导热结构、散热装置及电气设备
By setting a heat-conducting structure between high-power components and the liquid-cooled structure, the contact area is increased, which solves the problem of poor heat conduction, achieves effective heat dissipation, and improves the performance and lifespan of the components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN HONGFA AUTOMOTIVE ELECTRONICS CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the thermal conductivity between high-power components and liquid cooling structures is poor, resulting in ineffective heat dissipation, which affects performance and service life, and poses safety hazards.
A heat-conducting structure is adopted, including a first heat-conducting element and a bent second heat-conducting element, to increase the contact area with the liquid cooling structure. The first heat-conducting element contacts the top surface of the liquid cooling structure, and the second heat-conducting element contacts the side surface of the liquid cooling structure, thereby enhancing the heat transfer effect.
It improves heat dissipation efficiency, ensures the performance and lifespan of heating elements, and reduces safety hazards.
Smart Images
Figure CN224521408U_ABST
Abstract
Claims
1. A thermally conductive structure, characterized by, The heat-conducting structure is used to transfer the heat generated by the heating element to the liquid-cooled structure, and includes: A first heat-conducting element is located between the heating element and the liquid-cooling structure, and is in contact with the surface of the liquid-cooling structure facing the heating element; and A second heat-conducting element is disposed on the first heat-conducting element and bent relative to the first heat-conducting element toward the liquid cooling structure, and the second heat-conducting element is in contact with the side of the liquid cooling structure.
2. The thermally conductive structure of claim 1, wherein, The dimension of the second heat-conducting element along the height direction is 1 / 3 to 3 / 4 of the dimension of the liquid cooling structure along the height direction; And / or, the dimension of the second heat-conducting element along the width direction is 1 / 3 to 3 / 4 of the dimension of the first heat-conducting element along the width direction; And / or, the area of the first heat-conducting element is greater than or equal to the area of the high-power component in the heating element.
3. The thermally conductive structure of claim 1, wherein, There is a preset gap between the second heat-conducting component and the side of the liquid-cooled structure, and the preset gap is used to fill the heat-conducting adhesive.
4. The thermally conductive structure of claim 3, wherein, The preset spacing ranges from 0.5mm to 0.9mm.
5. The thermally conductive structure according to any one of claims 1 to 4, characterized in that, The heat-conducting structure further includes a first heat-conducting pad, which is disposed between the heating element and the first heat-conducting component; And / or, the thermally conductive structure further includes a second thermally conductive pad, which is disposed between the first thermally conductive element and the liquid cooling structure.
6. The thermally conductive structure according to any one of claims 1 to 4, wherein The heat-conducting structure also includes a plurality of mounting lugs, which are spaced apart on the edge of the first heat-conducting element and are mounted in the mounting housing of the electrical equipment.
7. The thermally conductive structure of claim 6, wherein, The mounting lug includes a connecting body and a mounting body. The connecting body extends along the height direction, with one end connected to the edge of the first heat-conducting element and the other end connected to the mounting body. The mounting body extends away from the first heat-conducting element and has mounting holes for fasteners to pass through in order to mount the mounting body to the mounting housing.
8. The thermally conductive structure of any one of claims 1 to 4, wherein, The first heat-conducting component and the second heat-conducting component are an integral structure, or the first heat-conducting component and the second heat-conducting component are designed separately; And / or, the first heat-conducting element and the second heat-conducting element are heat-conducting aluminum plates.
9. A heat dissipating device characterized by comprising: Includes a heating element, a liquid cooling structure, and a heat-conducting structure as described in any one of claims 1 to 8; The heating element includes a circuit board and high-power components. The circuit board is located on one side of the liquid cooling structure, and the high-power components are disposed on the surface of the circuit board opposite to the liquid cooling structure. The first heat-conducting element of the heat-conducting structure is located between the circuit board and the liquid cooling structure, and the second heat-conducting element of the heat-conducting structure is disposed on the side of the liquid cooling structure.
10. An electrical device, characterized by It includes a mounting housing and a heat dissipation device as described in claim 9, wherein the heat dissipation device is disposed in the mounting housing.