Side-emitting components and backlight modules

Abstract

This invention provides a side-emitting component, including a flexible circuit board and a light-emitting element attached to the flexible circuit board. The flexible circuit board includes a soldering portion, a circuit copper-clad layer, and a protective copper wire layer. The soldering portion includes a first base surface and a first side edge, with the first side edge disposed opposite to each other on both sides of the first base surface in a first direction. The circuit copper-clad layer is disposed on the first base surface. The protective copper wire layer is disposed on the outer side of the first base surface in the thickness direction. The first side edge has a pre-break groove recessed towards the inside of the soldering portion, and the protective copper wire layer is disposed inside the pre-break groove, isolating the pre-break groove from the circuit copper-clad layer. By setting the protective copper wire layer, the pre-break groove is prevented from tearing, protecting the circuit copper-clad layer circuit from damage and improving the yield rate. Compared with existing solutions, it has lower manufacturing difficulty and cost, and higher production efficiency. This invention also provides a backlight module with the above-mentioned side-emitting component.

Description

Technical Field

[0001] This utility model belongs to the field of display module technology, specifically relating to a side-emitting component and a backlight module. Background Technology

[0002] As a core component of display devices, backlight modules require larger and thinner dimensions while maintaining their light emission performance. As backlight modules become larger and thinner, the circuit boards used to mount the LED components also become thinner and longer. To further reduce the size of backlight modules, flexible printed circuit boards (FPCs) are generally used to fabricate the circuit boards.

[0003] To improve efficiency, multiple FPC substrates are first spliced ​​together into a whole during production, then copper is applied, and the basic shape is achieved by setting a pre-cut structure. In the later packaging stage, the individual FPC substrates are separated by cutting or tearing open the pre-cut structure.

[0004] However, for slender FPC substrates, the pre-break point is closer to the circuit area. During separation, traditional pre-break points are prone to tearing and extending, damaging the copper plating of the circuit, severely affecting the yield of the FPC substrate. Current solutions mostly involve improving and optimizing the flexible substrate of the FPC substrate. While this solves the tearing problem, it undoubtedly increases production steps and costs, hindering the widespread adoption of related backlight modules. Utility Model Content

[0005] To address the shortcomings of the prior art, this invention provides a side-emitting component. By setting a protective copper wire layer inside the pre-cut groove of the flexible circuit board, the structural strength of the first base surface in the pre-cut groove is improved, thereby increasing the yield of the slender flexible circuit board. The protective copper wire layer can be manufactured using the same copper-clad process as the circuit copper layer, which is less difficult and less expensive to manufacture, and has higher production efficiency.

[0006] The technical effect to be achieved by this utility model is realized through the following technical solution:

[0007] In a first aspect, this utility model provides a side-emitting component, including a flexible circuit board and a light-emitting element attached to the flexible circuit board, wherein the flexible circuit board includes:

[0008] The welding part includes a first base surface and a first side edge, wherein the first side edge is disposed opposite to both sides of the first base surface in a first direction;

[0009] A copper-clad circuit layer is disposed on the first base surface; and

[0010] A protective copper wire layer is disposed on the outer side of the first base surface in the thickness direction;

[0011] The first side is provided with a pre-break groove that is recessed toward the inside of the welding part. The protective copper wire layer is disposed inside the pre-break groove and isolates the pre-break groove from the circuit copper layer.

[0012] In some implementations, the protective copper wire layer is disposed around the inner edge of the pre-break groove.

[0013] In some implementations, the flexible circuit board further includes a bending portion, which is disposed at one end of the welding portion and extends outward in a first direction;

[0014] The bending portion includes a second base surface and a second side edge, wherein the second side edge is disposed opposite to each other on both sides of the second base surface in a second direction;

[0015] The copper-clad layer of the circuit extends from the soldering portion to the bending portion and is disposed on the second base surface.

[0016] In some implementations, at the connection between the welded portion and the bent portion, the protective copper wire layer is continuously disposed on the inner side of the first side and the second side, and the circuit copper cladding layer is isolated from the first side and the second side respectively.

