一种模拟芯片发热的热源装置
By designing a heat source device for the substrate and heating element, and utilizing a combination of insulating film and metal heat-conducting plate, the problem of the large structure and insufficient heat of existing analog chip heating devices is solved, realizing efficient and safe chip heating simulation, which is suitable for testing GPU and AI chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Filing Date
- 2025-07-26
- Publication Date
- 2026-07-17
Smart Images
Figure CN224521195U_ABST
Abstract
Claims
1. A heat source device that simulates heat generation of a chip, characterized by: The device includes a substrate (1) and a heating element (5). The heating element (5) is wrapped with an upper insulating film (4) and a lower insulating film (6) on its upper and lower sides. The upper insulating film (4), the heating element (5) and the lower insulating film (6) form a heating element insulator. A metal heat-conducting plate (2) and a substrate (1) are fixed on the upper and lower sides of the heating element insulator, respectively. The surface of the metal heat-conducting plate (2) is provided with a groove. The metal heat-conducting plate (2) and the substrate (1) are fixed by welding around the perimeter. A wiring guide plate (3) is provided at the end of the substrate (1). A conductive pin (7) is provided on the wiring guide plate (3). The conductive pin (7) is electrically connected to the heating element (5). The conductive pin (7) is connected to an external power supply through a power supply lead (8).
2. The heat source device simulating heat generation of a chip according to claim 1, characterized by: The substrate (1) has several fixing holes at equal intervals on both sides of the middle part for fixing the substrate (1).
3. The heat source device simulating heat generation of a chip according to claim 1, characterized by: The metal heat-conducting plate (2) and the substrate (1) are welded together to form a whole that encloses the heating element insulator.
4. The heat source device simulating heat generation of a chip according to claim 1, characterized by: The outer corners of the metal heat-conducting plate (2) are all set to be arc-shaped, and a material-taking groove is opened at one end of the top surface of the metal heat-conducting plate (2).
5. The heat source device simulating heat generation of a chip according to claim 1, characterized by: The heating element insulator formed by the upper insulating film (4), the heating element (5) and the lower insulating film (6) is sealed in the middle of the metal heat-conducting plate (2) and the substrate (1).
6. The heat source device simulating heat generation of a chip according to claim 1, characterized by: Each of the conductive pins (7) is electrically connected to the wiring board (3), and the wiring board (3) is electrically connected to the heating element (5).