A hot air leveling device for PCB board processing

Abstract

This utility model discloses a hot air leveling device for PCB board processing, belonging to the field of PCB board processing technology. The hot air leveling device mainly includes a frame, a lower conveyor, an upper cover, and an upper conveyor. A second motor is installed on the side of the frame; a lower conveyor is installed on the side of the inner wall of the frame; an upper cover is installed on the upper side of the frame, and a first motor is installed on the side of the upper cover; an upper conveyor is installed on the side of the inner wall of the upper cover; a round rod is directly or indirectly installed on the conveying surface of the upper conveyor, a connecting rod is installed on the circumferential wall of the round rod, and a box is installed at the bottom end of the connecting rod; a leveling component is installed on the inner wall of the box; a cooling component is installed on the inner wall of the upper cover, away from the upper conveyor; heating components are symmetrically arranged on both sides of the bottom end of the box. Compared with the prior art, this utility model reduces the risk of PCB board quality defects and improves the hot air leveling effect to a certain extent, thus having high practicality.

Description

Technical Field

[0001] This utility model relates to the field of PCB board processing technology, and in particular to a hot air leveling device for PCB board processing. Background Technology

[0002] PCBs, also known as printed circuit boards, are the key carriers for the electrical connections of electronic components. They occupy a central position in the electronics manufacturing industry due to their significant advantages—significantly reducing wiring and assembly error rates, and significantly improving automation levels and labor efficiency. Based on the number of layers, PCBs include single-sided, double-sided, four-layer, six-layer, and multi-layer boards.

[0003] In the PCB manufacturing process, hot air leveling is a crucial step to ensure quality and requires a hot air leveling device. This device typically consists of a frame, a conveyor module within the frame, an auxiliary frame at the top of the frame, and a solder sprayer and air knife mounted on the auxiliary frame. Its working principle is as follows: the conveyor module first performs the loading operation; when the PCB arrives at the designated working position, the conveyor module pauses; subsequently, the solder sprayer applies solder to the PCB, followed by air cleaning by the air knife, thus achieving hot air leveling; finally, the conveyor module restarts, sending the processed PCB out.

[0004] However, the above-mentioned traditional working mode has the following drawbacks: In order to ensure the smooth transmission of PCB boards, the reserved spacing between the auxiliary frame and the conveying module, although meeting the transmission requirements, leads to heat loss during the operation, which may affect the stability of the PCB board processing temperature; and temperature fluctuations generally increase the risk of PCB board quality defects, which has a significant impact on the hot air leveling effect. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a PCB board processing hot air leveling device, mainly comprising a frame, a lower conveyor, an upper cover, an upper conveyor, a connecting rod, a leveling component, an air-cooling component, and a heating component. In use, the box, leveling component, heating component, and lower conveyor cooperate to form a sealed space. Under the action of the upper conveyor, this sealed space surrounds the PCB board and moves synchronously with it. Furthermore, during this synchronous movement, the heating component is in close contact with the conveying surface of the lower conveyor, a design that allows the sealed space to store the heat generated during PCB board processing. Compared to existing technologies, this utility model reduces the risk of PCB board quality defects and improves the hot air leveling processing effect to a certain extent, thus possessing high practicality.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A hot air leveling device for PCB board processing includes:

[0008] The frame has a second motor mounted on its side;

[0009] A lower conveyor is used to move the PCB board. The lower conveyor is disposed on the side of the inner wall of the frame, and one end of the lower conveyor is connected to the drive end of the second motor.

[0010] An upper cover is mounted on the frame, and a first motor is provided on the side of the upper cover;

[0011] An upper conveyor is disposed on the side of the inner wall of the upper cover, and one end of the upper conveyor is connected to the drive end of the first motor;

[0012] A connecting rod, the top of which is directly or indirectly set on the conveying surface of the upper conveying component via a round rod, and a box is provided at the bottom;

[0013] A leveling component is connected to the inner wall of the box body;

[0014] An air-cooled component is disposed on the side of the upper cover away from the upper conveyor component;

[0015] in,

[0016] Heating elements are symmetrically arranged on both sides of the bottom of the box; when processing PCB boards, the heating elements are in contact with the conveying surface of the lower conveyor.

