一种毫米波测云仪散热结构

By designing a fan assembly and heat sink structure in the millimeter-wave cloud measuring instrument, the problem of excessive temperature caused by direct sunlight and self-heating of components was solved, achieving higher stability and lifespan.

CN224521418UActive Publication Date: 2026-07-17ANHUI TIANMU DEFENSE TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ANHUI TIANMU DEFENSE TECH CO LTD
Filing Date
2025-07-14
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing millimeter-wave cloud measuring instruments suffer from excessively high internal temperatures due to direct sunlight and self-heating of components, affecting their stability and lifespan.

Method used

The system employs an internal fan assembly and heat sink structure. Through the design of air inlets and outlets, combined with the fan assembly and heat sink, heat dissipation is achieved for the transmitting, receiving, and control components, preventing the accumulation of hot air.

Benefits of technology

It effectively reduced the internal temperature of the cloud measuring instrument, improved its stability and lifespan, and enhanced the operational reliability of electronic components.

✦ Generated by Eureka AI based on patent content.

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Abstract

本实用新型公开了一种毫米波测云仪散热结构,属于测云仪技术领域,包括箱体,所述箱体底面中部固定连接有安装盒,所述安装盒内固定安装有发射组件与接收组件,所述发射组件与所述接收组件顶部均固定安装有固定筒,两个所述固定筒之间以及所述固定筒与所述箱体侧壁之间均固定连接有挡板。该毫米波测云仪散热结构,通过位于上方的第二风扇组件配合位于底部的进风口,实现对箱体内热空气的排出,通过位于底部的第二风扇组件配合位于底部的的进风口,实现对控制组件与安装盒的散热,相较现有的装置,避免了由于阳光直射以及控制组件与发射组件自发热导致的箱体温度过高的问题,提高使用寿命与稳定性。
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Claims

1. A millimeter wave cloud detector heat dissipation structure comprising a box (1), characterized in that, A mounting box (2) is fixedly connected to the middle of the bottom surface of the housing (1). A transmitting component (3) and a receiving component (4) are fixedly installed inside the mounting box (2). A fixing cylinder (5) is fixedly installed on the top of both the transmitting component (3) and the receiving component (4). A baffle (6) is fixedly connected between the two fixing cylinders (5) and between the fixing cylinder (5) and the side wall of the housing (1). The bottom of the baffle (6) is higher than the top surface of the mounting box (2). An air inlet (7) is opened on the bottom surface of the housing (1) on one side of the mounting box (2). A control component (8) for controlling the transmitting component (3) and the receiving component (4) is fixedly installed on the bottom surface of the box (1) on the other side of the box (2). A first air outlet (9) is opened on the bottom surface of the box (1) on both sides of the control component (8). A second air outlet (10) is opened through the upper part of the side wall of the box (1) facing the first air outlet (9). A first fan assembly (11) and a second fan assembly (12) for blowing air out of the box (1) are fixedly installed at the first air outlet (9) and the second air outlet (10), respectively.

2. The millimeter wave cloud sensor heat sink structure of claim 1, wherein, The air inlet (7), the first air outlet (9), and the second air outlet (10) are all magnetically fitted with filter plates (13).

3. The millimeter wave cloud sensor heat sink structure of claim 2, wherein, A water baffle (14) for blocking rainwater is fixedly connected to the outer wall of the box (1) at the second air outlet (10).

4. The millimeter wave cloud sensor heat sink structure of claim 3, wherein, The baffle (6) has multiple ventilation holes (15) through it.

5. The millimeter wave cloud sensor heat sink structure of claim 4, wherein, A third fan assembly (16) for blowing air into the housing (1) is fixedly installed at the air inlet (7).

6. The millimeter wave cloud sensor heat sink structure of claim 1, wherein, The mounting box (2) is fixedly connected to the side of the control component (8) with a heat sink (17).