An insulated encapsulated high-voltage resistant PTC heating element assembly

Abstract

This utility model provides an insulated encapsulated high-voltage resistant PTC heating element assembly, belonging to the field of heating element assemblies. It includes an encapsulation shell, inside which a detachable mounting assembly is installed. An anti-pressure assembly is provided on the upper exterior of the encapsulation shell. When the chip body needs to be installed inside the encapsulation shell, the end plate on the right end of the chip body is directly inserted into the shell groove to the right. The inclined surface of the mounting plate is squeezed by the shell groove and slides into the inner groove, causing the limiting plate to slide within the limiting groove, compressing the first spring rod and causing it to contract. When the encapsulation shell is subjected to downward pressure during installation and use, the force plate is forced to move downward within the telescopic groove, causing the side plate to move downward within the side groove, and simultaneously causing the insert plate to move downward stably within the insert groove, compressing the third spring rod and causing it to contract. Through elastic contraction, the downward pressure is buffered, improving the pressure resistance of the encapsulation shell.

Description

Technical Field

[0001] This utility model relates to the field of heating element components, and more specifically, to an insulated encapsulated high-voltage resistant PTC heating element component. Background Technology

[0002] For heaters in new energy vehicles, PTC heating is currently the mainstream heating method. Existing conventional PTC heating devices typically include a cast aluminum base with slots arranged to fit the water tank, and a PTC heating element assembly inserted into the slots. The back of the slots forms heating ribs that are inserted into the water tank. The conventional PTC heating element assembly typically includes a main frame, a PTC heating element placed in the main frame, two electrodes covering the outer surface of the PTC heating element, and ceramic plates covering the outer surface of the two electrodes, thus constituting the entire PTC heating element assembly. The PTC heating element assembly is used to heat the water tank. To ensure the reliability of installation, PTC heating element assembly structures that include wedge plates have also appeared on the market.

[0003] A search revealed that Chinese patent CN219107681U discloses a "wedge-shaped PTC heating core assembly," comprising a main frame, a PTC element housed in a mounting groove, two sets of electrodes covering the two outer surfaces of the PTC element, and two ceramic plates covering the outer surfaces of the two sets of electrodes. Each ceramic plate has a thermally conductive film attached to its corresponding electrode surface. The assembly also includes a wedge-shaped plate capable of pressing against the outer surface of at least one of the ceramic plates, with at least one surface of the wedge-shaped plate having a concave-convex structure formed by multiple parallel grooves. The advantages are: the elastic compression of the conductive film increases the heat conduction area, resulting in a larger heat transfer area and improved thermal efficiency; in particular, the elasticity of the conductive film itself generates buffer pressure, preventing the ceramic insulation plate from cracking and improving product yield; the concave-convex structure design reduces frictional resistance, facilitates insertion, and lowers assembly difficulty. However, the following drawbacks still exist: (1) Existing heating core components install the encapsulation shell outside the chip body by encapsulating it with glue, but they do not have a structure that can completely lock the chip body, so the chip body may slip out inside the encapsulation shell. (2) The existing encapsulation shell has insufficient pressure resistance. When the encapsulation core is inserted, it will be squeezed by the surrounding components. During the squeezing, the internal heating core will be squeezed, causing the chip to bend and be damaged.

[0004] Therefore, we have made improvements and proposed an insulated encapsulated high-voltage resistant PTC heating core assembly. Utility Model Content

[0005] The purpose of this invention is to address the problem that existing heating element assemblies, which use encapsulation to mount the chip body outside the chip body, do not have a structure that completely locks the chip body in place and the encapsulation is not strong enough in terms of pressure resistance. As a result, the encapsulation core is squeezed by surrounding components when it is inserted and used, which causes the internal heating element to be squeezed.

[0006] To achieve the above-mentioned objectives, this utility model provides the following technical solution: An insulated encapsulated high-voltage PTC heating element assembly is provided to improve the above-mentioned problems.

