reduce the size of the depth camera.

[0013] In some implementations, the processing component also includes a power board module, which is located between the computing board module and the motherboard module. The power board module is electrically connected to the motherboard module and is used to supply power to the motherboard module. The power board module is also used to indirectly supply power to the computing board module through the motherboard module. The computing board module is electrically connected to the head unit, and the power board module is also used to indirectly supply power to the head unit through the computing board module.

[0014] In some implementations, both the computing board module and the power board module are equipped with test interfaces, which are Type-C interfaces used to connect to external test equipment.

[0015] In some implementations, the power board module is provided with power supply and data transmission interfaces; and / or, the power board module is provided with an M12 X-coded interface and an M12A-coded interface as power supply and data transmission interfaces. The M12 X-coded interface supports PoE power supply and data transmission, and the M12 A-coded interface supports DC power supply and RS-485 serial communication. The power supply and data transmission interfaces are used to connect to external devices, which are used to provide power to the depth camera and / or to perform data transmission interaction with the depth camera.

[0016] In the above implementation, the power board assembly highly integrates complex network ports, power ports, etc., improving the integration of internal components of the depth camera and further compressing the internal space requirements to achieve a smaller overall size.

[0017] In some implementations, the power supply and data transmission interface is provided with a spring that contacts the rear housing. When the connecting cable used to connect to the external device is inserted into the power supply and data transmission interface, the spring undergoes elastic deformation, thereby contacting the rear housing; and / or, the rear housing is provided with a through hole corresponding to the power supply and data transmission interface, so that the power supply and data transmission interface can pass through the through hole to connect to the external device. The through hole is a screw hole, and the through hole port is provided with a removable waterproof cover.

[0018] In the above implementation, the power supply and data transmission interfaces are electrically connected to the rear shell through a spring contact to achieve grounding and ensure electrical safety; a waterproof cover is installed at the through-hole port to improve the waterproof performance of the depth camera.

[0019] In some implementations, the depth camera also includes a heat sink located between the power board module and the computing board module. The heat sink has a first end and a second end disposed opposite to each other along the second direction. The first end is bent toward the power board module and is fixedly connected to the power board module. The second end has at least one column for supporting the computing board module so that the heat from the computing board module can be transferred to the heat sink through the column. The second direction is perpendicular to the first direction.

[0020] In some implementations, the depth camera also includes an LED assembly with a light-diffusing plate on the light-emitting side; and / or, the depth camera includes a shock-absorbing sleeve disposed between the head assembly and the inner side of the front housing to reduce the impact of depth camera shake on the head assembly.

[0021] In the above implementation, the LED component is used to indicate the working status of the depth camera, ensuring that the user can use the depth camera normally and improving the user experience; a shock-absorbing rubber sleeve is provided between the head assembly and the front shell, which gives the depth camera good shock resistance and helps to improve the image accuracy of the product.

[0022] In some implementations, the depth camera includes at least two waterproof rings, with a portion of the two waterproof rings located at a first connection between the front shell and the middle shell, and another portion located at a second connection between the rear shell and the middle shell, to prevent moisture from entering the interior of the depth camera through gaps at the first connection and / or the second connection.

[0023] In the above implementation, a waterproof ring is provided between the front shell and the middle shell, and a waterproof ring is also provided between the middle shell and the rear shell. By adopting a double waterproof ring design, an IP67 waterproof effect can be achieved.

[0024] In some implementations, the depth camera also includes at least one heat sink located on the side of the head assembly and connected between the head assembly and the middle shell. That is, one end of the heat sink is connected to the head assembly, and the other end of the heat sink overlaps the middle shell to transfer the heat generated by the head assembly during operation to the middle shell for heat dissipation.

[0025] In the above implementation, the heat dissipation performance of the depth camera is improved by using components such as heat sinks and radiators, where the heat sinks and radiators are made of materials with high thermal conductivity. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a depth camera provided in some embodiments of this application.

[0027] Figure 2 This is a schematic diagram of the structure of the shell provided in some embodiments of this application.

[0028] Figure 3 This is a schematic diagram of the structure of the head assembly provided in some embodiments of this application.

[0029] Figure 4 This is a schematic diagram of the front shell structure provided in some embodiments of this application.

[0030] Figure 5 This is a schematic exploded view of a depth camera provided in some embodiments of this application.

[0031] Figure 6 This is a schematic exploded view of the partial structure of a depth camera provided in some embodiments of this application.

