深度检测装置、基板及基板加工系统

Abstract

本实用新型公开了一种深度检测装置、基板及基板加工系统，涉及控深检测技术领域，深度检测装置包括：接触检测模块和连接模块；接触检测模块，分别与连接模块以及加工主轴连接，连接模块用于将接触检测模块与基板中一个目标基准层连接，以使刀具接触到与接触检测模块连接的目标基准层时，接触检测模块向基板加工设备发送接触信号。有效的避免了错误的接触信号输出有以及刀具在背钻加工过程受到铜屑、电磁干扰或者刀具侧壁触碰其他导电层等因素的影响，导致目标基准层的位置检测精度较低的技术问题，提高了检测精度。

Claims

1. A depth detection device, characterized in that, An apparatus for processing substrates, the substrate processing equipment including a processing spindle capable of holding a cutting tool to process a substrate, the substrate including at least one target reference layer, the depth detection device comprising: Contact detection module and connection module; The contact detection module is connected to the connection module and the machining spindle respectively. The connection module is used to connect the contact detection module to a target reference layer in the substrate, so that when the tool contacts the target reference layer connected to the contact detection module, the contact detection module sends a contact signal to the substrate processing equipment.

2. The depth detection device as described in claim 1, characterized in that: The first end of the contact detection module is connected to the first end of the connection module; The second end of the contact detection module is connected to the first end of the machining spindle; The second end of the connection module is connected to the target reference layer of the substrate.

3. The depth detection device of claim 2, wherein, The substrate processing equipment also includes a processing system; The third end of the contact detection module is connected to the first end of the processing system; The third end of the connection module is connected to the second end of the processing system.

4. The depth detection device of claim 3, wherein, The connection module includes an electronically controlled switch, and the target reference layer is equipped with a connection interface or wires; The first end of the electronically controlled switch is connected to the first end of the contact detection module; The second end of the electronically controlled switch is connected to the connection interface or the movable end of the wire; The third terminal of the electronically controlled switch is connected to the second terminal of the processing system.

5. The depth detection device of claim 4, wherein, The electrically controlled switch includes one or more, and the number of target reference layers is the same as the number of electrically controlled switches, wherein: The location of one or more of the target reference layers corresponds to the signal layer of the current back-drilling task.

6. The depth detection device as described in claim 3, characterized in that, The depth detection device also includes a switching control module; The third end of the connection module is connected to the first end of the switching control module; The second end of the switching control module is connected to the second end of the processing system.

7. A substrate, characterized by, The substrate includes: Target baseline layer; The target reference layer includes a target reference layer for the substrate in the depth detection apparatus according to any one of claims 1 to 6.

8. The substrate of claim 7, wherein, The substrate further includes a conductive layer; An isolation medium is provided between the target reference layer and the conductive layer, and / or an isolation medium is provided between adjacent target reference layers.

9. The substrate of claim 7, wherein, The target reference layer includes a power layer or a ground layer.

10. A substrate processing system, characterized by, The substrate processing system includes substrate processing equipment and the depth detection device as described in any one of claims 1 to 6.

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