[0017] In some implementations, the end of the bent portion is provided with a plug-in terminal, the circuit copper layer extends to the plug-in terminal and is electrically connected to the external circuit; the protective copper wire layer extends from the connection between the solder portion and the bent portion to the plug-in terminal.

[0018] In some implementations, the light-emitting elements come from two sets of BIN classifications with the same node voltage and wavelength, and complementary chromaticity and / or brightness, and the two sets of light-emitting elements are arranged alternately in the same row along the second direction on the welded part.

[0019] Secondly, this utility model provides a backlight module, including a display bracket, a film assembly, a light guide plate, and any of the side-emitting components described above;

[0020] The display bracket has a receiving cavity in the height direction, the light guide plate is disposed in the receiving cavity, the diaphragm assembly is disposed in the receiving cavity and located on the light guide plate, the side-emitting component is disposed in the receiving cavity and fixed to the inner wall of the receiving cavity in the longitudinal direction; the light-emitting element is disposed facing the light guide plate.

[0021] In some implementations, the receiving cavity is provided with a silicone positioning groove in the height direction, the silicone positioning groove is disposed away from the side light-emitting component, and the display bracket includes anti-loosening silicone, the anti-loosening silicone is disposed in the silicone positioning groove and abuts against the light guide plate, thereby restricting the position of the light guide plate in the receiving cavity.

[0022] In some implementations, the display bracket has a wiring groove in the height direction, the wiring groove is disposed on the same side as the side-emitting component, and the receiving cavity is connected to the external space in the longitudinal direction.

[0023] In some implementations, a fixing single-sided adhesive is also included, which is attached to the film assembly along one edge of the side-emitting component; the fixing single-sided adhesive includes an extension portion, which extends outward along the wiring groove, is then vertically bent, and attached to the display bracket.

[0024] In summary, this utility model has at least the following advantages:

[0025] 1. The side-emitting component provided by this utility model improves the structural strength of the first base surface in the pre-break groove by setting a protective copper wire layer inside the pre-break groove. When multiple flexible circuit boards are separated, the pre-break groove can be prevented from tearing, or even if tearing occurs, the tear will not extend and damage the circuit copper layer, thereby improving the yield of slender flexible circuit boards.

[0026] 2. The side-emitting component provided by this utility model can be made by copper plating process, and is formed together with the circuit copper plating layer on the first base surface. Compared with the existing reinforcement scheme, it has low manufacturing difficulty and manufacturing cost and high production efficiency.

[0027] 3. The backlight module provided by this utility model, after adopting the above-mentioned side-emitting component, can be thinner than the existing backlight module, which can meet the application scenarios with higher space requirements. Attached Figure Description

[0028] Figure 1 This is a front view of the side-emitting component in Example 1.

[0029] Figure 2 This is a front view of the flexible circuit board in Example 1.

[0030] Figure 3 This is a front view of the side-emitting component in Example 2.

[0031] Figure 4 This is an exploded view of the backlight module in Example 3.

[0032] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0033] Figure 6 for Figure 4 A magnified view of a section at point B in the middle.

[0034] Marked in the image:

[0035] 100. Side-emitting light assembly;

[0036] 200. Backlight module;

[0037] 1. Flexible circuit board; 11. Soldering part; 111. First base surface; 112. First side; 1121. Pre-cut groove; 12. Circuit copper layer; 13. Protective copper wire layer; 14. Bending part; 141. Second base surface; 142. Second side; 143. Plug-in end.

[0038] 2. Light-emitting element;

[0039] 3. Display bracket; 31. Receiving cavity; 311. Silicone positioning groove; 32. Anti-loosening silicone; 33. Cable routing groove; 331. Positioning slot; 34. Dustproof foam.