[0032] Figure 7 This is a schematic diagram of the structure of the back cover provided in some embodiments of this application.

[0033] Figure 8 This is a schematic diagram of the structure of a heat sink provided in some embodiments of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] Depth camera: 1. Housing; 2. Head assembly; 3. Processing assembly; 4. LED assembly; 5. Mounting post; 6. Heat sink; 7. Shock-absorbing rubber sleeve; 8. Waterproof ring; 9. Heat sink; 10. First flexible circuit board; 11. Second flexible circuit board;

[0036] Shell 1: Front shell 12, middle shell 13, rear shell 14;

[0037] Front shell 12: First light-transmitting hole 120, second light-transmitting hole 121;

[0038] Middle shell 13: First surface 130, second surface 131 and side surface 132;

[0039] Back cover 14: through hole 140, waterproof cover 141, step 142;

[0040] Side view 132: Openwork structure 1320, non-openwork structure 1321;

[0041] Head unit 2: Projection module 20, acquisition module 21, single-point laser ranging module 22;

[0042] Acquisition module 21: Infrared camera 210, color camera 211;

[0043] Processing component 3: computing board module 30, motherboard module 31, power board module 32;

[0044] Computing board module 30: First test interface 300;

[0045] Power board module 32: Industrial-grade power supply and data transmission interface 320, spring contact 321, second test interface 322;

[0046] LED component 4: Light diffuser 41;

[0047] Radiator 6: First end 60, connecting structure 601, second end 61, column 610;

[0048] Heat sink 9: Flat area 90, bending area 91. Detailed Implementation

[0049] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0050] In the description of the embodiments in this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. In this application, "at least one" means one or more, and "more" means two or more.

[0051] The use of prefixes such as "first" and "second" in this application embodiment is solely for distinguishing different descriptive objects and does not limit the position, order, priority, quantity, or content of the described objects. The use of ordinal numbers and other prefixes to distinguish descriptive objects in this application embodiment does not constitute a limitation on the described objects. The description of the described objects is found in the claims or the context of the embodiments, and the use of such prefixes should not constitute unnecessary restrictions.

[0052] To keep the drawings concise, the figures in this application only schematically show the parts related to the corresponding embodiments, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, some figures only schematically show some structures or components, and there may actually be more or fewer identical or similar structures or components.

[0053] In some related technologies, traditional binocular structured light cameras have low waterproof ratings, which cannot meet the requirements of current application scenarios. While existing depth cameras meet waterproof requirements, their processing components generate a lot of heat during operation, resulting in poor heat dissipation. Although split-type depth cameras solve the heat dissipation problem, they also bring problems such as large size and inconvenient installation, making it difficult to meet current needs. Based on this, this application provides an integrated depth camera to reduce size, facilitate installation, and simultaneously meet the application requirements of various scenarios such as heat dissipation and waterproofing.

[0054] Figure 1 This is a schematic diagram of the structure of an integrated depth camera provided in some embodiments of this application. In some embodiments, such as Figure 1 As shown, the depth camera provided in this application embodiment includes a housing 1, a head assembly, and a processing assembly. The housing 1 has a receiving cavity for installing the head assembly and the processing assembly. The head assembly is used to project a structured light pattern beam onto the object under test and receive the beam reflected back from the object under test to generate a structured light image. The processing assembly is used to process the structured light image to obtain the three-dimensional information of the object under test. The three-dimensional information includes one or more combinations of depth image, point cloud data, and / or three-dimensional model.

[0055] The housing 1 adopts a three-section design, including a front housing 12, a middle housing 13, and a rear housing 14 arranged sequentially along a first direction. This first direction is parallel to the light output direction (z-direction) of the structured light pattern beam projected onto the object by the head assembly. The head assembly and the processing assembly are respectively mounted on the front housing 12 and the rear housing 14, with the middle housing 13 separating the head assembly and the processing assembly. For example, as shown... Figure 1 and Figure 2 , Figure 2 The diagram below illustrates the structure of the middle shell 13 according to some embodiments of this application. The middle shell 13 has a first surface 130 and a second surface 131 disposed opposite each other in a first direction. The first surface 130 and the inner surface of the front shell 12 form a first receiving cavity for mounting the head assembly. The rear shell 14 and the second surface 131 form a second receiving cavity for mounting the processing assembly. It is understood that the first surface 130 is located at the end of the middle shell 13 near the front shell 12, and the second surface 131 is located at the end of the middle shell 13 near the rear shell 14. The first surface 130 and / or the second surface 131 can be continuous planes or planes with notches, and can be flexibly designed as needed.

