一种固定FPC的模组结构
By adding cross-shaped solder pads to the backlight frame and using solder paste to fix the FPC, combined with the protective film design, the problem of FPC falling off under low temperature conditions was solved, achieving a stable fixing effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TRULY OPTO ELECTRONICS
- Filing Date
- 2025-06-09
- Publication Date
- 2026-07-17
AI Technical Summary
Under extreme low temperature conditions, the adhesion between the FPC and the backlight frame in the vehicle display module weakens, leading to a risk of detachment.
A cross-shaped solder pad is added to the backlight iron frame, and the FPC is fixed by soldering it to the solder paste through the circular solder pad. A protective film is pasted on the other side of the conductive double-sided adhesive, and a double-insurance structure is adopted to enhance the adhesion stability.
The adhesion stability between the FPC and the backlight frame is enhanced under low temperature conditions, avoiding the risk of detachment, and the protective film is protected from dust contamination to ensure the fixing effect.
Smart Images
Figure CN224521259U_ABST
Abstract
Claims
1. A module structure for fixing an FPC, characterized by, It includes: Backlight frame (1), the back of which is provided with solder pads (2); FPC (3), FPC (3) is provided with circular pads (4), the circular pads (4) are soldered to the pad positions (2) by solder paste (5); Conductive double-sided adhesive (6), one side of which is bonded and fixed to FPC (3), and the other side of which is used to bond and fix to backlight iron frame (1).
2. The fixed FPC module structure according to claim 1, wherein, The number of the solder pads (2) is four, and the four solder pads (2) are set at the four corners of the back of the backlight iron frame (1). The number of the circular solder pads (4) is four, and the four circular solder pads (4) are set at the four corners of the FPC (3).
3. The fixed FPC module structure according to claim 1, wherein, A cross soldering position (201) is fixedly connected to the solder pad (2), and a cross through hole (401) is opened on the circular solder pad (4).
4. The fixed FPC module structure according to claim 3, wherein, The cross weld position (201) protrudes from the back of the backlight iron frame (1), and the cross through hole (401) is larger than the size of the cross weld position (201).
5. The fixed FPC module structure according to claim 4, wherein, The circular pad (4) has an exposed copper area, and the size of the circular pad (4) is adapted to the pad position (2).
6. The fixed FPC module structure according to claim 5, wherein, The surface of the cross-shaped welding position (201) is plated with copper or aluminum.
7. The fixed FPC module structure according to claim 6, wherein, The cross welding position (201) is fixedly connected to the connection end of the backlight iron frame (1) with a boss (202). The boss (202) has the same thickness as the conductive double-sided adhesive (6), and the boss (202) is larger than the size of the cross welding position (201).
8. The fixed FPC module structure of claim 1, wherein, A protective film (601) is pasted on the other side of the conductive double-sided adhesive (6), and a tear handle (602) is fixedly connected to the protective film (601).
9. The fixed FPC module structure according to claim 8, wherein, The protective film (601) includes a first film (6011) and a second film (6012). The first film (6011) and the second film (6012) are located on the left and right sides of the conductive double-sided adhesive (6). There are two tear handles (602), which are located at the outer corners of the first film (6011) and the second film (6012), respectively.
10. The fixed FPC module structure of claim 9, wherein, The protective film (601) is made of PET material, and both the first film (6011) and the second film (6012) are larger than the edge of the conductive double-sided adhesive (6).