[0040] 4. Diaphragm assembly;

[0041] 5. Light guide plate;

[0042] 6. Fixing single-sided adhesive; 61. Extension section;

[0043] X1, first direction; Y1, second direction;

[0044] X2, horizontal direction; Y2, vertical direction; Z, height direction. Detailed Implementation

[0045] To facilitate understanding of this utility model, a more comprehensive description will be given below with reference to the accompanying drawings and specific embodiments. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0046] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0047] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0049] For ease of understanding, it should be noted that in the attached diagram of the flexible circuit board, the X1 axis is the first direction and the Y1 axis is the second direction; while in the attached diagram of the backlight module, the X2 axis is the horizontal direction, the Y2 axis is the vertical direction, and the Z axis is the height direction.

[0050] Example 1:

[0051] Please see Figures 1-2 This utility model provides a side-emitting component 100, mainly used in the backlight module of a display device. The side-emitting component 100 includes a flexible circuit board 1 and a light-emitting element 2 attached to the flexible circuit board 1. The flexible circuit board 1 and the light-emitting element 2 are connected by soldering and are connected to an external circuit.

[0052] Specifically, the flexible circuit board 1 includes a soldering portion 11, a circuit copper-clad layer 12, and a protective copper wire layer 13. The width direction of the soldering portion 11 is defined as the first direction X1, and its length direction as the second direction Y1. The soldering portion 11, serving as the area for soldering with the light-emitting element 2, includes a first base surface 111 and first side edges 112. The first side edges 112 are disposed opposite each other on both sides of the first base surface 111 in the first direction X1. The circuit copper-clad layer 12 is disposed on the first base surface 111, located between the first side edges 112, and electrically connects the light-emitting element 2 to an external circuit. The protective copper wire layer 13 is disposed on the outer side of the first base surface 111 in the thickness direction.

[0053] Furthermore, the first side 112 is provided with a pre-break groove 1121 recessed towards the inside of the welding part 11, and the protective copper wire layer 13 is disposed inside the pre-break groove 1121, thus isolating the pre-break groove 1121 from the circuit copper cladding layer 12.

[0054] During production, smaller or slender flexible circuit boards 1 are manufactured using a panelization process. This involves drilling holes and applying copper to multiple layers of substrate, then placing the circuit copper layer 12 onto the substrate, and finally bonding the substrates together to form the finished flexible circuit board 1. During production, to facilitate processes such as tinning, surface mounting, and soldering, the flexible circuit board 1 is pre-cut into its approximate shape and has pre-cut grooves 1121 for interlocking connections, facilitating the later separation of individual flexible circuit boards 1.

[0055] As the width of the solder joint 11 decreases, the pre-break groove 1121 gets closer and closer to the circuit. During the separation process, the pre-break groove 1121 is prone to breakage, which will eventually extend and damage the circuit copper layer 12. At the same time, the substrate at the location of the pre-break groove 1121 is relatively fragile during the separation process of the narrow and long flexible circuit board 1, and the probability of tearing is relatively high.

[0056] The protective copper wire layer 13, positioned between the pre-break groove 1121 and the circuit copper layer 12, increases the structural strength of the pre-break groove 1121, reducing the likelihood of tearing during separation. Even if tearing still occurs at the pre-break groove 1121, the protective copper wire layer 13 prevents the tear from extending into the circuit copper layer 12, thus protecting the circuit copper layer 12 from damage. Whether improving the structural strength of the pre-break groove 1121 or preventing tearing, the purpose of the protective copper wire layer 13 is to improve the yield of the slender flexible circuit board 1 and reduce production costs.

[0057] The protective copper wire layer 13 is disposed on the outer surface of the first base surface 111 in the thickness direction, and the copper plating process used for it can be the same as that used for the circuit copper plating layer 12. For the flexible circuit board 1, which already requires a copper plating process, only the copper plating area needs to be set at the corresponding position on the first base surface 111, and the protective copper wire layer 13 is formed at the same time as the circuit copper plating layer 12. Compared with the existing substrate reinforcement scheme, the manufacturing difficulty and manufacturing cost of setting the protective copper wire layer 13 are significantly reduced, and the reduction of processes will also improve production efficiency.

[0058] In some embodiments, the protective copper wire layer 13 is disposed around the inner edge of the pre-break groove 1121. The protective copper wire layer 13 is disposed only inside the pre-break groove 1121, and does not need to extend to the entire first side edge 112. This reduces cost and copper coverage area without affecting the enhancement effect.