[0056] Through the above embodiments, the depth camera provided in this application adopts a three-section integrated structure, which makes the components compact, thereby reducing the size of the depth camera, improving installation efficiency, and improving heat dissipation performance by transferring heat to the middle shell.

[0057] like Figure 2 As shown, the middle shell 13 also includes a side 132 perpendicular to the first surface 130 and the second surface 131, that is, a side 132 perpendicular to the first direction. The side 132 connects the first surface 130 and the second surface 131. The side 132 is provided with a hollow structure 1320 for heat dissipation of the head assembly and the processing assembly.

[0058] Specifically, the hollow structure 1320 on the side 132 allows the heat generated by the machine head assembly installed in the first receiving cavity and the processing assembly in the second receiving cavity during operation to be conducted to the first surface 130 and the second surface 131 respectively, and dissipated through the hollow structure 1320.

[0059] Optionally, the perforated structure 1320 can be an array of rectangular perforated structures or a honeycomb perforated structure, such as... Figure 2 In the middle shell 13 shown, the hollow structure 1320 on the side 132 is an array of rectangular hollow structures. In this application, the shape of the hollow structure 1320 is not limited.

[0060] In the above embodiments, the middle shell 13 is provided with a first surface 130 and a second surface 131, which together with the front shell 12 and the rear shell 14 form a first receiving cavity and a second receiving cavity, respectively, which can separate the head assembly and the processing assembly to achieve heat insulation; and by providing a hollow structure 1320 on the first side of the middle shell 13, air can flow between the hollow structures 1320, which is beneficial to further heat dissipation of the head assembly 2 and the processing assembly 3.

[0061] In some embodiments, the side 132 of the middle shell 13 further includes a non-perforated structure 1321, which is used to protect the connection line between the head assembly and the processing assembly; and / or, the non-perforated structure includes a through hole through the front shell 12, the middle shell 13 and the rear shell 14 for through-fixing of the front shell 12, the middle shell 13 and the rear shell 14.

[0062] In the above embodiment, by simultaneously providing a hollow structure 1320 and a non-hollow structure 1321 on the side surface 132, it is beneficial to balance the heat dissipation performance of the head assembly 2 and the processing assembly 3, and can also improve the structural stability of the depth camera and the stability of the circuit connection.

[0063] In some embodiments, the middle shell 13, the front shell 12, and the rear shell 14 can be fixedly connected by the top edge injection method to form an integrated shell structure. That is, the molten material is allowed to enter the cavity of the middle shell 13 from the top edge of the middle shell 13 to reduce the burrs on the side 132 edge of the middle shell 13, so that the shell 1 has a good appearance and mass production capability.

[0064] Figure 3 This is a schematic diagram of the structure of the head assembly 2 provided in some embodiments of this application, such as... Figure 3 As shown, the head assembly 2 includes a projection module 20 and a acquisition module 21. The projection module 20 is used to emit a structured light pattern beam to the object under test, and the acquisition module 21 is used to acquire the structured light beam reflected back by the object under test and generate a structured light image.

[0065] In some embodiments, the projection module 20 can be a speckle emission module, including a light source, a collimating lens, and a pattern modulator. The light source can be one or more combinations of a VCSEL array light source or an EEL light source, used to emit a speckle beam to the collimating lens. The collimating lens can be one or more combinations of a single lens, multiple lenses, a microlens array, or a metalens, used to collimate the speckle beam to the pattern modulator. The pattern modulator can be one or more combinations of a diffractive optical element (DOE), a photomask (MASK), a liquid crystal, or an optical metasurface, used to expand the speckle beam and project it onto the object under test. The collimating lens and the pattern modulator can be an integrated design or separate designs.

[0066] In some embodiments, the acquisition module 21 includes at least one infrared camera 210, wherein the infrared camera 210 includes a focusing lens, a filter, and an image sensor. The focusing lens can be one or more combinations of a single lens, multiple lenses, a microlens array, or a superlens, used to focus the reflected speckle beam onto the pixel array of the image sensor. The filter is used to filter stray beams consistent with the wavelength of the light source, allowing only the beam emitted by the light source to enter the image sensor. The image sensor can be one of a CMOS sensor, a SPAD sensor, or a TOF sensor, used to receive the reflected structured light beam and image it to obtain a structured light image. It is understood that the filter can be disposed on the light-incident side of the focusing lens or between the focusing lens and the image sensor. Disposing the filter between the focusing lens and the image sensor is beneficial for miniaturizing the acquisition module 21.