[0017] Furthermore, the upper conveyor includes:

[0018] The driving components are symmetrically arranged on both sides of the inner wall of the upper cover, and the end of the driving component is connected to the driving end of the first motor.

[0019] The transmission components are symmetrically arranged on both sides of the inner wall of the upper cover. The ends of the transmission components are rotatably connected to the inner wall of the upper cover, and the transmission components and the driving components are spaced apart.

[0020] Two synchronous belts are provided, which are fitted onto the drive component and the transmission component.

[0021] Furthermore, the PCB board processing hot air leveling device also includes:

[0022] Mounting bases are rotatably mounted at both ends of the round rod, and the mounting bases are connected to the conveying surface of the synchronous belt;

[0023] Multiple rectangular rods are arranged in a linear array along the length of the circular rod. The rectangular rods are located between two synchronous belts and extend toward the top of the upper cover. The top of the rectangular rods and the top of the upper cover are on the same horizontal line, and the rectangular rods are slidably connected to the inner wall of the upper cover.

[0024] A top plate is located at the top of the upper cover, and the bottom end of the top plate is connected to the top end of the rectangular rod;

[0025] in,

[0026] The top of the upper cover has several through slots, the inner wall of the through slots is slidably connected to the side wall of the rectangular rod, and the through slots are adapted to the rectangular rod.

[0027] Furthermore, the leveling component includes:

[0028] A spray nozzle is connected to the inner wall of the box body, the spray nozzle extends toward the upper side of the box body, and the top end of the spray nozzle is connected to the bottom end of the connecting rod;

[0029] A hot air generator is located at the top of the housing;

[0030] An air knife is disposed on the side of the inner wall of the box. The air knife is connected to the hot air generator, and the working end of the air knife is opposite to the conveying surface of the lower conveyor.

[0031] Furthermore, the heating element includes:

[0032] Heaters are located on both sides of the bottom end of the box body;

[0033] An outer frame heat insulation bracket is disposed on the side of the heater away from the housing;

[0034] An inner frame heat-conducting bracket is disposed on the side of the heater near the housing;

[0035] The bottom frame is fitted to the conveying surface of the lower conveyor. The top of the bottom frame is connected to the bottom of the inner frame heat-conducting frame, the top of the bottom frame is connected to the bottom of the outer frame heat-insulating frame, and the top of the bottom frame is connected to the bottom of the heater.

[0036] Furthermore, the air-cooled component includes:

[0037] A flexible hose is installed inside the upper cover, with a main pipe at one end and a fan at the other end;

[0038] The nozzle is located at the air outlet end of the main pipe, and the working end of the nozzle is opposite to the conveying surface of the lower conveyor.

[0039] The lifting device has its non-driving end connected to the top of the inner wall of the upper cover, and its driving end connected to the outer peripheral wall of the main pipe. The lifting device and the hose are spaced apart.

[0040] Furthermore, the lower conveyor includes:

[0041] A drive roller is disposed on the inner wall of the frame. One end of the drive roller is rotatably connected to one side of the inner wall of the frame, and the other end is connected to the drive end of the second motor.

[0042] A drive roller is disposed on the inner wall of the frame, and the end of the drive roller is rotatably connected to the side of the inner wall of the frame;

[0043] A conveyor belt is fitted onto the drive roller and the transmission roller.

[0044] Furthermore, the PCB board processing hot air leveling device also includes:

[0045] The first limiting plate, which is several in number, is equidistantly arranged on the conveying surface of the conveyor belt, and the cross-section of the first limiting plate is L-shaped.

[0046] The number of second limiting plates is equal to the number of first limiting plates. The second limiting plates are equidistantly arranged on the conveying surface of the conveyor belt, and the cross-section of the second limiting plates is L-shaped.