[0059] In another embodiment, the flexible circuit board 1 further includes a bending portion 14, which is disposed at one end of the soldering portion 11 and extends outward in a first direction X1. The bending portion 14 includes a second base surface 141 and a second side 142, which are disposed opposite to each other on both sides of the second base surface 141 in a second direction Y1. The circuit copper layer 12 extends from the soldering portion 11 to the bending portion 14 and is disposed on the second base surface 141. After the soldering portion 11 is fixed, it is bent or extended outward by the bending portion 14 to make an electrical connection with an external circuit. In this embodiment, the second base surface 141 and the first base surface 111 have the same number of layers and structure in the thickness direction. During production, the second side 142, like the first side 112, is also provided with a pre-cut groove 1121 and a protective copper wire layer 13 that isolates the pre-cut groove 1121 and the circuit copper layer 12.

[0060] However, during production line processing, transportation, testing, and assembly, due to its elongated shape, the connection between the bent portion 14 and the welded portion 11, especially at the relatively short connection between the second side 142 and the first side 112, is prone to bending and tearing. Because of the larger lever arm, the tearing probability is higher than that of the pre-cut groove 1121, and the damage caused by the tearing is also greater. Therefore, in this embodiment, at the connection between the welded portion 11 and the bent portion 14, a protective copper wire layer 13 is continuously disposed inside the first side 112 and the second side 142, and the circuit copper layer 12 is isolated from the first side 112 and the second side 142 respectively.

[0061] After a protective copper wire layer 13 is provided at the connection between the welded part 11 and the bent part 14, the structural strength at this location is improved, thereby reducing the possibility of tearing or preventing the copper-clad layer 12 of the protective circuit from being damaged after tearing. Since the protective copper wire layer 13 at this location has the same protection distance and processing method as the protective copper wire layer 13 inside the pre-break groove 1121, it will not be described again here.

[0062] For a flexible circuit board 1 where both the solder portion 11 and the bending portion 14 are relatively long, providing a protective copper wire layer 13 only at the connection between the solder portion 11 and the bending portion 14 is clearly insufficient to prevent tearing at other locations of the bending portion 14. In some embodiments, the end of the bending portion 14 is provided with a plug-in terminal 143, and the circuit copper layer 12 extends to the plug-in terminal 143 and is electrically connected to an external circuit. The protective copper wire layer 13 extends from the connection between the solder portion 11 and the bending portion 14 to the plug-in terminal 143. The protective copper wire layer 13 essentially extends to cover the entire bending portion 14, thereby preventing corresponding bending tearing problems from occurring at other locations on the second side 142. In this embodiment, the protective copper wire layer 13 also extends from the connection between the solder portion 11 and the bending portion 14 toward the solder portion 11 side, thereby enhancing the structural strength around the connection between the solder portion 11 and the bending portion 14 and further reducing the possibility of tearing at that location.

[0063] In some embodiments, the first base surface 111 is provided with protective copper wire layers 13 on both outer sides in the thickness direction. The protective copper wire layers 13 on both sides provide a more comprehensive protection for the first base surface 111, greatly enhancing the structural strength and load-bearing capacity of the area where the protective copper wire layers 13 are provided.

[0064] In summary, the side-emitting component provided in this embodiment improves the structural strength of the solder joint in the pre-cut groove by setting a protective copper wire layer inside the pre-cut groove. This can prevent the pre-cut groove from tearing when multiple flexible circuit boards are separated, or even if tearing occurs, the tear will not extend and damage the circuit copper layer, thereby improving the yield of slender flexible circuit boards.

[0065] Secondly, the protective copper wire layer can be made using a copper cladding process, forming together with the circuit copper cladding layer on the first substrate. Compared to existing reinforcement solutions, it has lower manufacturing difficulty and cost, and higher production efficiency.

