一种域控制器及车辆
By designing a heat dissipation fin array and an electromagnetic shielding layer, the problem of overheating of the domain controller in complex environments is solved, improving heat dissipation efficiency and electromagnetic shielding performance, and ensuring the stable operation of the domain controller.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JINGDONG KUNPENG (JIANGSU) TECH CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-17
AI Technical Summary
Existing domain controllers are complex in structure, expensive, and prone to overheating of the core board in complex environments.
It adopts a heat dissipation fin array design, combined with an electromagnetic shielding layer and a sealing structure. The heat dissipation efficiency and electromagnetic shielding performance are improved through heat dissipation channels and electromagnetic shielding layer, and the protection level is enhanced through sealing structure.
It enables stable operation of the domain controller in complex environments, improves heat dissipation and electromagnetic shielding performance, and reduces the risk of temperature and electromagnetic interference to the domain controller.
Smart Images

Figure CN224521410U_ABST
Abstract
Claims
1. A domain controller, characterized in that, The system includes an upper shell (10), a lower shell (20), and a domain control board body (30); wherein the upper shell (10) and the lower shell (20) are connected and form a receiving space, and the domain control board body (30) is disposed in the receiving space; the outer surface of the upper shell (10) is provided with a heat dissipation structure and a heat dissipation fin array, one end of the heat dissipation fin (11) is close to the heat dissipation structure, and the other end extends in a radial curve toward the domain control board body (30); a heat dissipation channel is formed between two adjacent heat dissipation fins (11) to guide the airflow generated by the heat dissipation structure through the domain control board body (30); the inner surface of the heat dissipation structure mounting location of the upper shell (10) is provided with an inwardly protruding heat-conducting step (12).
2. The domain controller of claim 1, wherein, The domain control board body (30) is provided with an external interface on the front side, and the upper shell (10) and the lower shell (20) are provided with external interface holes on the front side. The external interface is connected to external devices through the external interface holes. The inner surface of the upper shell (10) is provided with a first electromagnetic shielding layer (13) extending in the left-right direction, and / or the inner surface of the lower shell (20) is provided with a second electromagnetic shielding layer (21) extending in the left-right direction; the first electromagnetic shielding layer (13) and the second electromagnetic shielding layer (21) are used to achieve electromagnetic shielding performance between the domain control board body (30) and the external interface.
3. The domain controller of claim 2, wherein, Conductive foam is provided between the first electromagnetic shielding layer (13) and the domain control board body (30), and / or between the second electromagnetic shielding layer (21) and the domain control board body (30).
4. The domain controller of claim 1, wherein, The upper shell (10) has a sealing step (14) at the shell joint, and the lower shell (20) has a sealing groove (22) at the shell joint. The upper shell (10) and the lower shell (20) achieve the closure of the receiving space at the shell joint through the interference fit between the sealing step (14) and the sealing groove (22).
5. The domain controller of claim 1 or 4, wherein, A sealing strip (50) is provided at the joint between the upper shell (10) and the lower shell (20).
6. The domain controller as claimed in claim 1, characterized in that, The outer surface of the upper shell (10) is provided with an upwardly protruding mounting step (15), and the heat dissipation structure is mounted on the mounting step (15).
7. The domain controller of claim 1 or 6, wherein, The heat dissipation structure includes a cooling fan (16) and a fan cover (17).
8. The domain controller of claim 1, wherein, A debugging interface hole is provided between the upper shell (10) and the lower shell (20) to expose the debugging interface of the domain controller body (30); the domain controller also includes a debugging port cover (60) for closing the debugging interface.
9. The domain controller of claim 8, wherein, The domain controller also includes a debug window seal (70), which is disposed between the debug port cover (60) and the debug interface.
10. A vehicle characterized by comprising: include: The domain controller as described in any one of claims 1 to 9.