一种回流焊冷却装置

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By installing a mesh plate at the bottom of the ventilation plate of the reflow soldering cooling device, the problem of liquefied rosin dripping is solved by using its through-hole ventilation holes and gaps to absorb rosin, thus achieving the goals of reducing product contamination and maintaining cooling effect.

CN224521300UActive Publication Date: 2026-07-17GOODWE TECHNOLOGIES CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: GOODWE TECHNOLOGIES CO LTD
Filing Date: 2025-08-01
Publication Date: 2026-07-17

AI Technical Summary

Technical Problem

During the reflow soldering process, liquefied rosin frequently drips onto the surface of PCBA products, causing product contamination.

Method used

A mesh plate is installed at the bottom of the ventilation plate of the reflow soldering cooling device. The mesh plate has ventilation holes and gaps that run through it from top to bottom. Cold air flows through the ventilation holes, and after the rosin is vaporized, it enters the gaps to be absorbed and dispersed, preventing it from condensing into droplets.

Benefits of technology

It effectively reduces the dripping of liquefied rosin, lowers the risk of product contamination, and maintains the cooling effect.

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Abstract

本实用新型公开了一种回流焊冷却装置，涉及回流焊技术领域。回流焊冷却装置包括通风板和固定于通风板底部的网板；通风板上设有多个上下贯通的第一通风孔，网板上设有与各第一通风孔分别对应连通的第二通风孔，第二通风孔上下贯通，网板上还分布有多个上下贯通的网板缝隙。冷风可经第一通风孔、第二通风孔向下流动，保证正常的冷却功能。网板上还分布有多个网板缝隙，在环境中飘浮有气化的松香时，可向上进入网板缝隙中或渗入通风板与网板之间的装配间隙中，在松香吸附到通风板上冷凝液化后，会分散到各网板缝隙中以避免汇集，可有效减少液化的松香凝结成液滴，或停留在风板与网板的装配间隙以避免掉落，可有效改善液化的松香频繁滴落的问题。

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Claims

1. A reflow soldering cooling device, characterized by, Includes a ventilation panel (2) and a mesh panel (3) fixed to the bottom of the ventilation panel (2); The ventilation plate (2) is provided with a plurality of first ventilation holes (23) that are vertically connected. The mesh plate (3) is provided with second ventilation holes (31) that are respectively connected to each of the first ventilation holes (23). The second ventilation holes (31) are vertically connected. The mesh plate (3) is also provided with a plurality of mesh plate gaps (32) that are vertically connected.

2. The reflow solder cooling device according to claim 1, characterized by The mesh plate (3) covers the entire bottom surface of the ventilation plate (2), and the area of the mesh plate (3) outside the second ventilation hole (31) is covered with mesh plate gaps (32).

3. The reflow solder cooling device of claim 1, wherein The mesh panel (3) is woven from silk threads, and the weaving gap is the mesh panel gap (32).

4. The reflow solder cooling device of claim 1, wherein, The mesh plate (3) is made of stainless steel mesh, iron mesh, aluminum mesh or velvet mesh.

5. The reflow solder cooling device of claim 1, wherein, The mesh gap (32) extends in a bent or inclined manner in the vertical direction.

6. The reflow solder cooling device of claim 1, wherein, The mesh plate (3) is bolted to the ventilation plate (2).

7. The reflow soldering cooling device according to any one of claims 1 to 6, characterized in that The ventilation plate (2) includes a main body (22) and a frame (21). The frame (21) is a ring structure that runs vertically through the top and bottom. The main body (22) is fixed to the bottom of the frame (21) and covers the bottom opening of the frame (21). The first ventilation hole (23) is located on the main body (22).

8. The reflow soldering cooling device according to claim 7, characterized in that It also includes an air duct (1), the top surface of the frame (21) being connected to the bottom surface of the air duct (1); The bottom of the air duct (1) is provided with two sliders (15). The sliders (15) are L-shaped structures composed of a first rod (151) and a second rod (152). The top of the first rod (151) is fixed to the bottom of the air duct (1), and the top of the second rod (152) is fixed to the bottom of the first rod (151) and flipped relative to the first rod (151). The first rods (151) of the two sliders (15) are parallel to the first direction and arranged along the second direction. The second rods (152) of the two sliders (15) are flipped in opposite directions. The top of the frame (21) is provided with two L-shaped grooves (24), which are slidably connected to the two sliders (15) along the first direction and support the frame (21) upward through the second rod (152).

9. The reflow solder cooling device of claim 8, wherein, The air duct (1) is rotatably connected to a baffle (16) at one end face in the first direction; the baffle (16) rotates so that its bottom end abuts against an outer side of the frame (21) in the first direction.

10. The reflow solder cooling device of claim 7, wherein, It also includes an air duct (1), the top surface of the frame (21) being connected to the bottom surface of the air duct (1); The air duct (1) has two guide blocks (13) fixed at one end in the first direction, and the two guide blocks (13) protrude from both sides of the air duct (1) in the second direction respectively; The air duct (1) has a latch (14) fixed on the other end face in the first direction. The latch (14) includes a fixed arm (141) and a rotating arm (142). The rotating arm (142) rotates relative to the fixed arm (141) to open or close the opening on the fixed arm (141).