铜排散热结构及测试装置

Abstract

本实用新型涉及一种铜排散热结构及测试装置，铜排散热结构包括支撑件，支撑件包括第一侧面，第一侧面设有用于容纳铜排的容纳槽，支撑件内还有与容纳槽连通的风道，风道用于与气体发生装置连通。气体发生装置产生的气流能够通过风道吹向容纳槽内的铜排，利用风冷的方式带走铜排因铜排的引脚和被测模块的端子之间的电流通过产生的热量，从而能够降低铜排的温度，确保铜排能够正常工作，保护铜排和被测模块，同时延长铜排的使用寿命；并且，该铜排散热结构的结构简单，便于拆装和更换，成本较低。

Claims

1. A copper busbar heat dissipation structure, characterized in that, The support (1) includes a first side (11) with a receiving groove (111) for accommodating a copper busbar (5). The support (1) also has an air duct (12) communicating with the receiving groove (111) and the air duct (12) is used to communicate with a gas generating device.

2. The copper busbar heat dissipation structure according to claim 1, wherein, The air duct (12) includes a connecting section (121) and a plurality of air outlet sections (122). The connecting section (121) extends along the length direction of the support member (1), and each air outlet section (122) is arranged at intervals along the length direction of the support member (1). The two ends of each air outlet section (122) are respectively connected to the bottom wall of the receiving groove (111) and the connecting section (121).

3. The copper busbar heat spreading structure of claim 2, wherein, The number of air ducts (12) is at least two, and each of the connecting sections (121) is arranged in parallel intervals on a plane parallel to the bottom wall of the receiving groove (111).

4. The copper busbar heat spreading structure of claim 2, wherein, At least one end of the connecting section (121) extends to the end face of the support member (1), and the copper busbar heat dissipation structure further includes a connector (2) that is sealed to the end of the connecting section (121), the connector (2) being used to communicate with the gas generating device.

5. The copper busbar heat spreading structure of claim 1, wherein, The bottom wall of the receiving groove (111) is provided with a plurality of support parts (13), and each support part (13) is arranged at intervals along the length direction of the support member (1).

6. The copper busbar heat spreading structure of claim 1, wherein, The support member (1) also includes a second side (14) adjacent to the first side (11). The second side (14) is provided with a plurality of limiting parts (15). Each limiting part (15) is arranged at intervals along the length direction of the support member (1) and corresponds to the pin (51) of the copper busbar (5).

7. The copper busbar heat spreading structure of claim 1, wherein, The support member (1) also includes a third side (17) facing away from the first side (11), the third side (17) is provided with a through hole (16), and the copper busbar heat dissipation structure also includes a metal part (3) disposed on the third side (17), the metal part (3) is provided with an assembly hole (31) corresponding to the through hole (16).

8. The copper busbar heat spreading structure of claim 1, wherein, The bottom wall of the receiving groove (111) is provided with a plurality of first grooves (18), each of the first grooves (18) being arranged at intervals along the length direction of the support member (1) and corresponding to the pins (51) of the copper busbar (5); The copper busbar heat dissipation structure also includes multiple temperature sensors (4), each of which is embedded in one of the first grooves (18).

9. A test device, characterized by Includes the copper busbar heat dissipation structure as described in any one of claims 1-8.

10. The test device of claim 9, wherein, The testing apparatus also includes: Capacitor (200), including stacked busbar (201); The first copper busbar assembly (300) includes a first copper busbar (301) and a first support structure (302), wherein the first support structure (302) presses and fixes the first copper busbar (301) to one side of the stacked busbar (201); and, The second copper bar assembly (400) comprises a second copper bar (401) and a second support structure (402), and the second support structure (402) tightly fixes the second copper bar (401) to the side of the laminated busbar (201) away from the first copper bar (301). At least one of the first support structure (302) and the second support structure (402) is the copper bar heat dissipation structure.

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