[0067] Furthermore, if the depth camera acquires the depth image of the object being measured based on the principle of monocular structured light, the acquisition module 21 can include only one infrared camera 210a; if the depth camera acquires the depth image of the object being measured based on the principle of binocular structured light, then the acquisition module 21 needs to include two infrared cameras 210, such as... Figure 3 As shown, the acquisition module 21 includes a first infrared camera 210a and a second infrared camera 210b. This application does not limit the method by which the depth camera acquires the depth image of the object under test, therefore, it does not limit the number of infrared cameras.

[0068] In some embodiments, the acquisition module 21 further includes a color camera 211 for acquiring color images of the object under test to obtain texture information of the object under test.

[0069] Specifically, such as Figure 3 As shown, when the acquisition module 21 includes a color camera 211 and two infrared cameras 210, the projection module 20 and the color camera 211 are positioned between the two infrared cameras 210 so that the structure pattern light beam projected by the projection module 20 can fill the acquisition field of view of the two infrared cameras 210.

[0070] It should be understood that, regardless of whether the acquisition module 21 includes a single infrared camera 210a or two infrared cameras 210a and 210b, the projection field of view of the projection module 20 must be greater than or equal to the acquisition field of view of the acquisition module 21 in order to remove invalid edge information and improve the system performance and measurement accuracy.

[0071] In some embodiments, such as Figure 3The head assembly 2 also includes a single-point laser ranging module 22 based on the DTOF measurement principle. The single-point laser ranging module 22 is adjacent to the projection module 20. The single-point laser ranging module 22 includes a projection unit and a data acquisition unit. The projection unit emits a pulsed beam, and the data acquisition unit receives the reflected pulsed beam. The relative distance is calculated by measuring the time required for the pulsed beam to travel from emission to reception. The single-point laser ranging module 22 can be used for short-range measurements, helping to fill the blind spots in structured light short-range measurements and improving the overall ranging performance of the depth camera. For example, when a user is in the short-range measurement blind zone of the depth camera, the single-point laser ranging module 22 can be activated to obtain the distance between the user and the depth camera, prompting the depth camera to promptly shut down the projection module 20 to prevent the beam emitted by the projection module 20 from harming the user's eyes and improving safety.

[0072] Figure 4 This is a schematic diagram of the structure of the front shell 12 provided in some embodiments of this application, such as... Figure 4 As shown, in some embodiments, the front housing 12 is provided with a first light-transmitting hole 120a corresponding to the projection module 20 in the head assembly 2 and first light-transmitting holes 120b and 120c corresponding to the color camera 211 and infrared camera 210 in the projection module 20, respectively, so that the projection module 20 can project a structured light pattern beam onto the object under test through the light-transmitting hole, and the acquisition module 21 can receive the structured light pattern beam or natural light beam reflected back by the object under test through the light-transmitting hole to generate a structured light image or a color image.

[0073] Figure 5 A schematic exploded view of a depth camera is provided for some embodiments of this application. The depth camera also includes an LED component 4 disposed on one side of the head assembly 2, used to indicate the working status of the depth camera, such as power-on / standby / normal use / fault status, so as to facilitate normal use of the depth camera and improve the user experience. Furthermore, a light-diffusing plate 41 is provided on the light-emitting side of the LED component 4 to make the LED light less glaring.

[0074] In some embodiments, such as Figure 4 and Figure 5 As shown, the front shell 12 is also provided with a second light-transmitting hole 121 corresponding to the LED component 4 and the single-point laser ranging module 22. The second light-transmitting hole 121a corresponds to the LED component 4, and the second light-transmitting hole 121b corresponds to the single-point laser ranging module 22. The LED component 4 emits a light beam through the second light-transmitting hole 121a, and the single-point laser ranging module 22 emits a light beam and receives the reflected light beam through the second light-transmitting hole 121b.

[0075] like Figure 5As shown, in some embodiments, the processing component 3 includes a computing board module 30 and a motherboard module 31. The computing board module 30 is used to receive structured light images acquired by the acquisition module 21 and process the structured light images to obtain depth images of the object under test. The motherboard module 31 is electrically connected to the computing board module 30 and is used to process the depth images to obtain point cloud data and / or three-dimensional models of the object under test.

