一种立体分层布线的紧凑型电路板
By using a three-dimensional layered wiring structure and replacing traditional screw connections with snap-fit and spring structures, the reliability issues of installation and disassembly of compact circuit boards are solved, achieving stable installation and disassembly and providing additional protection and support.
CN224521382UActive Publication Date: 2026-07-17SHENZHEN FENGDAXING ELECTRONICS DEVELOPMENT CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN FENGDAXING ELECTRONICS DEVELOPMENT CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Traditional screw mounting methods for compact circuit boards are prone to thread stripping, affecting the reliability and manufacturability of installation and disassembly operations.
Method used
It adopts a three-dimensional layered wiring structure, and uses components such as mounting base, card slot, support and limit rod to replace the traditional screw connection through snap-fit and spring structure to achieve stable installation and disassembly of circuit board.
Benefits of technology
It enables stable installation and removal of circuit boards, avoids thread stripping issues, improves installation and removal efficiency, and provides additional protection and support to ensure the stability and protection of the circuit boards.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224521382U_ABST
Abstract
本实用新型涉及紧凑型电路板技术领域，特别是一种立体分层布线的紧凑型电路板，包括安装底架，所述安装底架的一端安装有两个中空结构的安装座，所述安装底架另一端的侧壁开设有两个卡接口，所述安装底架的顶部设置有电路板本体。本实用新型的优点在于：通过设置安装底架、第一卡座和第二卡座，第一卡座和第二卡座分别安装在电路板本体的两端位置，同时两个凹形座分别安装在安装座的内部，两个第一卡扣分别与两个卡接口相卡接，进而便于对电路板本体稳定安装在安装底架的顶面位置，同时便于代替传统的螺钉连接，并实现对电路板本体的安装和拆卸操作，整体结构简单，设计合理，节省安装和拆卸时间，便于进行推广使用。
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