[0066] Example 2:

[0067] Please Figures 1-2 Based on this, refer to Figure 3 This embodiment further optimizes upon embodiment 1, providing a side-emitting component 100. The difference lies in that the light-emitting elements 2 come from two groups of BIN classifications with the same node voltage and wavelength, but complementary chromaticity and luminance, or complementary chromaticity and luminance. The two groups of light-emitting elements 2 are arranged alternately in the same row along the second direction Y1 on the welding part 11.

[0068] In actual production, the light-emitting elements 2 are graded according to BIN classification parameters such as node voltage, wavelength, chromaticity, and brightness. Those meeting the high-quality parameter range are selected and then surface-mounted onto the welding section 11. However, other defective products generated in this process are disposed of through other low-value channels, resulting in material waste. In particular, the value of light-emitting elements 2 that meet both node voltage and wavelength standards is not fully realized.

[0069] The side-emitting component 100 provided in this embodiment, with its mixed BIN classification, not only effectively eliminates the color difference and light spot problems commonly found in the arrangement of traditional light-emitting elements 2, but also significantly improves the overall luminous efficiency. While ensuring excellent optical performance, it achieves cost reduction and efficiency improvement, as well as increased utilization of the light-emitting elements 2. This provides a higher-quality and more economical backlight solution for high-end lighting and display applications.

[0070] During assembly, the two sets of light-emitting elements 2 are alternately welded onto the welding part 11. The group designation of each welding position needs to be marked on the first base surface 111 for subsequent maintenance and inspection. For example, if the two sets of light-emitting elements 2 are named group a1 and group b1, then the designation should be marked on the first base surface 111. Figure 3 The enlarged view is shown in the image.

[0071] It should be noted that the complementarity described in this embodiment is not a simple numerical complementarity, but rather refers to the fact that the chromaticity or luminance values ​​of the two groups of light-emitting elements 2 are close to the excellent range, and at least one group of values ​​does not reach the excellent standard. Through the cooperation of the two groups of light-emitting elements 2, the overall light output effect is close to the excellent standard light output effect.

[0072] The side-emitting component 100 provided in this embodiment not only ensures excellent light emission performance, but also has cost-effectiveness and product competitiveness.

[0073] Example 3:

[0074] Please Figures 1-3 Based on the above Figures 4-6 This embodiment provides a backlight module 200, including a display bracket 3, a film assembly 4, a light guide plate 5, and a side-emitting component 100 as described in either Embodiment 1 or Embodiment 2.

[0075] Specifically, the display bracket 3 has a receiving cavity 31 in the height direction Z, and the light guide plate 5 is disposed in the receiving cavity 31 and located at the bottom of the receiving cavity 31. The diaphragm assembly 4 is disposed in the receiving cavity 31 and located above the light guide plate 5, and the side-emitting component 100 is disposed in the receiving cavity 31 and fixed to the inner wall of the receiving cavity 31 in the longitudinal direction Y2. The light-emitting element 2 is positioned towards the light guide plate 5, and the emitted light enters the side of the light guide plate 5. After optical processing by the light guide plate 5 and the diaphragm assembly 4, the light is emitted outward from the receiving cavity 31 to provide backlight. The display element (not labeled) such as the liquid crystal panel is disposed above the diaphragm assembly 4, and the backlight is emitted from the diaphragm assembly 4 and enters the display element, thereby realizing the display of the display device.

[0076] In the backlight module 200 provided in this embodiment, the traditional mid-frame structure is not used to install and fix the various components. Instead, the light guide plate 5, diaphragm assembly 4, and other components are directly placed in the receiving cavity 31 of the display bracket 3. By eliminating the mid-frame structure, the backlight module 200, in conjunction with the installation of the display bracket 3, can make the display device thinner and reduce the space occupied by the display device.

