一种模块化PCBA电路板
By setting up heat-conducting plates and heat dissipation systems on modular PCBA circuit boards, the problem of localized high temperatures on modular circuit boards is solved, achieving effective heat transfer and active heat dissipation, and ensuring stable operation of the circuit boards.
CN224521245UActive Publication Date: 2026-07-17SHENZHEN CHUANGXIN ZHIHUI ELECTRONIC TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN CHUANGXIN ZHIHUI ELECTRONIC TECH CO LTD
- Filing Date
- 2025-04-11
- Publication Date
- 2026-07-17
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Figure CN224521245U_ABST
Abstract
本实用新型公开了一种模块化PCBA电路板，包括PCBA电路板主体，且所述PCBA电路板主体在位于每个模块电路的安装区上设有导热板，且所述导热板的厚度为5mm，在模块电路安装在安装区后模块电路的底部与导热板的顶部紧密贴合，所述导热板的两端伸出模块电路外且设有竖直向上的散热条，所述散热条的上表面散热翅片，且所述电路板主体还固定有主散热机构；本实用新型将各个模块电路安装到相应的区域上，这样将模块电路安装在导热板的顶部，这样在模块电路工作时，将产生的热量传递给导热板，在导热板传递给散热条，这样具有较好的散热效果，避免热量在模块电路与PCBA电路板主体的连接处造成堆积。
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