一种以石英加热管为热源方式的加热盘结构
By using quartz heating tubes as a heat source in wafer bonding, combined with cooling water pipes and hook structures, the problems of uneven heating, slow temperature rise, and high energy consumption were solved, achieving rapid and uniform heating and efficient cooling, thus improving the quality of wafer bonding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HAICHUANG INTELLIGENT EQUIP (YANTAI) CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer bonding processes suffer from problems such as poor heating uniformity, slow heating rate, difficulty in zone heating, and high energy consumption in the heating pad.
Using quartz heating tubes as the heat source, heating is achieved through infrared radiation. Multiple quartz heating tubes are arranged in parallel in the upper and lower heating plates, combined with cooling water pipes and hook structures, to achieve rapid and uniform heating and efficient cooling.
It achieves good heating uniformity, rapid temperature rise, precise zone heating, and low energy consumption, thereby improving the efficiency and reliability of wafer bonding.
Smart Images
Figure CN224521209U_ABST
Abstract
Claims
1. A heating plate structure using a quartz heating tube as a heat source, characterized in that, It includes a lower heating plate and an upper heating plate, and multiple quartz heating tubes are embedded in both the upper and lower heating plates. The quartz heating tubes are elongated and arranged in parallel with each other. A wafer pair is provided between the upper heating plate and the lower heating plate; a mold pair, including an upper mold and a lower mold, is provided between the upper heating plate and the lower heating plate, and graphite pads are provided above and below the wafer pair, and the graphite pads and the wafer pair are located between the upper mold and the lower mold.
2. The heating plate structure using a quartz heating tube as a heat source according to claim 1, wherein The quartz heating tubes in the upper heating plate and the lower heating plate are arranged vertically in correspondence.
3. The heating plate structure using a quartz heating tube as a heat source according to claim 1, wherein The quartz heating tube passes through both ends of the upper or lower heating plate.
4. The heating plate structure using a quartz heating tube as a heat source according to claim 1, wherein Both the upper and lower heating plates are equipped with four quartz heating tubes.
5. The heating plate structure using a quartz heating tube as a heat source according to claim 1, wherein The mold has grooves inside that are adapted to the structure of the graphite pad and the wafer pair.
6. The heating plate structure using a quartz heating tube as a heat source according to claim 1, wherein An upper cooling plate is provided above the upper heating plate, and a lower cooling plate is provided below the lower heating plate. Cooling water pipes are provided inside both the upper and lower cooling plates.
7. The heating plate structure using a quartz heating tube as a heat source according to claim 6, wherein Hooks are provided to connect the upper heating plate and the upper cold plate, as well as the lower heating plate and the lower cold plate.
8. The heating plate structure using a quartz heating tube as a heat source according to claim 7, wherein One end of the hook abuts against the lower heating plate, and the other end is connected to the lower cooling plate by a screw, with a compression spring fitted around the screw.