一种防PCB分层的分片工装
By designing a segmented tooling to prevent PCB delamination, and utilizing a combination of limit bolts and limit components, the problem of PCB delamination caused by manual operation was solved, thereby improving product yield and quality.
CN224521279UActive Publication Date: 2026-07-17TIANJIN MEISEN ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TIANJIN MEISEN ELECTRONICS CO LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-17
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Figure CN224521279U_ABST
Abstract
本实用新型涉及PCB分片技术领域,且公开了一种防PCB分层的分片工装,包括正边板,所述正边板的侧面设置有后边板,所述正边板与后边板之间设置有分片组件,所述分片组件包括下压板、上压板、连接螺栓、链接弹簧、弧形槽、斜槽。该防PCB分层的分片工装利用分片组件的设置,在需要对PCB产品进行分片时,根据PCB产品的厚度调整限位螺栓与螺母之间的配合长度,之后将PCB产品插入上压板与下压板之间的空隙中,待PCB板与上压板和下压板之间的间隙完全吻合后,工作人员两只手握持装置两侧的正边板与后边板,并将其朝向同一侧弯曲掰动,此时PCB产品被分开成四片成品,在提高产品的良率同时提高了产品的品质,避免出现分层现象。
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