[0007] The present invention is as follows: The package includes a housing, inside which a snap-fit ​​assembly is detachably installed, and on the outer upper part of the housing is a pressure-resistant assembly; The card mounting assembly includes a shell groove inside the packaging shell, an end plate is detachably inserted into the shell groove, and a chip body is installed between the two end plates on both sides. The pressure-resistant component includes an outer plate disposed on the upper outer wall of the encapsulation shell, and an expansion groove is provided inside the outer plate, and a force-bearing plate is movably disposed inside the expansion groove.

[0008] As a preferred technical solution of this utility model, an inner groove is provided on the side of the end plate, and a retaining plate is movably arranged inside the inner groove.

[0009] As a preferred technical solution of this utility model, a limiting groove is provided on the side wall of the inner groove, a limiting plate is provided on the side wall of the card plate to cooperate with the limiting groove, and a first spring rod is provided on the side wall of the limiting plate.

[0010] As a preferred technical solution of this utility model, a slot is provided on the upper side of the shell groove to cooperate with the slot plate, and a push plate is movably arranged inside the slot.

[0011] As a preferred technical solution of this utility model, the side wall of the slot is provided with a side groove, the side wall of the push plate is provided with a side plate that cooperates with the side groove, and the side wall of the side plate is connected with a second spring rod.

[0012] As a preferred technical solution of this utility model, the side wall of the expansion groove is provided with a side groove, and the side wall of the force-bearing plate is provided with a side plate that cooperates with the side groove.

[0013] As a preferred technical solution of this utility model, the lower end of the telescopic groove is provided with a groove, the lower end of the force plate is provided with a plate that cooperates with the groove, and the lower end of the plate is provided with a third spring rod.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: In the solution of this utility model: 1. With the help of the end plate, clamping plate, limiting plate, first spring rod, and push plate, when the chip body needs to be installed in the package, the end plate on the right end of the chip body is directly inserted into the shell groove to the right. The inclined surface of the clamping plate is squeezed by the shell groove and slides into the inner groove, which drives the limiting plate to slide in the limiting groove. The first spring rod is squeezed to retract. When both end plates are fully inserted into the shell groove, the clamping plate is aligned with the clamping groove. The first spring rod pushes the limiting plate upward, which drives the clamping plate to insert into the aligned clamping groove, thus completing the quick installation of the package. When disassembly and maintenance are required, the push plate is pressed down to push the clamping plate from the clamping groove into the inner groove. At the same time, the side plate slides in the side groove, which squeezes the second spring rod to retract. When the clamping plate is completely detached from the clamping groove, the end plate is pushed to the right to make the chip body completely detach from the shell groove, thus completing the disassembly. The pressure on the push plate is released, and the second spring rod pushes the side plate, which drives the push plate to reset for disassembly operation again. 2. Through the set force plate, side plate, insert plate and third spring rod, when the encapsulation shell is subjected to downward pressure impact during installation and use, the force plate moves downward in the expansion groove, which drives the side plate to move downward in the side groove. At the same time, the insert plate moves downward stably in the insert groove, which squeezes the third spring rod and causes it to contract. Through elastic contraction, the downward pressure is buffered, which improves the pressure resistance of the encapsulation shell. Attached Figure Description

[0015] Figure 1 A schematic diagram of the overall structure of an insulated encapsulated high-voltage resistant PTC heating core assembly provided by this utility model; Figure 2 A schematic diagram of the chip body structure of an insulated and encapsulated high-voltage PTC heating core assembly provided by this utility model; Figure 3 A schematic diagram of the mounting structure of an insulated encapsulated high-voltage PTC heating core assembly provided by this utility model; Figure 4 A schematic diagram of the clamping plate and limiting plate structure of an insulated encapsulated high-voltage resistant PTC heating core assembly provided by this utility model; Figure 5 This utility model provides a schematic diagram of the pressure-resistant component structure of an insulated encapsulated high-voltage resistant PTC heating core assembly.