[0047] The beneficial effects of this utility model are:

[0048] The PCB board processing hot air leveling device provided by this utility model includes a box, a leveling component, a heating component, and a lower conveyor component. These components work together to form a sealed space. Under the action of the upper conveyor component, this sealed space surrounds the PCB board and moves synchronously with it. This design provides the prerequisite for the normal processing of PCB boards. In addition, during the processing of the PCB board, the heating component and the conveying surface of the lower conveyor component are in contact. During the aforementioned synchronous movement, the sealed space can store the heat generated during the processing of the PCB board, increasing the probability of maintaining a stable processing temperature for the PCB board, thereby reducing the risk of quality defects in the PCB board and improving the processing effect of hot air leveling. Therefore, it has high practicality. Attached Figure Description

[0049] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0050] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0051] Figure 2 This utility model Figure 1 A schematic diagram of the cross-sectional structure;

[0052] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;

[0053] Figure 4 This is a simplified assembly structure diagram of the upper conveyor, mounting base, round rod, rectangular rod, and top plate of this utility model.

[0054] Figure label:

[0055] 1. Conveyor belt; 11. First limiting plate; 12. Second limiting plate; 13. Transmission roller; 14. Drive roller;

[0056] 2. Frame; 21. First motor; 22. Second motor;

[0057] 3. Top cover; 31. Top plate; 32. Rectangular rod; 33. Through groove; 34. Round rod; 35. Connecting rod;

[0058] 4. Fan; 41. Hose; 42. Telescopic rod; 43. Main pipe; 44. Electric actuator; 45. Nozzle;

[0059] 5. Synchronous belt; 51. Drive component; 52. Transmission component; 53. Mounting base;

[0060] 6. Box body; 61. Power supply; 62. Sprayer; 63. Hot air generator; 64. Air knife; 65. Outer frame heat insulation frame; 66. Heater; 67. Bottom frame; 68. Inner frame heat conduction frame. Detailed Implementation

[0061] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0062] Please see Figures 1-4This embodiment discloses a hot air leveling device for PCB board processing, which includes a frame 2, which has a U-shaped structure. A second motor 22 is arranged on the side of the frame 2. A lower conveyor (not marked in the figure) is arranged on the side of the inner wall of the frame 2. One end of the lower conveyor is connected to the drive end of the second motor 22. The lower conveyor is used to move the PCB board. An upper cover 3 is arranged on the upper side of the frame 2. A first motor 21 is arranged on the side of the upper cover 3. An upper conveyor (not marked in the figure) is arranged on the side of the inner wall of the upper cover 3. One end of the upper conveyor is connected to the drive end of the first motor 21. A round rod 34 is directly or indirectly arranged on the conveying surface of the upper conveyor. A connecting rod 35 is arranged on the peripheral wall of the round rod 34. A box 6 is arranged at the bottom end of the connecting rod 35. The inner wall of the box body 6 is provided with a leveling component (not marked in the figure); the inner wall of the upper cover 3 is provided with a cooling component (not marked in the figure), which is located away from the upper conveyor, i.e., the cooling component and the upper conveyor are located on opposite sides inside the upper cover 3; heating components (not marked in the figure) are symmetrically arranged on both sides of the bottom end of the box body 6; when processing the PCB board, the heating components are in contact with the conveying surface of the lower conveyor, and the box body 6, the leveling component, the heating component, and the lower conveyor can work together to form a sealed space; under the action of the upper conveyor, the sealed space can surround the periphery of the PCB board and move synchronously with the PCB board; in addition, during the synchronous movement, the heating component is in contact with the conveying surface of the lower conveyor, and this design allows the sealed space to store the heat generated when processing the PCB board. Compared with the prior art, this utility model reduces the risk of PCB board quality defects and improves the processing effect of hot air leveling to a certain extent, thus having high practicality.

