一种散热器及电子设备
By setting guide blocks on both sides of the flow channel pressure plate, an obstruction is formed to the flow of fluid in the fluid channel, thereby increasing the flow rate and solving the flow resistance problem caused by fin expansion, achieving efficient heat dissipation and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MOORE THREADS TECH CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, the method of expanding the effective heat dissipation area by adding fins improves the heat dissipation effect, but it also increases the fluid flow resistance and weakens the fluid heat absorption effect, which cannot meet the heat dissipation requirements under high power conditions. Furthermore, increasing the flow rate will exacerbate the burden on the cooling circuit.
Design a heat sink that uses flow guide blocks extending away from the flow channel pressure plate on both sides to obstruct the flow of fluid in the fluid channel, reduce the diameter of the fluid passage, promote the flow rate, and thus quickly remove heat to meet the heat dissipation requirements of electronic components.
It achieves increased fluid flow rate and enhanced heat dissipation efficiency without increasing cooling circuit pressure, ensuring stable operation of electronic components, avoiding local overheating, and features a compact structure and high integration.
Smart Images
Figure CN224521425U_ABST