一种能够根据空间布局进行多次弯折多层线路板
By introducing a metal and ceramic layer structure into the multilayer circuit board and combining it with retaining components and copper components for fixation, the problem of the circuit board's inability to bend is solved, enabling flexible installation and efficient space utilization, while also improving service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN RUIBANG MULTILAYER PCB TECH LTD
- Filing Date
- 2025-09-25
- Publication Date
- 2026-07-17
AI Technical Summary
Existing multilayer circuit boards cannot be bent according to the actual space layout, resulting in installation difficulties and low space utilization.
Metal and ceramic layers are added between multi-layer circuit boards, and partition grooves are made in the ceramic layer. The boards are fixed by adhesive layers. The rigidity of the metal layer and the toughness of the ceramic layer are used to achieve multiple bends. Combined with the fixing structure of retaining components and copper components, the circuit boards can be installed according to the spatial layout.
It enables the circuit board to be bent multiple times, improving installation flexibility and space utilization, and extends service life through the cooling structure of the metal layer.
Smart Images
Figure CN224521265U_ABST