[0063] In a specific application scenario, as shown in the appendix Figure 2 and appendix Figure 4As shown, the upper conveyor includes a drive component 51, a transmission component 52, and a synchronous belt 5. The drive component 51 is symmetrically arranged on both sides of the inner wall of the upper cover 3. The end of the drive component 51 is connected to the drive end of the first motor 21, i.e., there are two first motors 21, and the two first motors 21 operate in different ways. The drive end of one rotates counterclockwise, and the drive end of the other rotates clockwise. The transmission component 52 is symmetrically arranged on both sides of the inner wall of the upper cover 3. The end of the transmission component 52 is rotatably connected to the inner wall of the upper cover 3, and the transmission component 52 is spaced apart from the drive component 51. There are two synchronous belts 5, which are sleeved on the drive component 51 and the transmission component 52. In use, both first motors 21 are in working condition, driving the drive component 51 to rotate, and the drive component 51 drives the transmission component 52 to rotate. During this process, the two synchronous belts 5 mentioned above move in one direction, that is, the box 6, leveling component, heating component, lower conveyor component, round rod 34, connecting rod 35 and leveling component can move along the conveying direction of the synchronous belt 5, thereby achieving the purpose of the aforementioned sealed space surrounding the periphery of the PCB board and moving synchronously with the PCB board. The sealed space is adapted to the PCB board.

[0064] Furthermore, as shown in the appendix Figure 2 and appendix Figure 4 As shown, mounting seats 53 are rotatably provided at both ends of the round rod 34. The mounting seats 53 are connected to the conveying surface of the synchronous belt 5. This design facilitates the synchronous movement of the aforementioned sealed space and the synchronous belt 5. This is existing technology, and the relevant details will not be elaborated. Multiple rectangular rods 32 are arranged in a linear array along the length of the round rod 34. The rectangular rods 32 are located between the two synchronous belts 5 and extend towards the top of the upper cover 3. The top of the rectangular rods 32 and the top of the upper cover 3 are roughly on the same horizontal line. Normally, the top of the upper cover 3 has several through slots 33. The number of through slots 33 is equal to the number of rectangular rods 32. The inner wall of the through slots 33 is slidably connected to the side wall of the rectangular rods 32. The through slots 33 are adapted to the rectangular rods 32. A top plate 31 is provided at the top of the upper cover 3 along its width direction. The bottom end of the top plate 31 is connected to the top of the rectangular rods 32. Under the action of the rectangular rods 32, the top plate 31 can move left and right along the length of the upper cover 3. In use, the rectangular rod 32 works in conjunction with the through groove 33 to guide the movement of the round rod 34.

[0065] In a specific application scenario, as shown in the appendix Figure 3As shown, the leveling component includes a sprayer 62, a hot air generator 63, and an air knife 64. The sprayer 62 is connected to the inner wall of the housing 6, extends upwards towards the housing 6, and its top end is connected to the bottom end of the connecting rod 35. The hot air generator 63 is located at the top of the housing 6. An air knife 64 is located on the side of the inner wall of the housing 6, communicating with the hot air generator 63, and its working end is opposite to the conveying surface of the lower conveyor. Typically, a power supply 61 is located at the top of the housing 6, electrically connected to the sprayer 62, the hot air generator 63, and the air knife. This design provides power support for this embodiment, ensuring its normal operation.

[0066] In a specific application scenario, as shown in the appendix Figure 3 As shown, the heating element includes a heater 66, an outer frame heat insulation frame 65, an inner frame heat-conducting frame 68, and a bottom frame 67. The heater 66 is located on both sides of the bottom of the housing 6 and is electrically connected to the aforementioned power supply 61. The heater 66 is used for heating. An outer frame heat insulation frame 65 is located on the side of the heater 66 away from the housing 6, and this outer frame heat insulation frame 65 is used for heat insulation. An inner frame heat-conducting frame 68 is located on the side of the heater 66 closest to the housing 6, and this inner frame heat-conducting frame 68 provides heat insulation for the heater. The protective effect of component 66 is achieved by a bottom frame 67 fitted onto the conveying surface of the lower conveyor. The top of the bottom frame 67 is connected to the bottom of the inner frame heat-conducting frame 68, the bottom of the outer frame heat insulation frame 65, and the bottom of the heater 66. In other words, the bottom frame 67 spans the outer frame heat insulation frame 65, the heater 66, and the inner frame heat-conducting frame 68, protecting the corresponding structures of these components. Furthermore, the heater 66, power supply 61, sprayer 62, hot air generator 63, and air knife 64 are all existing technologies and will not be described in detail further.

