电路板结构及电子设备
By using a symmetrical circuit board design, the problems of large warpage and solder joint cracking in odd-layer circuit boards were solved, thereby achieving circuit board stability and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGSHAN PRECISION SINGAPORE PTE LTD
- Filing Date
- 2025-07-01
- Publication Date
- 2026-07-17
AI Technical Summary
The asymmetrical structure of odd-layer circuit boards results in large warpage and poor flatness after lamination, which makes the solder joints prone to cracking during soldering after cavity processing, increasing production costs.
The circuit board design employs a symmetrical structure, which splits the dielectric layer into multiple dielectric layers and a substrate, forming a symmetrical structure with the second substrate as the central axis. This structure includes a first dielectric layer, a second dielectric layer, a third dielectric layer, and a fourth dielectric layer, thereby enhancing the tightness of the connection.
It reduces the warpage of the circuit board, decreases the risk of solder joint cracking during soldering, lowers production costs, and improves the stability and processing efficiency of the circuit board.
Smart Images
Figure CN224521249U_ABST
Abstract
Claims
1. A circuit board structure, characterized by, include: A first circuit layer, wherein a first dielectric layer, a first substrate, a second dielectric layer, a second substrate, and a third dielectric layer are sequentially stacked on one side of the first circuit layer, wherein the first dielectric layer is used to bond the first circuit layer and the first substrate, and the second dielectric layer is used to bond the first substrate and the second substrate. A first bonding plate is disposed on the side of the third dielectric layer away from the second substrate. A fourth dielectric layer and a second circuit layer are sequentially disposed on the side of the first bonding plate away from the third dielectric layer. The third dielectric layer is used to bond the second substrate and the first bonding plate. The fourth dielectric layer is used to bond the second circuit layer and the first bonding plate. The circuit board structure forms a symmetrical structure with the second substrate as the central axis.
2. The circuit board structure according to claim 1, characterized by The second substrate has a first copper layer on the side close to the third dielectric layer, and the area of the interface between the first copper layer and the third dielectric layer is smaller than the area of the interface between the second dielectric layer and the first copper layer.
3. The circuit board structure according to claim 1, characterized by The thickness of the first substrate is 1 to 1.2 times the thickness of the first laminate excluding the circuit layer.
4. The circuit board structure according to claim 1, characterized by It also includes vias that sequentially penetrate the first circuit layer, the first dielectric layer, the first substrate, the second dielectric layer, the second substrate, the third dielectric layer, the first lamination plate, the fourth dielectric layer, and the second circuit layer.
5. The circuit board structure of claim 1, wherein The thickness of the third dielectric layer is equal to the thickness of the second dielectric layer.
6. The circuit board structure of claim 1, wherein The first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer are all prepregs.
7. The circuit board structure according to claim 2, characterized by The first copper layer includes a separation copper layer, the area of which is smaller than the area of the bottom of the preset cavity, and the single-sided gap between the separation copper layer and the bottom of the preset cavity is 0.1 mm to 0.5 mm. The preset cavity is used to accommodate components.
8. The circuit board structure according to claim 7, characterized by The first copper layer also includes a process edge, on which target points are provided for positioning of the punching machine.
9. The circuit board structure according to claim 8, characterized in that, The first copper layer also includes conductive leads, through which the separated copper is connected to the process edge.
10. An electronic device, comprising: include: The circuit board structure according to any one of claims 1 to 9.