具有复合导热结构的电源
By using a composite thermal conductivity structure of graphene heat sink and heat pipe, the problems of aging thermal conductive adhesive and poor temperature uniformity of insulating thermal conductive sheet in traditional water-cooled power supplies are solved, achieving efficient heat conduction and temperature uniformity, and improving the stability and lifespan of the power supply.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GREAT WALL POWER SUPPLY TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-17
AI Technical Summary
In traditional water-cooled power supplies, aging, cracking, or mismatch in the coefficient of thermal expansion of the thermal conductive adhesive can lead to increased thermal resistance and decreased heat dissipation performance. The limited thermal conductivity and poor temperature uniformity of the insulating thermal pad can cause localized heat accumulation, affecting the stability and lifespan of the power supply.
A composite thermal conductivity structure of graphene heat sink and heat pipe is adopted. The graphene heat sink is used for high-power modules, and the heat pipe is used for EMI modules. The graphene heat sink quickly and evenly distributes heat and conducts heat to the water-cooled plate, while the heat pipe conducts heat from the EMI module to the water-cooled plate, achieving uniform temperature and efficient heat dissipation.
It improves the heat conduction efficiency of the power supply, avoids local overheating, enhances temperature uniformity, improves the stability and lifespan of the power supply, avoids protective shutdown, and improves heat dissipation performance.
Smart Images
Figure CN224521407U_ABST