数据中心
By modularizing the power supply and load groups in the data center and sharing the cooling system, the problems of high maintenance costs for independent air conditioning and large space occupation of power supply units are solved, achieving cost savings and improved heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DELTA ELECTRONICS (SHANGHAI) CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-07-17
AI Technical Summary
The independent control and maintenance of air conditioning in the power distribution area and the server room area in existing data centers leads to high maintenance costs. The power supply equipment is high-power and occupies a lot of space, which affects the space layout and production costs.
The power supply unit is located in the power distribution unit, and the load group is located in the load unit. A modular design is adopted. The cooling system is connected to the power distribution unit and the load unit, and they share the same cooling system to reduce the configuration of refrigeration equipment. The cooling system of the load group is used to provide cooling for the power supply unit and the load group.
It reduces maintenance and production costs, extends the lifespan of power supply equipment, optimizes space utilization and heat dissipation, and reduces the cost of low-voltage cables.
Smart Images
Figure CN224521397U_ABST
Abstract
Claims
1. A data center, characterized by, include: Power Distribution Department; The load section is disposed adjacent to the power distribution section; At least one power supply device is installed within the power distribution unit; At least one load group is disposed within the load section, and the load group includes at least one load. A cooling system, at least partially connected to the power distribution unit and the load unit, for cooling the power supply unit and the load group.
2. The data center of claim 1, wherein, Each load group includes at least two loads arranged along a first direction; Wherein, along the first direction, the power supply device is disposed on at least one side of the load group, and the power supply device and the load group have a straight-line structure.
3. The data center of claim 2, wherein, The load groups are arranged along the second direction, the power supply devices are arranged along the second direction, and at least one power supply device and at least one load group are correspondingly arranged along the first direction; The first direction and the second direction are perpendicular to each other.
4. The data center of claim 2, wherein, Along the second direction, the depth of the power supply device is L1, and the depth of the load is L2; Where L1-L2≤0.1*L2, and the second direction is set perpendicular to the first direction.
5. The data center of claim 2, wherein, Along the first direction, the power supply device and the corresponding load group are located in the same area.
6. The data center of claim 2, wherein, It also includes a partition disposed between the power supply device and the load group.
7. The data center of claim 3, wherein, The cooling system includes: The heat dissipation channel is at least partially disposed within the power distribution section and the load section; A cooling device is connected to the heat dissipation channel, and the power distribution unit and the load unit share the cooling device.
8. The data center of claim 7, wherein, The heat dissipation channel includes: A cold aisle extends along the first direction and is disposed between two adjacent load groups; and / or, the cold aisle is disposed on the outer side of two adjacent load groups along the second direction; A thermal aisle extends along the first direction and is disposed between two adjacent load groups; and / or, the thermal aisle is disposed on the outer side of two adjacent load groups along the second direction; Wherein, the hot aisle is disposed between two adjacent cold aisles; or, the cold aisle is disposed between two adjacent hot aisles; The cooling device is connected to the cold channel and the hot channel. The cold air generated by the cooling device is delivered to the load group and the power supply device through the cold channel, and the cold air is heated and then flows back to the cooling device through the hot channel.
9. The data center of claim 8, wherein, The projection of the cold aisle onto a plane perpendicular to the second direction and the projections of the load group and the corresponding power supply device onto a plane perpendicular to the second direction both overlap at least partially. And / or, the projection of the thermal channel along a plane perpendicular to the second direction at least partially overlaps with the projection of the load group and the corresponding power supply device along a plane perpendicular to the second direction.
10. The data center of claim 9, wherein, The heat dissipation channel also includes a cold connection channel, which is located on one side of the load group along the third direction and is connected to the cooling device and the cold channel respectively. And / or, the heat dissipation channel further includes a thermal connection channel, which is disposed on the other side of the load group along the third direction, and the thermal connection channel is connected to the thermal channel and the cooling device respectively; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
11. The data center of claim 10, wherein, Along the third direction, the height of the hot channel is greater than or equal to the height of the cold channel; And / or, the load group and the power supply device are provided with cold ventilation holes on the side facing the cold aisle; And / or, the load group and the power supply device are provided with heat vents on the side facing the heat channel.
12. The data center of claim 7, wherein, The heat dissipation channel includes a first cold channel and a second cold channel, which are respectively disposed on both sides of the load group and / or the power supply device along the second direction; The cooling system further includes a heat exchanger, and the cooling device is connected to the heat exchanger. The heat exchanger is located on the side of the load group and / or the power supply device facing the first cold channel, so that the hot air generated by the load group and / or the power supply device is turned into cold air through the heat exchanger, and the cold air is delivered to the second cold channel through the first cold channel.