[0076] Specifically, the computing board module 30 is electrically connected to the head assembly 2 via a first flexible printed circuit board (FPC) 10, which is used to receive the structured light image acquired by the acquisition module 21 in the head assembly 2 and perform depth calculation to obtain the depth image of the object under test; the computing board module 30 is electrically connected to the main board module 31 via a second flexible printed circuit board 11, which further processes the depth image, such as completing the depth image, converting the depth image into a point cloud to obtain the point cloud of the object under test, or performing three-dimensional reconstruction based on the depth image to obtain a three-dimensional model of the object under test.

[0077] It should be understood that in this application, the head assembly 2 and the processing assembly 3 are set separately and electrically connected by a flexible circuit board, so that the processing assembly 3 can be adapted to other head assemblies 2 of the same size and has good compatibility; the electrical connection method in this application can also be implemented by one or more combinations of methods such as ribbon cable, soldering, etc., which are not limited here.

[0078] In some embodiments, the processing component 3 further includes a power board module 32 disposed between the computing board module 30 and the motherboard module 31. The computing board module 30 is positioned closer to the head assembly 2 than the motherboard module 31. The motherboard module 31 operates at a higher temperature, and being located away from the head assembly 2 reduces the mutual temperature influence between the two. Specifically, the power board module 32 is electrically connected to the motherboard module 31 and supplies power to the motherboard module 31; the computing board module 30 and the motherboard module 31 are connected via a second flexible circuit board 11, and thus, under the control of the motherboard module 31, the power board module 32 can indirectly supply power to the computing board module 30; since the computing board module 30 and the head assembly 2 are connected via a first flexible circuit board 10, the power board module 32 can also indirectly supply power to the head assembly 2.

[0079] In some embodiments, the power board module 32 is also provided with an interface for electrical connection with the LED component 4, so that the LED component 4 can be directly electrically connected to the power board module 32, and the power board module 32 provides independent power supply to the LED component 4 under the control of the main board module 31.

[0080] In one embodiment, the power board module 32 is provided with an industrial-grade power supply and data transmission interface 320 for connecting to external devices, used to provide power to the depth camera and / or for data transmission interaction with a host computer, wherein the external devices include an external power supply and / or a host computer. The industrial-grade power supply and data transmission interface 320 is provided with a spring contact 321 that contacts the rear shell 14. The rear shell 14 serves as a potential reference point (i.e., "grounding"). When the industrial-grade power supply and data transmission interface 320 is connected to an external device by a connecting cable, the spring contact 321 will undergo elastic deformation, thereby maintaining tight contact with the rear shell 14 to form an electrical connection to achieve grounding and ensure electrical safety.

[0081] Optionally, the industrial-grade power supply and data transmission interfaces 320 are M12 X-coded and M12A-coded industrial-grade interfaces, respectively. The M12 X-coded interface supports PoE power supply and data transmission, and its stability is better than USB 3.0, making it suitable for high vibration and long-distance connections. The M12 A-coded interface supports DC power supply and RS-485 serial communication, making it suitable for short-distance, low-speed point-to-point communication. Figure 6 Schematic exploded views of the depth camera portion structure provided in some embodiments of this application, such as Figure 5 and Figure 6 As shown, the rear housing 14 of the depth camera has a through hole 140 corresponding to the industrial-grade power supply and data transmission interface 320, so that the industrial-grade power supply and data transmission interface 320 located on the power board module 32 passes through the through hole 140 and is exposed to the outside of the depth camera housing, facilitating connection with external devices. Optionally, the through hole 140 can be a screw hole.

[0082] In some embodiments, the computing board module 30 and the power board module 32 are respectively provided with a first test interface 300 and a second test interface 322, wherein both the first test interface 300 and the second test interface 322 can be Type-C interfaces, which is beneficial for users to directly test each component, facilitate quick problem location and optimization of device performance.

[0083] In some embodiments, a heat sink 6 is provided between the power board module 32 and the computing board module 30. Along the second direction of the depth camera, i.e., the x-direction perpendicular to the first z-direction, the heat sink 6 includes a first end 60 and a second end 61 disposed opposite to each other. The first end 60 has a connecting structure 601 bent toward the power board module 32, and the connecting structure 601 is fixedly connected to the power board module 32. The second end 61 is provided with at least one column 610, which contacts the computing board module 30. Specifically, the column 610 is a screw post, used to support the computing board module 30 above the heat sink 6 and fixed to the computing board module 30 by screws.

