一种手机用高导热石墨片散热结构
By designing a combined structure of heat dissipation shell, heat dissipation components and heat dissipation plate inside the mobile phone, the problem of poor adhesion between the high thermal conductivity graphite sheet and the heat-generating components is solved, achieving efficient heat transfer and heat dissipation, ensuring stable operation of the mobile phone and extending the life of electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIANHE GREEN ENERGY TECHNOLOGY (SUZHOU) CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-17
AI Technical Summary
Existing high thermal conductivity graphite sheet heat dissipation structures for mobile phones suffer from complex structures and poor fit with heat-generating components, resulting in poor heat dissipation performance and failing to meet the ever-increasing heat dissipation demands of mobile phones.
The structure includes a heat dissipation shell, heat dissipation components and a heat spreader. It utilizes a combination of first and second graphite sheets, a corrugated connecting layer, a thermally conductive silicone layer and a heat spreader, and achieves efficient heat transfer and dissipation through the cooperation of heat dissipation grooves and heat dissipation fins.
It improves heat transfer efficiency, enhances heat dissipation, ensures stable operation of the phone, extends the lifespan of electronic components, and adapts to the complex internal spatial structure of the phone.
Smart Images
Figure CN224521399U_ABST
Abstract
Claims
1. A high-thermal-conductivity graphite sheet heat dissipation structure for a mobile phone, comprising a heat dissipation shell (1) and a heat dissipation assembly (2), characterized in that: The heat dissipation shell (1) is provided with a mobile phone motherboard (3). The mobile phone motherboard (3) includes a board body (31). Multiple sets of heat-generating components (32) are provided on one side of the board body (31). The heat dissipation assembly (2) includes a first graphite sheet layer (21) located on one side of the heat-generating component (32). A second graphite sheet layer (22) is provided between the board body (31) and the inner wall of the heat dissipation shell (1). A connecting layer (23) is provided between the first graphite sheet layer (21) and the second graphite sheet layer (22) located on the outer side of the board body (31). A heat dissipation plate (24) is provided on the outer ring of the heat dissipation assembly (2) and the mobile phone motherboard (3) located on the inner side of the heat dissipation shell (1). Multiple sets of heat dissipation grooves (4) are opened on the inner wall of the heat dissipation shell (1). Multiple sets of heat dissipation fins (5) are provided in each set of heat dissipation grooves (4).
2. The high thermal conductive graphite sheet heat dissipation structure for a mobile phone according to claim 1, characterized in that: The mounting end of the heating element (32) is installed corresponding to one side of the plate (31), one side of the first graphite sheet (21) is in contact with the heating element (32), and the upper and lower sides of the second graphite sheet (22) are in contact with the heat dissipation shell (1) and the side of the plate (31) that are close to each other.
3. The high thermal conductive graphite sheet heat dissipation structure for a mobile phone according to claim 1, characterized in that: The inner side of the connecting layer (23) is closely attached to the outer side of the plate (31). The connecting layer (23) is arranged in a wave shape. The upper and lower sides of the connecting layer (23) are respectively installed on the side close to the first graphite sheet layer (21) and the second graphite sheet layer (22).
4. The high thermal conductive graphite sheet heat dissipation structure for a mobile phone according to claim 1, characterized in that: A thermally conductive silicone layer (25) is provided between the first graphite sheet layer (21) and the plate body (31). Multiple sets of adapter grooves are provided on the thermally conductive silicone layer (25), and the outer ring of each set of heating components (32) is tightly fitted to the inner wall of the adapter groove.
5. The high thermal conductive graphite sheet heat dissipation structure for a mobile phone according to claim 4, characterized in that: The inner ring of the heat dissipation plate (24) is installed in correspondence with the outer ring of the heat dissipation component (2) and the mobile phone motherboard (3), and the outer ring of the heat dissipation plate (24) is installed in correspondence with the inner wall of the heat dissipation shell (1).
6. The high thermal conductive graphite sheet heat dissipation structure for a mobile phone according to claim 5, characterized in that: The inner wall of the heat sink (4) is arc-shaped. The mounting end of the heat sink (5) is installed corresponding to the inner wall of the heat sink (4). One side of the heat sink (5) is in contact with the outer ring of the heat spreader (24). The surface of the heat sink (5) is coated with a heat dissipation coating.