13. The data center of claim 12, wherein, The cooling device is connected to the heat exchanger via cold pipes and hot pipes. The projections of the cold pipes and / or the hot pipes onto a plane perpendicular to the second direction at least partially overlap with the projections of the load group and the corresponding power supply device onto a plane perpendicular to the second direction. Along the first direction, the sum of the lengths of the load group and the corresponding power supply device is less than or equal to the lengths of the cold piping and / or the hot piping.
14. The data center of claim 12, wherein, The heat dissipation channel also includes an intermediate channel, which is located on one side of the load group and the power supply device along a third direction. The first cold channel is connected to the second cold channel through the intermediate channel. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
15. The data center of claim 3, wherein, The power supply device and / or the load group are liquid-cooled with internal circulation cooling. The cooling system also includes a cooling device and a heat exchanger. The cooling device is connected to the heat exchanger through cold pipes and hot pipes. The heat exchanger is located on one side of the load group and / or the power supply device along the second direction. The coolant heated by the load group and / or the power supply device is cooled by the heat exchanger. The projection of the cold pipes and / or the hot pipes along the second direction and the projection of the load group and the corresponding power supply device along a plane perpendicular to the second direction both at least partially overlap.
16. The data center of claim 12, wherein, The heat exchanger is at least one of a water-air heat exchanger and a water-water heat exchanger.
17. The data center of claim 12, wherein, The heat exchanger includes a load heat exchanger and a power supply heat exchanger, and the cooling system further includes: The first circulating water path, the cooling device is connected to the load heat exchanger corresponding to the load group through the first circulating water path; The first regulating valve is located in the first circulating water circuit; The second circulating water path connects the cooling device to the power supply heat exchanger corresponding to the power supply device through the second circulating water path. The second regulating valve is located in the second circulating water circuit.
18. The data center of claim 9, wherein, The cooling system also includes: A top heat exchanger is disposed above the load group and / or the power supply device in a third direction, and the cooling device is connected to the top heat exchanger through a first pipe; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
19. The data center of claim 1, wherein, The power supply device includes at least one solid-state transformer, the input of which is medium voltage, and the load unit also includes at least one distribution cabinet and one battery cabinet.
20. The data center of claim 2, wherein, It includes at least two load groups arranged along a second direction, and a power supply device disposed on one side of one of the load groups along a first direction, the power supply device supplying power to the at least two load groups.
21. The data center of claim 17, wherein, The first circulating water path is directly connected to the cooling device and the load heat exchanger, and the second circulating water path is directly connected to the cooling device and the power supply heat exchanger.
22. The data center of claim 21, wherein, The first and second circulating water paths include a main cooling pipe and a plurality of sub-cooling pipes connected to the main cooling pipe. The main cooling pipe of the first and second circulating water paths is connected to the cooling device. Each sub-cooling pipe of the first circulating water path is used to connect to one or more of the load heat exchangers. Each sub-cooling pipe of the second circulating water path is used to connect to one or more of the power supply heat exchangers. The first and second circulating water paths contain coolant.
23. The data center of claim 22, wherein, The first regulating valve is installed in the main cooling pipe of the first circulating water circuit, the second regulating valve is installed in the main cooling pipe of the second circulating water circuit, and the plurality of sub-cooling pipes of the first circulating water circuit and the second circulating water circuit are provided with a third regulating valve.
24. The data center of claim 1, wherein, Each load group includes at least two loads arranged along a first direction; In this configuration, the load group is located on one side of the power supply device along a third direction, and the third direction is perpendicular to the first direction.
25. The data center of claim 24, wherein, The load groups are arranged along the second direction, the power supply devices are arranged along the second direction, and at least one power supply device and at least one load group are arranged correspondingly along the third direction; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
26. The data center of claim 25, wherein, The cooling system includes: A cooling device is shared by the power distribution unit and the load unit; The heat exchanger is connected to the cooling device and is correspondingly connected to the load group and the power supply device. The heat exchanger also includes a load heat exchanger and a power supply heat exchanger. The first circulating water path, the cooling device is connected to the load heat exchanger corresponding to the load group through the first circulating water path; The second circulating water path connects the cooling device to the power supply heat exchanger corresponding to the power supply device.
27. The data center of claim 26, wherein, The first circulating water path and the second circulating water path are connected in series.
28. The data center of claim 26, wherein, The first circulating water path comprises a cold water path and a hot water path, and the cooling device is communicated with the load heat exchanger corresponding to the load group through the cold water path and the hot water path of the first circulating water path; the second circulating water path comprises a cold water path and a hot water path, and the cooling device is communicated with the power supply heat exchanger corresponding to the power supply device through the cold water path and the hot water path of the second circulating water path, and the first circulating water path and the second circulating water path are connected in parallel.
29. The data center of claim 24, wherein, The projection of the power supply device and the load group on a horizontal plane at least partially overlaps.