一种改善音质的耳机
By connecting the microphone housing to the ground terminal in the headphones, the problem of current noise caused by power frequency interference was solved, resulting in improved audio quality and user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BASEUS TECH CO LTD
- Filing Date
- 2025-08-05
- Publication Date
- 2026-07-17
AI Technical Summary
When existing active noise-canceling headphones are charging on a computer, power frequency interference is transmitted to the headphones through the data cable, causing current noise and affecting audio quality and user experience.
By connecting the microphone housing to the ground terminal of the headphones, the potential difference between the analog ground of the internal chip of the headphones and the ground terminal of the microphone is balanced, the current return path is blocked, and the current noise is eliminated.
It effectively eliminates power frequency interference, improves audio quality, and ensures a good user experience in ANC or transparency mode.
Smart Images
Figure CN224521156U_ABST
Abstract
Claims
1. An earphone for improving sound quality, characterized by comprising: The headphones include: The earphone shell has a receiving cavity and a through hole, the through hole connecting the receiving cavity to the outside; A loudspeaker is disposed within the cavity, and the sound output direction of the loudspeaker corresponds to the through hole to transmit the audio output by the loudspeaker to the outside. A microphone is disposed on the earphone shell, and the sound output direction of the speaker corresponds to the microphone; A circuit board is disposed in the receiving cavity and electrically connects the speaker and the microphone; The microphone includes a housing, which is connected to the grounding terminal of the earphone via a conductive component.
2. The earphone of claim 1, wherein The grounding terminal is located in the accommodating cavity.
3. The earphone according to claim 1, characterized in that, The circuit board is provided with a ground terminal and an active terminal; the microphone also includes: a microphone positive wire and a microphone negative wire; The microphone positive wire is electrically connected to the active terminal, the microphone negative wire is electrically connected to the ground terminal, and the conductive element is electrically connected to the microphone negative wire.
4. The earphone of claim 3, wherein The microphone positive wire and the microphone negative wire are twisted and wound together.
5. The earphone of claim 1, wherein The grounding terminal is located on the earphone shell.
6. The earphone of claim 1, wherein The conductive component includes a metal component or a solder component that has a conductive function.
7. The earphone of claim 1, wherein The conductive element covers at least one of the top surface, bottom surface, and peripheral surface of the housing, wherein the peripheral surface is connected between the top surface and the bottom surface.
8. The earphone of claim 1, wherein, The conductive element covers the top surface, bottom surface, and peripheral surface of the housing, wherein the peripheral surface is connected between the top surface and the bottom surface.
9. The earphone of claim 1, wherein, The microphone is a feedback microphone.
10. The earphone of any one of claims 1, wherein, The microphone includes any one of the following: a microphone with a shielding layer, a patch silicon microphone, an electret condenser microphone, an analog silicon microphone, or a digital silicon microphone.
11. The earphone of claim 10, wherein, When the microphone is an electret condenser microphone, the positive and negative electrode wires of the electret condenser microphone are twisted together, and the twisted electrode wires are electrically connected to the ground terminal of the circuit board.
12. The earphone according to any one of claims 1 to 11, characterized in that, The earphones also include a Type-C interface, the earphone shell includes an opening, the Type-C interface is located in the opening and is electrically connected to the circuit board.