[0016] The image shows: 1. Encapsulation shell; 201. Shell groove; 202. End plate; 203. Chip body; 204. Inner groove; 205. Card plate; 206. Limiting groove; 207. Limiting plate; 208. First spring rod; 209. Card slot; 210. Push plate; 211. Side groove; 212. Side plate; 213. Second spring rod; 301. Outer plate; 302. Telescopic groove; 303. Force plate; 304. Side groove; 305. Side plate; 306. Insertion groove; 307. Insertion plate; 308. Third spring rod. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0018] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0019] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] like Figure 1-5 As shown, this embodiment proposes an insulated encapsulated high-voltage resistant PTC heating core assembly, including an encapsulation shell 1, a snap-fit ​​assembly that can be detachably installed inside the encapsulation shell 1, and an anti-pressure assembly provided on the upper outer side of the encapsulation shell 1. The card assembly includes a shell groove 201 inside the package shell 1, an end plate 202 is detachably inserted into the shell groove 201, and a chip body 203 is installed between the two end plates 202. The pressure-resistant component includes an outer plate 301 disposed on the upper outer wall of the encapsulation shell 1, an expansion groove 302 is provided inside the outer plate 301, and a force-bearing plate 303 is movably disposed inside the expansion groove 302.

[0022] like Figure 3 As shown, an inner groove 204 is provided on the upper side of the end plate 202. A retaining plate 205 is movably disposed inside the inner groove 204. The inclined surface of the retaining plate 205 is pressed by the shell groove 201 and slides into the inner groove 204, causing the limiting plate 207 to slide in the limiting groove 206, pressing the first spring rod 208 to retract it. When both end plates 202 are fully inserted into the shell groove 201, the retaining plate 205 is aligned with the retaining groove 209. The first spring rod 208 pushes the limiting plate 207 upward, causing the retaining plate 205 to be inserted into the aligned retaining groove 209, thus completing the quick installation of the encapsulation shell 1.

[0023] like Figure 3As shown, a limiting groove 206 is provided on the side wall of the inner groove 204, and a limiting plate 207 that cooperates with the limiting groove 206 is provided on the side wall of the clamping plate 205. A first spring rod 208 is provided on the side wall of the limiting plate 207. The first spring rod 208 compresses and retracts it. When the end plates 202 on both sides are fully inserted into the shell groove 201, the clamping plate 205 is aligned with the clamping groove 209. The first spring rod 208 pushes the limiting plate 207 upward, causing the clamping plate 205 to be inserted into the aligned clamping groove 209.

[0024] like Figure 3 As shown, a slot 209 is provided on the upper side of the shell groove 201 to cooperate with the slot plate 205. A push plate 210 is movably arranged inside the slot 209. Pressing the push plate 210 pushes the slot plate 205 downward from the slot 209 into the inner groove 204, while driving the side plate 212 to slide in the side groove 211, squeezing the second spring rod 213 to make it retract. When the slot plate 205 is completely disengaged from the slot 209, the end plate 202 is pushed to the right to make the chip body 203 completely disengage from the shell groove 201, thus completing the disassembly.

[0025] like Figure 5 As shown, the card slot 209 has a side groove 211 on its side wall, and the push plate 210 has a side plate 212 that cooperates with the side groove 211 on its side wall. The side plate 212 is connected to a second spring rod 213. The second spring rod 213 compresses and retracts the card slot 205. When the card slot 205 is completely disengaged from the card slot 209, the end plate 202 is pushed to the right to completely disengage the chip body 203 from the shell groove 201, thus completing the disassembly. The pressure on the push plate 210 is released, and the second spring rod 213 pushes the side plate 212, causing the push plate 210 to reset for the disassembly operation.

[0026] like Figure 5 As shown, the side wall of the expansion groove 302 is provided with a side groove 304, and the side wall of the force plate 303 is provided with a side plate 305 that cooperates with the side groove 304. When the encapsulation shell 1 is subjected to downward pressure during installation and use, the force plate 303 is subjected to force and moves downward in the expansion groove 302, which drives the side plate 305 to move downward in the side groove 304, and at the same time makes the insert plate 307 move downward stably in the insert groove 306.

[0027] like Figure 5 As shown, the lower end of the telescopic groove 302 is provided with a groove 306, and the lower end of the force plate 303 is provided with a plate 307 that cooperates with the groove 306. The lower end of the plate 307 is provided with a third spring rod 308. The plate 307 moves down stably in the groove 306, squeezing the third spring rod 308 and causing it to contract. The elastic contraction buffers the downward pressure, improving the pressure resistance of the encapsulation shell 1.

