一种PCB叠层结构

By optimizing the distance between the power and ground layers and the signal layer layout of the PCB stack-up structure, and by adopting a double ground layer structure and differential signal lines, the problems of power supply noise interference and poor electromagnetic shielding in traditional designs are solved, thereby improving the electromagnetic compatibility of the circuit board and the stability of the equipment.

CN224521251UActive Publication Date: 2026-07-17HEFEI JUYI POWER SYST CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HEFEI JUYI POWER SYST CO LTD
Filing Date
2025-07-22
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Traditional six-layer PCB stack-up designs suffer from electromagnetic compatibility issues such as power supply noise interference, insufficient signal integrity, and poor electromagnetic shielding, which affect the normal operation and stability of electronic equipment.

Method used

It adopts a dual-ground structure, differential signal lines, grid-like power wiring and a large area of ​​copper foil layer design, optimizes the distance between the power layer and the ground layer and the layout of the signal layer, forms an effective electromagnetic shielding layer, and enhances power integrity and signal integrity.

Benefits of technology

It effectively suppresses power supply noise interference, improves the accuracy and stability of signal transmission, enhances electromagnetic shielding, and ensures the stable operation of electronic equipment in complex electromagnetic environments.

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Abstract

本实用新型涉及通信设备技术领域，提供了一种PCB叠层结构，包括从顶层到底层依次设置的顶层信号层、第一电源层、第一地层、第二地层、第二电源层以及底层信号层，第一地层与所述第二地层相邻设置形成电源屏蔽层，本实用新型通过优化电源层的布线方式和层间距离，降低了电源网络的阻抗，有效减少了电源噪声的产生和传播，提高了电源完整性，为电路提供稳定可靠的电源供应，确保电子设备的正常运行，双地层结构形成了良好的电磁屏蔽层，有效抑制了电路板自身产生的电磁辐射，同时抵御了外界电磁干扰对电路板的影响，提升了电路板在复杂电磁环境下的抗干扰能力。
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Claims

1. A PCB stack-up structure, characterized by, This includes, from top to bottom, a top signal layer, a first power layer, a first ground layer, a second ground layer, a second power layer, and a bottom signal layer, wherein: The first ground layer and the second ground layer are arranged adjacently to form a power shielding layer. There is a first preset distance between the first power layer and the first ground layer, and between the second power layer and the second ground layer. There is a second preset distance between the top signal layer and the first power layer, and between the bottom signal layer and the second power layer. The first preset distance is less than the second preset distance. The electromagnetic radiation generated by the first power layer and the second power layer is absorbed or reflected by the adjacent first ground layer and the second ground layer, and it is difficult to penetrate the power shielding layer to radiate outward to the top signal layer and the bottom signal layer.

2. The PCB laminate structure of claim 1, wherein, The first preset distance is 0.12~0.18mm, and the second preset distance is 0.08~0.11mm.

3. The PCB laminate structure of claim 1, wherein, A third preset distance of 0.2~0.3 mm is also provided between the first stratum and the second stratum.

4. The PCB laminate structure of claim 1, wherein, A copper foil layer is laid on both the first and second ground layers to form a complete ground plane, and a first conductive channel is formed by multiple via arrays between the first and second ground layers.

5. The PCB laminate structure of claim 1, wherein, The first power layer and the second power layer are each provided with at least one independent power supply area. The power supply area is isolated by power lines that are orthogonally distributed in a grid pattern, and the power supply area is connected to the corresponding power pin through vias.

6. The PCB laminate structure of claim 1, wherein, Multiple vias are provided between the first power layer and the first ground layer, and between the second power layer and the second ground layer. The multiple vias are distributed in a quincunx pattern to form a second conductive channel, which is used to increase the conductive path and reduce the impedance of the power supply and ground.

7. The PCB laminate structure of claim 1, wherein, Differential signal lines are provided on the top signal layer and the bottom signal layer respectively. The differential signal lines are of equal length and equally spaced. The differential signal pairs are tightly coupled, which reduces electromagnetic radiation during signal transmission and avoids signal distortion caused by signal delay difference.

8. The PCB laminate structure of claim 1, wherein, The inner diameter of the via is 0.2~0.3mm, and the outer diameter is 0.5~0.8mm.