[0077] In some embodiments, the receiving cavity 31 is provided with a silicone positioning groove 311 in the height direction Z. The silicone positioning groove 311 is located away from the side light-emitting component 100. The display bracket 3 includes anti-loosening silicone 32, which is disposed in the silicone positioning groove 311 and abuts against the light guide plate 5. When the light guide plate 5 is pressed, the anti-loosening silicone 32 deforms and absorbs energy, keeping the light guide plate 5 in a clamped state, ensuring that the light guide plate 5 does not loosen during the operation of the backlight module 200. Preferably, the anti-loosening silicone 32 can be provided with steps in the horizontal X2 and vertical Y2 directions, so that the light guide plate 5 can be accurately positioned in the horizontal X2 and vertical Y2 directions, limiting the position of the light guide plate 5 in the receiving cavity 31.

[0078] In other embodiments, the display bracket 3 has a wiring groove 33 in the height direction Z. The wiring groove 33 is located on the same side as the side-emitting component 100 and connects the receiving cavity 31 to the external space in the longitudinal direction Y2. The wiring groove 33 is a reserved wiring groove for the terminal display element, which facilitates the lead-out of the corresponding line of the display element after installation and its electrical connection to the external control circuit. In this embodiment, since the backlight module 200 has a large length-to-width ratio, the wiring groove 33 is located in the middle of the long side. In actual installation, the display element can be mirror-mounted in the receiving cavity 31, thereby using existing display elements for splicing and avoiding the cost increase caused by customized production.

[0079] Of course, the bent portion 14 of the side-emitting component 100 can also be achieved by splicing. The bent portion 12 bends outward and extends outward through the wiring groove 33, and then the plug-in end 143 is plugged into the external control circuit. However, in order to ensure the consistency of the backlight module 200, this embodiment uses a set of side-emitting components 100. After the welding portion 11 is fixed, the welding portion 11 is bent along the inner wall of the receiving cavity 31, and then the bent portion 12 is passed through the hole structure at the bottom of the receiving cavity 31 to complete the electrical connection with the external circuit. The wiring groove 33 can also be set near the corner of the receiving cavity 31 to adapt to different wiring requirements.

[0080] Furthermore, the backlight module 200 of this embodiment also includes a fixing single-sided adhesive 6, which is attached to the film assembly 4 along one edge of the side-emitting component 100. The film assembly 4 is fixed in the horizontal X2 and vertical Y2 positions within the receiving cavity 31 through different mounting structures, while the fixing single-sided adhesive 6 restricts the height Z direction of the film assembly 4 within the receiving cavity 31, ensuring that the relative position of the film assembly 4 and the display bracket 3 remains unchanged.

[0081] The fixing single-sided adhesive 6 includes an extension portion 61. The extension portion 61 extends outward along the wiring groove 33, is then vertically bent, and adheres to the display bracket 3. The extension portion 61 increases the adhesion of the fixing single-sided adhesive 6 to the display bracket 3, thereby strengthening the fixation of the film assembly 4. If the bent portion 14 of the side-emitting component 100 passes through the wiring groove 33, the extension portion 61 can also bond and fix the bent portion 14. In addition to fixing the film assembly 4, the fixing single-sided adhesive 6 also serves to shield light, blocking bright spots and uneven brightness in the light-emitting element 2.

[0082] In this embodiment, the wiring groove 33 is provided with a positioning slot 331 on the side facing the receiving cavity 31 for positioning the diaphragm assembly 4 and the fixing single-sided adhesive 6. Each diaphragm of the diaphragm assembly 4 and the fixing single-sided adhesive 6 abut against the positioning slot 331 by setting a matching extension structure, so as to achieve rapid positioning in the receiving cavity 31 in the horizontal X2 and vertical Y2 directions.

[0083] Due to the frameless design, dust or foreign objects can easily enter the product through the gaps in the wiring groove 33 during assembly and transportation. Even after the display components are installed, gaps may still exist. Therefore, in this embodiment, dustproof foam 34 is also attached inside the wiring groove 33. The elastic deformation of the dustproof foam 34 adapts to different installation tolerances to fill the gaps in the wiring groove 33, preventing dust and foreign objects from entering the product and thus ensuring a high yield rate.

[0084] In summary, the backlight module provided in this embodiment, after adopting the aforementioned side-emitting components, can be thinner than existing backlight modules, meeting the needs of application scenarios with higher space requirements.