[0067] In a specific application scenario, as shown in the appendix Figure 1 and appendix Figure 2As shown, the air-cooled component includes a hose 41, a nozzle 45, and a lifting device (not marked in the figure). The hose 41 is located inside the upper cover 3. One end of the hose 41 is connected to a main pipe 43, and the other end is connected to a fan 4. The fan 4 is located at the top of the upper cover 3 and is used to generate airflow, which can be delivered to the main pipe 43 via the hose 41. The outlet end of the main pipe 43 is connected to a nozzle 45, and the working end of the nozzle 45 is opposite to the conveying surface of the lower conveyor. That is, the airflow in the main pipe 43 can be sprayed out through the nozzle 45 and then act on the PCB board on the lower conveyor. The top of the inner wall of the upper cover 3 is provided with a lifting device. The drive end of the lifting device is connected to the outer peripheral wall of the main pipe 43, and the lifting device is spaced apart from the hose 41. In actual use, the telescopic rod 42 or the electric push rod 44 can be used as the lifting device in this embodiment; of course, the telescopic rod 42 and the electric push rod 44 can also be combined as the lifting device in this embodiment, as shown in the attached figure. Figure 1 As shown, as long as the main pipe 43 can move up and down, thus guiding the movement of the main pipe 43, the staff can choose the appropriate solution according to their needs. The specific details will not be elaborated here.

[0068] In a specific application scenario, as shown in the appendix Figure 1 and appendix Figure 2 As shown, the lower conveyor includes a drive roller 14, a transmission roller 13, and a conveyor belt 1; wherein, the drive roller 14 is disposed on the inner wall of the frame 2, one end of the drive roller 14 is rotatably connected to one side of the inner wall of the frame 2, and the other end of the drive roller 14 is connected to the drive end of the second motor 22; the transmission roller 13 is disposed on the inner wall of the frame 2, and the end of the transmission roller 13 is rotatably connected to the side of the inner wall of the frame 2; the conveyor belt 1 is sleeved on the transmission roller 13 and the drive roller 14.

[0069] Furthermore, as shown in the appendix Figure 1 and appendix Figure 3 As shown, a plurality of first limiting plates 11 are equidistantly arranged on the conveying surface of the conveyor belt 1. The first limiting plates 11 have an L-shaped cross-section. A plurality of second limiting plates 12 are equidistantly arranged on the conveying surface of the conveyor belt 1. The number of second limiting plates 12 is equal to the number of first limiting plates 11. The second limiting plates 12 have an L-shaped cross-section. Furthermore, the second limiting plates 12 are inverted L-shaped, while the first limiting plates 11 are upright L-shaped. That is, the cooperation of the first limiting plates 11 and the second limiting plates 12 can limit the PCB board placed on the conveyor belt 1. In addition, the plane area formed by the middle of the first limiting plates 11 and the second limiting plates 12 is equal to the plane area formed by the bottom of the aforementioned sealed space. That is, when the bottom of the sealed space is in contact with the conveying surface of the conveyor belt 1, one side of the sealed space is in contact with the inner wall of the first limiting plate 11, and the other side of the sealed space is in contact with the inner wall of the second limiting plate 12.

[0070] In use, firstly, the second motor 22 is started to rotate the drive roller 14; then, the transmission roller 13 rotates synchronously with the drive roller 14, thereby driving the conveyor belt 1 to move; then, the PCB board is placed on the conveyor surface of the conveyor belt 1, and the PCB board is positioned using the adjacent first limiting plate 11 and second limiting plate 12; during this process, the PCB board can gradually move closer to the inside of the upper cover 3 as the conveyor belt 1 moves; next, the two first motors 21 are started to rotate the two drive components 51 (one clockwise and the other counterclockwise); then, the two transmission components 52 rotate, thereby driving the two synchronous belts 5 to move; at the same time, within a certain range inside the upper cover 3, the two synchronous belts 5 and the conveyor belt 1 are in a state of synchronous movement; during this process, the movement of the two synchronous belts 5 will drive the two mounting seats 53 to move, thereby driving the round rod 34 to move synchronously as well;