[0084] In some embodiments, the rear housing 14 is provided with a step 142 on the side near the through hole 140, and the heat sink 6 is mounted on the step 142 so that the heat from the power board module 32 and the computing board module 30 to the heat sink 6 is transferred to the lower surface of the rear housing 14 through the step 142, which facilitates heat dissipation to the outside.

[0085] In the above embodiment, the heat of the power board module 32 and the computing board module 30 can be dissipated through the heat sink 6 between them, and the motherboard module 31 is in contact with the bottom surface of the rear shell 14, and the heat sink 6 is connected to the step 142 on the rear shell 14, so that the heat of the motherboard module 31 and the heat sink 6 can be transferred to the outside through the rear shell 14, which is beneficial to improving the heat dissipation performance of the depth camera.

[0086] Figure 7 The diagram below shows the structure of the rear cover 14 provided in some embodiments of this application. The rear cover 14 is provided with a removable waterproof cover 141 to isolate the through hole 140 from the external space, which helps to improve the waterproof performance of the depth camera. When the depth camera is not in use, the waterproof cover 141 can be tightened to protect the industrial-grade power supply and data transmission interface 320 and prevent water from entering the depth camera. When the depth camera is in use, the waterproof cover 141 can be removed from the depth camera to allow the industrial-grade power supply and data transmission interface 320 to be connected to external devices.

[0087] like Figure 5 As shown, in some embodiments, in the first direction of the depth camera, the front shell 12, middle shell 13, and rear shell 14 are provided with through mounting holes, and mounting posts 5 are provided in the mounting holes for through-fixing the front shell 12, middle shell 13, and rear shell 14. Optionally, the mounting holes can be screw holes, and the mounting posts 5 can be long screws. The three-section integrated structure is conducive to miniaturization, and the front shell, middle shell, and rear shell can be locked together by the mounting posts 5, so that the three parts can be quickly connected into one, giving the overall shell good installation efficiency.

[0088] In some embodiments, the middle shell 13 and the rear shell 14, as well as the middle shell 13 and the front shell 12, can be assembled by mounting posts 5 respectively, which facilitates the transfer of the depth camera semi-finished product and has a good installation design.

[0089] In some embodiments, when the head assembly 2 is fixed against the bottom surface of the front housing 12, a shock-absorbing rubber sleeve 7 is also provided between the head assembly 2 and the front housing 12 to reduce the impact of the depth camera shaking on the head assembly 2 and improve the shockproof and waterproof performance of the depth camera.

[0090] like Figure 2 and Figure 5As shown, the depth camera includes at least two waterproof rings 8. A portion of the waterproof rings is located at the first connection point of the first surface 130 of the front shell 12 and the middle shell 13, and the other portion of the waterproof rings is located at the second connection point of the second surface 131 of the rear shell 14 and the middle shell 13. This prevents moisture from entering the depth camera through the gaps at the connection points when the depth camera is in a harsh environment, thereby improving the waterproof performance of the depth camera.

[0091] In some embodiments, the front assembly 2 has at least one heat sink 9 on its side, connected between the front assembly 2 and the middle shell 13, that is, one end of the heat sink 9 is connected to the front assembly 2, and the other end extends to the middle shell 13 and overlaps the middle shell 13. Figure 5 and Figure 8 As shown, Figure 8 This is a schematic diagram of the structure of a heat sink provided in some embodiments of this application. Multiple heat sinks 9 are provided on two opposite sides of the head assembly 2 along the y-direction. The heat sink 9 has an "L"-shaped structure, including a planar area 90 and a bending area 91. The upper end of the planar area 90 is connected to the head assembly 2. The planar area 90 extends downward from the head assembly 2 to the middle shell 13 and connects with one end of the bending area 91. The lower surface of the bending area 91 contacts the first surface 130 of the middle shell 13 to transfer the heat dissipated by the head assembly 2 to the middle shell 13, and then to the outside through the middle shell 13, which is beneficial to improving the heat dissipation performance of the head assembly 2.

[0092] It should be understood that the front shell 12, middle shell 13, rear shell 14, heat sink 6 and heat sink 9 in this application are preferably made of materials with high thermal conductivity, which is beneficial to further transfer heat to the outside and improve the heat dissipation performance of the depth camera.