[0085] The above description is merely an example and illustration of the structure of this utility model, and while the description is quite specific and detailed, it should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these obvious substitutions all fall within the protection scope of this utility model.

Claims

1. A side-emitting component, comprising a flexible circuit board (1) and a light-emitting element (2) attached to the flexible circuit board (1), characterized in that, The flexible circuit board (1) includes: The welding part (11) includes a first base surface (111) and a first side edge (112), wherein the first side edge (112) is disposed opposite to each other on both sides of the first base surface (111) in a first direction (X1); A copper-clad circuit layer (12) is disposed on the first base surface (111); and A protective copper wire layer (13) is disposed on the outside of the first base surface (111) in the thickness direction; The first side (112) is provided with a pre-break groove (1121) recessed towards the inside of the welding part (11), and the protective copper wire layer (13) is disposed inside the pre-break groove (1121) and isolates the pre-break groove (1121) from the circuit copper layer (12).

2. The side light assembly of claim 1, wherein, The protective copper wire layer (13) is disposed around the inner edge of the pre-broken groove (1121).

3. The side light assembly of claim 1, wherein, The flexible circuit board (1) further includes a bending portion (14), which is disposed at one end of the welding portion (11) and extends outward in a first direction (X1); The bent portion (14) includes a second base surface (141) and a second side edge (142), the second side edge (142) being disposed opposite to each other on both sides of the second base surface (141) in a second direction (Y1); The circuit copper cladding layer (12) extends from the soldering part (11) to the bending part (14) and is disposed on the second base surface (141).

4. The side light assembly of claim 3, wherein, At the connection between the welding part (11) and the bending part (14), the protective copper wire layer (13) is continuously disposed on the inner side of the first side (112) and the second side (142), and isolates the circuit copper layer (12) from the first side (112) and the second side (142) respectively.

5. The side light assembly of claim 3, wherein, The end of the bent portion (14) is provided with a plug-in end (143), the circuit copper layer (12) extends to the plug-in end (143) and is electrically connected to the external circuit; the protective copper wire layer (13) extends from the connection between the solder portion (11) and the bent portion (14) to the plug-in end (143).

6. The side light assembly of claim 1, wherein, The light-emitting elements (2) are from two groups of BIN classifications with the same node voltage and wavelength, and complementary chromaticity and / or brightness, and the two groups of light-emitting elements (2) are arranged in the same row along the second direction (Y1) on the welding part (11) at intervals.

7. A backlight module characterized by It includes a display bracket (3), a diaphragm assembly (4), a light guide plate (5), and a side-emitting component (100) as described in any one of claims 1-6; The display bracket (3) has a receiving cavity (31) in the height direction (Z), the light guide plate (5) is disposed in the receiving cavity (31), the diaphragm assembly (4) is disposed in the receiving cavity (31) and located on the light guide plate (5), the side light-emitting assembly (100) is disposed in the receiving cavity (31) and fixed to the inner wall of the receiving cavity (31) in the longitudinal direction (Y2); the light-emitting element (2) is disposed facing the light guide plate (5).

8. The backlight module of claim 7, wherein, The receiving cavity (31) is provided with a silicone positioning groove (311) in the height direction (Z). The silicone positioning groove (311) is located away from the side light-emitting component (100). The display bracket (3) includes anti-loosening silicone (32). The anti-loosening silicone (32) is disposed in the silicone positioning groove (311) and abuts against the light guide plate (5) to restrict the position of the light guide plate (5) in the receiving cavity (31).

9. The backlight module of claim 7, wherein, The display bracket (3) has a wiring groove (33) in the height direction (Z), the wiring groove (33) is arranged on the same side as the side light-emitting component (100), and connects the receiving cavity (31) to the external space in the longitudinal direction (Y2).

10. The backlight module of claim 9, wherein, It also includes a fixing single-sided adhesive (6), which is attached to the film assembly (4) along one side edge of the side-emitting component (100); the fixing single-sided adhesive (6) includes an extension portion (61), which extends outward along the wiring groove (33), is then bent vertically and attached to the display bracket (3).

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