[0028] Specifically, when using this heating element assembly: When it is necessary to install the chip body 203 into the package shell 1, directly insert the end plate 202 on the right end of the chip body 203 into the shell groove 201. The inclined surface of the retaining plate 205 is squeezed by the shell groove 201 and slides into the inner groove 204, causing the limiting plate 207 to slide in the limiting groove 206, squeezing the first spring rod 208 to retract it. When both end plates 202 are fully inserted into the shell groove 201, the retaining plate 205 is aligned with the retaining groove 209. The first spring rod 208 pushes the limiting plate 207 upward, causing the retaining plate 205 to be inserted into the aligned retaining groove 209, thus completing the quick installation of the package shell 1. When disassembly and maintenance are required, press down on the push plate 210 to push the retaining plate 205 from the retaining groove 209 downward into the inner groove. 204. Simultaneously, the side plate 212 slides within the side groove 211, compressing the second spring rod 213 to retract. When the retaining plate 205 is completely disengaged from the retaining slot 209, the end plate 202 is pushed to the right to completely disengage the chip body 203 from the shell groove 201, thus completing the disassembly. The pressure on the push plate 210 is released, and the second spring rod 213 pushes the side plate 212, causing the push plate 210 to reset for another disassembly operation. When the package shell 1 is subjected to downward pressure during installation and use, the force plate 303 is forced to move downward within the telescopic groove 302, causing the side plate 305 to move downward within the side groove 304. At the same time, the insert plate 307 moves downward stably within the insert groove 306, compressing the third spring rod 308 to retract. Through elastic contraction, the downward pressure is buffered, improving the pressure resistance of the package shell 1.

[0029] All technical features in this embodiment can be freely combined according to actual needs.

[0030] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. An insulating encapsulated high-voltage resistant PTC heat generating core assembly comprising an encapsulation shell (1), characterized in that: The encapsulation shell (1) is detachably installed with a snap-fit ​​assembly inside, and the upper part of the encapsulation shell (1) is provided with an anti-pressure assembly. The card assembly includes a shell groove (201) inside the encapsulation shell (1), an end plate (202) is detachably inserted inside the shell groove (201), and a chip body (203) is installed between the two end plates (202). The pressure-resistant component includes an outer plate (301) disposed on the upper outer wall of the encapsulation shell (1), and an expansion groove (302) is provided inside the outer plate (301), and a force-bearing plate (303) is movably disposed inside the expansion groove (302).

2. The insulated and encapsulated high voltage PTC heating element assembly of claim 1, wherein, The end plate (202) has an inner groove (204) on its upper side, and a retaining plate (205) is movably disposed inside the inner groove (204).

3. The insulated encapsulated high voltage PTC heat generating core assembly of claim 2 wherein, The inner groove (204) has a limiting groove (206) on its side wall, and the card plate (205) has a limiting plate (207) that cooperates with the limiting groove (206) on its side wall. The limiting plate (207) has a first spring rod (208) on its side wall.

4. The insulated encapsulated high voltage PTC heat generating core assembly of claim 2 wherein, The upper side of the shell groove (201) is provided with a slot (209) that cooperates with the slot plate (205), and a push plate (210) is movably arranged inside the slot (209).

5. The insulated encapsulated high voltage PTC heat generating core assembly of claim 4 wherein, The card slot (209) has a side groove (211) on its side wall, and the push plate (210) has a side plate (212) that cooperates with the side groove (211) on its side wall. The side plate (212) is connected to a second spring rod (213).

6. The insulated and encapsulated high voltage PTC heating element assembly of claim 1 wherein, The expansion groove (302) has a side groove (304) on its side wall, and the force plate (303) has a side plate (305) that cooperates with the side groove (304) on its side wall.

7. The insulated encapsulated high voltage PTC heat generating core assembly of claim 6 wherein, The lower end of the telescopic groove (302) is provided with a groove (306), and the lower end of the force plate (303) is provided with a plate (307) that cooperates with the groove (306). The lower end of the plate (307) is provided with a third spring rod (308).

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