[0071] When the PCB board moves to the appropriate position inside the upper cover 3, the round rod 34 moves to the lower side of the synchronous belt 5; then, with the assistance of the connecting rod 35, the box 6, the bottom frame 67, and the inner frame heat conduction frame 68 can be moved down and come into contact with the conveying surface of the conveyor belt 1; in this process, the aforementioned sealed space is formed, the PCB board is located in the sealed space, and the sealed space and the PCB board move synchronously; then, the circuit between the heater 66 and the power supply 61 is connected, and with the assistance of the inner frame heat conduction frame 68, the PCB board in the sealed space is heated to increase the ambient temperature of the PCB board;

[0072] Next, the spray gun 62 is started to perform solder spraying on the upper surface of the PCB board; after the solder spraying is completed, the spray gun 62 is stopped; then, the hot air generator 63 is started, which generates hot air and delivers it to the air knife 64; then, the air knife 64 is used to blow clean the PCB board after solder spraying, thus completing the hot air leveling process of the PCB board; then, the round rod 34 moves to the bend of the synchronous belt 5 near the main pipe 43, and the box body 6 and other components move upward, exposing the PCB board and continuing to move along the conveyor surface of the conveyor belt 1; at this time, the purpose of sealed synchronous movement of the PCB board and hot air leveling is achieved, which effectively reduces the risk of defects in the PCB board, reduces working time, and to a certain extent ensures the effect and quality of hot air leveling;

[0073] When the PCB board moves to the lower side of the main pipe 43, the fan 4 is started; then, the airflow generated by the fan 4 can move along the hose 41 to the main pipe 43; then, the airflow in the main pipe 43 is sprayed out from the working end of the nozzle 45, thereby realizing the cooling operation of the PCB board; in addition, the operator can start the lifting equipment to adjust the main pipe 43 to a suitable position, and then adjust the distance between the nozzle 45 and the PCB board, so that this embodiment can cool PCB boards of different thicknesses, thereby improving the production quality of PCB boards to a certain extent.

[0074] Typically, this embodiment also includes a controller (not shown in the figure), which is electrically connected to the first motor 21, the second motor 22, the fan 4, the telescopic rod 42, the electric push rod 44, the nozzle 45, the power supply 61, the sprayer 62, the hot air generator 63, the air knife 64, and the heater 66. This design facilitates the operator's adjustment of the working status of the corresponding components in this embodiment at any time. Furthermore, considering temperature factors, the operator can use heat-resistant materials to manufacture the corresponding components in this embodiment, which can extend the service life of this embodiment to a certain extent.

[0075] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A hot air leveling device for PCB processing, characterized in that, include: The frame (2) has a second motor (22) on its side; The lower conveyor is used to move the PCB board. The lower conveyor is disposed on the side of the inner wall of the frame (2). One end of the lower conveyor is connected to the drive end of the second motor (22). The upper cover (3) is mounted on the frame (2), and the side of the upper cover (3) is provided with a first motor (21). An upper conveyor is disposed on the side of the inner wall of the upper cover (3), and one end of the upper conveyor is connected to the drive end of the first motor (21); The connecting rod (35) is directly or indirectly set on the conveying surface of the upper conveyor through a round rod (34) at its top end, and a box (6) is set at its bottom end. The leveling component is connected to the inner wall of the box body (6); An air-cooled component is disposed on the side of the upper cover (3) away from the upper conveyor component; in, Heating elements are symmetrically arranged on both sides of the bottom end of the box (6); when processing the PCB board, the heating elements are in contact with the conveying surface of the lower conveyor.

2. The PCB board processing hot air leveling device according to claim 1, characterized in that, The upper conveyor includes: The driving component (51) is symmetrically arranged on both sides of the inner wall of the upper cover (3), and the end of the driving component (51) is connected to the driving end of the first motor (21). The transmission component (52) is symmetrically arranged on both sides of the inner wall of the upper cover (3). The end of the transmission component (52) is rotatably connected to the inner wall of the upper cover (3), and the transmission component (52) and the driving component (51) are spaced apart. Two synchronous belts (5) are fitted onto the drive member (51) and the transmission member (52).

