一种域控制器及车辆

By designing a heat dissipation fin array and an electromagnetic shielding layer, the problem of overheating of the domain controller in complex environments is solved, improving heat dissipation efficiency and electromagnetic shielding performance, and ensuring the stable operation of the domain controller.

CN224521410UActive Publication Date: 2026-07-17JINGDONG KUNPENG (JIANGSU) TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JINGDONG KUNPENG (JIANGSU) TECH CO LTD
Filing Date
2025-07-03
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing domain controllers are complex in structure, expensive, and prone to overheating of the core board in complex environments.

Method used

It adopts a heat dissipation fin array design, combined with an electromagnetic shielding layer and a sealing structure. The heat dissipation efficiency and electromagnetic shielding performance are improved through heat dissipation channels and electromagnetic shielding layer, and the protection level is enhanced through sealing structure.

Benefits of technology

It enables stable operation of the domain controller in complex environments, improves heat dissipation and electromagnetic shielding performance, and reduces the risk of temperature and electromagnetic interference to the domain controller.

✦ Generated by Eureka AI based on patent content.

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Abstract

本实用新型公开了一种域控制器及车辆,涉及智能控制技术领域。本实用新型的域控制器包括上壳、下壳和域控制板本体;其中,上壳与下壳连接并围成收容空间,域控制板本体设置于收容空间内;上壳外表面设置散热结构和散热鳍片阵列,散热鳍片为曲面,散热鳍片的一端靠近散热结构、另一端朝向远离散热结构的方向以曲线形式延伸;上壳的散热结构安装处的内表面设置向内凸起的导热台阶。本实用新型实施例的域控制器能够引导冷空气流经域控制板本体中的发热部位,快速将域控制板本体工作产生的热量释放掉,保证域控制器满足复杂环境下的运行。
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Claims

1. A domain controller, characterized in that, The system includes an upper shell (10), a lower shell (20), and a domain control board body (30); wherein the upper shell (10) and the lower shell (20) are connected and form a receiving space, and the domain control board body (30) is disposed in the receiving space; the outer surface of the upper shell (10) is provided with a heat dissipation structure and a heat dissipation fin array, one end of the heat dissipation fin (11) is close to the heat dissipation structure, and the other end extends in a radial curve toward the domain control board body (30); a heat dissipation channel is formed between two adjacent heat dissipation fins (11) to guide the airflow generated by the heat dissipation structure through the domain control board body (30); the inner surface of the heat dissipation structure mounting location of the upper shell (10) is provided with an inwardly protruding heat-conducting step (12).

2. The domain controller of claim 1, wherein, The domain control board body (30) is provided with an external interface on the front side, and the upper shell (10) and the lower shell (20) are provided with external interface holes on the front side. The external interface is connected to external devices through the external interface holes. The inner surface of the upper shell (10) is provided with a first electromagnetic shielding layer (13) extending in the left-right direction, and / or the inner surface of the lower shell (20) is provided with a second electromagnetic shielding layer (21) extending in the left-right direction; the first electromagnetic shielding layer (13) and the second electromagnetic shielding layer (21) are used to achieve electromagnetic shielding performance between the domain control board body (30) and the external interface.

3. The domain controller of claim 2, wherein, Conductive foam is provided between the first electromagnetic shielding layer (13) and the domain control board body (30), and / or between the second electromagnetic shielding layer (21) and the domain control board body (30).

4. The domain controller of claim 1, wherein, The upper shell (10) has a sealing step (14) at the shell joint, and the lower shell (20) has a sealing groove (22) at the shell joint. The upper shell (10) and the lower shell (20) achieve the closure of the receiving space at the shell joint through the interference fit between the sealing step (14) and the sealing groove (22).

5. The domain controller of claim 1 or 4, wherein, A sealing strip (50) is provided at the joint between the upper shell (10) and the lower shell (20).

6. The domain controller as claimed in claim 1, characterized in that, The outer surface of the upper shell (10) is provided with an upwardly protruding mounting step (15), and the heat dissipation structure is mounted on the mounting step (15).

7. The domain controller of claim 1 or 6, wherein, The heat dissipation structure includes a cooling fan (16) and a fan cover (17).

8. The domain controller of claim 1, wherein, A debugging interface hole is provided between the upper shell (10) and the lower shell (20) to expose the debugging interface of the domain controller body (30); the domain controller also includes a debugging port cover (60) for closing the debugging interface.

9. The domain controller of claim 8, wherein, The domain controller also includes a debug window seal (70), which is disposed between the debug port cover (60) and the debug interface.

10. A vehicle characterized by comprising: include: The domain controller as described in any one of claims 1 to 9.