[0093] It should be understood that the above implementation methods may be used only one of them, or in any combination.

[0094] In the embodiments of this application, the terms "first," "second," and various numerical designations (e.g., "1," "2," etc.) are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The order of the process numbers above does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. It should be understood that the objects described in this way can be interchanged where appropriate so as to describe solutions other than those in the embodiments of this application.

[0095] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0096] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0097] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0098] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0099] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0100] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An integrated depth camera, characterized by, include: The head assembly is used to project a structured light pattern beam onto the object under test and receive the structured light pattern beam reflected back from the object under test to generate a structured light image. A processing component is used to process the structured light image to obtain the three-dimensional information of the object under test; as well as, The housing includes a front shell, a middle shell, and a rear shell arranged sequentially along a first direction, the first direction being parallel to the light emission direction of the structured light pattern beam projected by the head assembly onto the object under test; the head assembly and the processing assembly are respectively mounted on the front shell and the rear shell, and the middle shell is used to separate the head assembly and the processing assembly.

2. The depth camera of claim 1, wherein, The middle shell includes a side surface parallel to the first direction; The side surface has a perforated structure for heat dissipation; and / or, The side has a non-perforated structure, and the connecting line between the head assembly and the processing assembly passes through the non-perforated structure.

3. The depth camera of claim 1 or 2, wherein, The front shell, the middle shell, and the rear shell are all provided with through mounting holes along the first direction. The depth camera also includes a mounting post for passing through the mounting holes to fix the front shell, the middle shell, and the rear shell together.

4. The depth camera of claim 1 or 2, wherein, The head assembly includes a projection module for emitting a structured light pattern beam toward the object under test and an acquisition module for acquiring the structured light pattern beam reflected back by the object under test and generating the structured light image. The processing component includes a computing board module and a motherboard module. The computing board module is used to receive the structured light image generated by the acquisition module and perform depth calculation to obtain the depth image of the object under test. The motherboard module is electrically connected to the computing board module and is used to process the depth image to obtain the point cloud data and / or three-dimensional model of the object under test.

5. The depth camera of claim 4, wherein, The processing component also includes a power board module, which is located between the computing board module and the motherboard module and is electrically connected to the motherboard module to supply power to the motherboard module. The power board module is also used to indirectly supply power to the computing board module through the motherboard module; The computing board module is electrically connected to the head unit assembly, and the power board module is also used to indirectly supply power to the head unit assembly through the computing board module.

6. The depth camera of claim 5, wherein, Both the computing board module and the power board module are further provided with test interfaces, which are used to connect to external testing equipment for testing; and / or, The depth camera also includes a heat sink disposed between the power board module and the computing board module. The heat sink has a first end and a second end disposed opposite to each other along a second direction. The first end is bent toward the power board module. The power board module is fixedly connected to the heat sink at the first end. The second end is provided with at least one column for supporting the computing board module. The second direction is perpendicular to the first direction.

7. The depth camera of claim 5, wherein, The power board module is equipped with power supply and data transmission interfaces; and / or, The power board module is equipped with an M12 X-coded interface and an M12 A-coded interface, which serve as power supply and data transmission interfaces; The power supply and data transmission interface is used to connect to external devices, which are used to provide power to the depth camera and / or to perform data transmission interactions with the depth camera.

8. The depth camera of claim 7, wherein, The power supply and data transmission interface is provided with a spring contact that contacts the rear housing. When a connecting cable for connecting to the external device is inserted into the power supply and data transmission interface, the spring contact undergoes elastic deformation, thereby contacting the rear housing to form an electrical connection; and / or, The rear shell is provided with a through hole corresponding to the power supply and data transmission interface, so that the power supply and data transmission interface can pass through the through hole to connect with the external device. The through hole is a screw hole, and the through hole port is provided with a removable waterproof cover.

9. The depth camera of claim 1 or 2, wherein, The depth camera further includes an LED assembly, the light-emitting side of which is provided with a light-diffusing sheet; and / or, the depth camera further includes a shock-absorbing rubber sleeve disposed between the head assembly and the inner side of the front housing.

10. The depth camera of claim 1 or 2, wherein, The depth camera also includes at least two waterproof rings, a portion of which is located at the first connection between the front shell and the middle shell, and the other portion is located at the second connection between the rear shell and the middle shell; And / or, The depth camera also includes at least one heat sink connected between the head assembly and the middle shell.

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