一种塑封耐压防水结构的印制电路板
The design of the buffer sleeve and sealing cap with plastic encapsulation solves the stability and sealing problems of printed circuit boards in complex environments, and provides convenient operation and efficient waterproof performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINDAXING ELECTRIC TECH CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
AI Technical Summary
Existing printed circuit boards are easily damaged by vibration, shock, water immersion, and dust intrusion. Traditional sealing structures are cumbersome to operate and have reduced sealing performance, making it difficult to balance convenience with waterproof and pressure-resistant requirements.
It adopts a plastic-sealed structure, including a buffer sleeve and a sealing cap. The buffer sleeve is composed of a rubber sleeve, a sponge ring and a metal ring, which provides cushioning and shock absorption. The sealing cap is composed of an L-shaped slide rail, a transparent plastic slide cover and a rubber bending ring, which achieves convenient sealing and waterproofing.
It achieves buffering and shock absorption in complex environments, improves the stability and sealing performance of the circuit board, ensures reliable structural fixation, and facilitates wire connection operations.
Smart Images
Figure CN224521255U_ABST
Abstract
Claims
1. A printed circuit board with a plastic-encapsulated, pressure-resistant, and waterproof structure, characterized in that: The circuit includes a printed circuit board body (1), the surface of which is covered with a plastic encapsulation structure (2), a buffer sleeve (3) is embedded in the circular through holes near the four corners of the printed circuit board body (1), a slot (4) is provided on the plastic encapsulation structure (2) adjacent to the rectangular through hole, and a sealing cap (5) is welded to the surface of the plastic encapsulation structure (2) at the rectangular through hole.
2. The printed circuit board of claim 1, wherein: the plastic package pressure-resistant waterproof structure is formed by: forming a first layer of plastic on the surface of the printed circuit board; forming a second layer of plastic on the first layer of plastic; and forming a third layer of plastic on the second layer of plastic. The buffer sleeve (3) consists of a rubber sleeve (301) embedded in the circular through holes near the four corners of the printed circuit board body (1), a sponge ring (302) pasted and fixed on the upper and lower surfaces of the rubber sleeve (301), and a metal ring (303) pasted on the surface of the sponge ring (302).
3. The printed circuit board of claim 2, wherein: the plastic encapsulation is a molding compound; and the molding compound is a molding compound that is a liquid at room temperature and solidifies at room temperature. The edge of the circular through hole of the printed circuit board body (1) is engaged in the annular groove on the outside of the rubber sleeve (301).
4. The printed circuit board of claim 3, wherein: the plastic encapsulation is formed of a material having a dielectric constant of 3.0 or less. The sealing cover (5) includes an L-shaped slide rail (501) symmetrically welded to the surface of the plastic sealing structure (2) at both ends of the rectangular through hole, a transparent plastic slide cover (502) slidably mounted on the L-shaped slide rail (501), a rubber bending ring (503) bonded and fixed to the bottom edge of the transparent plastic slide cover (502), and an elastic retaining plate (504) welded to the middle of the front end of the transparent plastic slide cover (502).
5. The printed circuit board with a plastic-encapsulated, pressure-resistant, and waterproof structure according to claim 4, characterized in that: The sealing cap (5) also includes a rubber pad (505) that is bonded and fixed to the surface of the plastic sealing structure (2) at the edge of the rectangular through hole.
6. The printed circuit board of claim 5, wherein: the plastic encapsulation is a molding compound; and the molding compound is a liquid encapsulation material. The lower end of the elastic plate (504) is inserted into the groove (4) on the surface of the plastic sealing structure (2) to lock the position of the transparent plastic sliding cover (502).
7. The printed circuit board of claim 6, wherein: the plastic encapsulation is a molding compound; and the molding compound is a liquid encapsulation material. The upper end of the rubber pad (505) corresponds to the notch on the bottom surface of the rubber bending ring (503). The surface of the rubber pad (505) is evenly distributed with multiple grooves. The bottom surface of the rubber bending ring (503) is provided with a groove corresponding to the groove of the rubber pad (505). The rubber bending ring (503) and the rubber pad (505) cooperate to seal the gap between the rectangular through hole of the plastic sealing structure (2) and the transparent plastic sliding cover (502).