3. The PCB board processing hot air leveling device according to claim 2, characterized in that, Also includes: Mounting base (53) is rotatably disposed at both ends of the round rod (34), and the mounting base (53) is connected to the conveying surface of the synchronous belt (5); There are multiple rectangular rods (32), which are arranged in a linear array along the length of the round rod (34). The rectangular rods (32) are located between two synchronous belts (5). The rectangular rods (32) extend toward the top of the upper cover (3). The top of the rectangular rods (32) and the top of the upper cover (3) are on the same horizontal line. The rectangular rods (32) are slidably connected to the inner wall of the upper cover (3). The top plate (31) is located at the top of the upper cover (3), and the bottom end of the top plate (31) is connected to the top end of the rectangular rod (32); in, The top of the upper cover (3) is provided with several through grooves (33), the inner wall of the through grooves (33) is slidably connected to the side wall of the rectangular rod (32), and the through grooves (33) are adapted to the rectangular rod (32).

4. The hot air leveling apparatus for processing a PCB board according to any one of claims 1 to 3, wherein The leveling component includes: The spray nozzle (62) is connected to the inner wall of the box body (6), the spray nozzle (62) extends toward the upper side of the box body (6), and the top end of the spray nozzle (62) is connected to the bottom end of the connecting rod (35). A hot air generator (63) is disposed at the top of the housing (6); An air knife (64) is disposed on the side of the inner wall of the box (6). The air knife (64) is connected to the hot air generator (63), and the working end of the air knife (64) is opposite to the conveying surface of the lower conveyor.

5. The PCB board processing hot air leveling device according to claim 4, wherein, The heating element includes: Heaters (66) are disposed on both sides of the bottom end of the box body (6); An outer frame heat insulation bracket (65) is disposed on the side of the heater (66) away from the housing (6); The inner frame heat-conducting bracket (68) is disposed on the side of the heater (66) near the box body (6); The bottom frame (67) is attached to the conveying surface of the lower conveyor. The top of the bottom frame (67) is connected to the bottom of the inner frame heat-conducting frame (68), the top of the bottom frame (67) is connected to the bottom of the outer frame heat insulation frame (65), and the top of the bottom frame (67) is connected to the bottom of the heater (66).

6. The PCB board processing hot air leveling device according to any one of claims 1-3 or claim 5, characterized in that, The air-cooled component includes: A hose (41) is provided inside the upper cover (3). One end of the hose (41) is provided with a main pipe (43), and the other end is provided with a fan (4). The nozzle (45) is located at the air outlet end of the main pipe (43), and the working end of the nozzle (45) is opposite to the conveying surface of the lower conveyor. The lifting device has its non-driving end connected to the top of the inner wall of the upper cover (3), the driving end of the lifting device connected to the outer peripheral wall of the main pipe (43), and the lifting device and the hose (41) are spaced apart.

7. The PCB processing hot air lamination apparatus according to any one of claims 1-3 or 5, wherein The lower conveyor includes: A drive roller (14) is disposed on the inner wall of the frame (2). One end of the drive roller (14) is rotatably connected to one side of the inner wall of the frame (2), and the other end is connected to the drive end of the second motor (22). A drive roller (13) is disposed on the inner wall of the frame (2), and the end of the drive roller (13) is rotatably connected to the side of the inner wall of the frame (2). The conveyor belt (1) is fitted onto the drive roller (14) and the transmission roller (13).

8. The PCB board processing hot air leveling device of claim 7, wherein, Also includes: The first limiting plate (11) is of several kinds. The first limiting plate (11) is equidistantly arranged on the conveying surface of the conveyor belt (1). The cross-section of the first limiting plate (11) is L-shaped. The number of the second limiting plate (12) is equal to the number of the first limiting plate (11). The second limiting plate (12) is equidistantly arranged on the conveying surface of the conveyor belt (1). The cross-section of the second limiting plate (12) is L-shaped.

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