超薄型图像传感器

Abstract

本实用新型公开了一种超薄型图像传感器，涉及图像传感器技术领域。其中，超薄型图像传感器的壳体具有相连通的第一空间、第二空间，且第二空间与外界连通，由此将电路板安装于第二空间内并实现将第一空间进行封盖，由此实现将传感器组件封装在相对密封的第一空间内；即实现了电路板的安装，又通过电路板将传感器组件封装于第一空间内，由于电路板作为壳体的一部分，减少了额外的封装材料，有效降低了壳体的厚度尺寸，有助于实现图像传感器的轻薄化设计；同时电路板安装于第二空间内，通过壳体的周侧壁实现对电路板进行防护，显著提高了图像传感器的整体结构强度。

Claims

1. An ultra-thin image sensor having X, Y and Z directions which intersect two by two, characterized in that, include: The housing, in the Z direction, has a first space and a second space that are connected, and the second space is connected to the outside on the side away from the first space; The sensor assembly is installed within the first space; as well as A circuit board, installed in the second space, is used to position and encapsulate the sensor assembly within the first space.

2. The ultra-thin image sensor of claim 1, wherein, The housing includes: The main body portion, wherein the first space is formed within the main body portion, and in the Z direction, the main body portion has a first end facing the circuit board side, and the first space is disposed through the first end; and An extension is provided in the Z direction, with the first end connected to the periphery of the extension, which extends in a direction away from the first end, so that the space within the extension forms the second space.

3. The ultra-thin image sensor of claim 2, wherein, In the Z direction, the extension is located outside the first space, such that the first end of the portion located between the first space and the extension forms a stop. The circuit board is installed in the second space, with one end of the circuit board facing the main body pressing against the stop portion.

4. The ultra-thin image sensor of claim 2, wherein, The first end is provided with a guide post, and the guide post extends in a direction away from the first end; In the Z direction, the circuit board has a guide hole through the corresponding position of the guide post, and the circuit board is fixedly installed on the first end by fasteners.

5. The ultra-thin image sensor of claim 2, wherein, The sensor assembly includes: The light source section is used to emit light onto the surface to be inspected; and A photosensitive component is disposed at a distance from one side of the light source portion in the X direction; A lens structure is disposed between the light source and the photosensitive component; and A reflective part is obliquely disposed between the light source part and the lens structure, and is used to reflect the light information emitted by the light source part and reflected by the surface to be detected to the lens structure, and then transmit it to the photosensitive component through the lens structure; The light source, the photosensitive component, the lens structure, and the reflective component all extend along the Y direction.

6. The ultra-thin image sensor of claim 5, wherein, The first space includes: The first subspace is used to accommodate the light source unit; and The second subspace is used to accommodate the photosensitive component; in the X direction, the first subspace and the second subspace are spaced apart to form a third subspace between the first subspace and the second subspace; In the X direction, the two sides of the third subspace are connected to the first subspace and the second subspace. The reflective part and the lens structure are both disposed in the third subspace, and the lens structure extends at least partially from the third subspace into the second subspace.

7. The ultra-thin image sensor of claim 6, wherein, In the Z direction, at least a portion of the second subspace on the side away from the circuit board is recessed in the direction away from the circuit board to form a snap-fit ​​cavity, and at least a portion of the photosensitive component on the side away from the circuit board is snapped into the snap-fit ​​cavity; In the Z direction, the circuit board has a through-hole corresponding to the snap-fit ​​cavity, and the photosensitive component has a snap-fit ​​protrusion on the side away from the snap-fit ​​cavity that engages with the snap-fit ​​hole.

8. The ultra-thin image sensor of claim 6, wherein, The second subspace has a stop block extending toward the circuit board from one side wall away from the circuit board and one end near the third subspace; The blocking block is disposed between the photosensitive component and the lens structure, and in the X direction, the blocking block is located outside the path through which the lens structure transmits light information; The lens structure at least partially abuts against the stop block on the side facing the photosensitive component.

9. The ultra-thin image sensor of claim 6, wherein, The third subspace has a recessed groove on the side near the circuit board, and the groove is located on the side of the third subspace near the first subspace. The reflective part is at least partially housed within the inclined groove, so that the reflective part is maintained at a preset tilt angle.

10. The ultra-thin image sensor of any of claims 6-9, wherein, The ultra-thin image sensor also includes a light-transmitting part; The main body has a mounting hole for mounting the light-transmitting part through it on the side away from the circuit board. In the Z direction, the third subspace and at least part of the first subspace are connected to the mounting hole.

Images