一种可快速散热的多层印制PCB线路板
By installing heat dissipation and buffer components under the multilayer printed PCB circuit board, the problems of poor heat dissipation and vibration are solved, achieving rapid heat dissipation and protection, and facilitating maintenance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU GLOBAL SUCCESS CIRCUIT CO LTD
- Filing Date
- 2025-07-25
- Publication Date
- 2026-07-17
AI Technical Summary
Existing multilayer printed PCBs have poor heat dissipation performance, making it difficult to dissipate heat effectively and quickly. Furthermore, long-term vibration may lead to fatigue fracture of solder joints, copper foil peeling, or interlayer delamination.
A heat dissipation assembly, including a heat sink and heat sink fins, is installed under the multi-layer circuit board body. A fan is used to accelerate heat dissipation, and a buffer assembly is used to reduce the impact of vibration on the circuit board. Aluminum material and corrugated design are used to improve heat dissipation efficiency, and buffer assembly and magnetic filter assembly are used for protection.
It enables rapid heat dissipation of multilayer circuit boards, reduces fatigue fracture of solder joints and delamination caused by vibration, and facilitates maintenance and replacement.
Smart Images
Figure CN224521427U_ABST
Abstract
Claims
1. A multilayer printed circuit board with rapid heat dissipation, comprising a multilayer circuit board body (1), a base plate (2), and a heat dissipation assembly (3), characterized in that: A heat sink (4) is fixed to the bottom of the multilayer circuit board body (1), and heat sink fins (5) are fixed at equal intervals at the bottom of the heat sink (4). The heat sink assembly (3) includes a housing (31) fixed to the top of the base plate (2). A mesh plate (32) and a mounting plate (33) are fixed inside the housing (31). A fan (34) is fixed inside the two openings at the top of the mounting plate (33). A filter assembly (35) is installed at the air inlet on both sides of the housing (31). A buffer assembly (6) for protecting the multilayer circuit board body (1) is provided on the top of the base plate (2).
2. The multi-layer printed PCB circuit board of rapid heat dissipation according to claim 1, characterized in that: The buffer assembly (6) includes four buffer seats (61) fixed to the top of the base plate (2). Buffer blocks (62) slide inside the openings at the top of the buffer seats (61). The bottom four corners of the multilayer circuit board body (1) are fixed with locking blocks (63) that are adapted to the buffer blocks (62). The locking blocks (63) are respectively fitted onto the surface of the corresponding buffer blocks (62). The interior of the buffer seats (61) is provided with moving blocks (64) that are adapted to the buffer blocks (62). Damping buffers (65) are fixed on the buffer blocks (62) and the moving blocks (64). The other end of the damping buffers (65) is fixedly connected to the inner wall of the buffer seats (61).
3. The multi-layer printed PCB circuit board of rapid heat dissipation according to claim 2, characterized in that: Two of the locking blocks (63) are engaged with the first limiting strip (66) at the upper limit, and the other two locking blocks (63) are engaged with the second limiting strip (67) at the upper limit. The first limiting strip (66) and the second limiting strip (67) are fixedly connected by a bolt rod (68).
4. The multi-layer printed PCB circuit board of claim 1, wherein: The filter assembly (35) includes a frame (351) disposed at the air inlet of the housing (31), a filter screen (352) fixed inside the frame (351), a cathode magnetic frame (353) fixed at the air inlet of the housing (31), and an anode magnetic frame (354) fixed on one side wall of the frame (351), the anode magnetic frame (354) and the cathode magnetic frame (353) being attracted to each other.
5. A multilayer printed PCB circuit board with rapid heat dissipation according to claim 1, characterized in that: The base plate (2) has four mounting holes (7) at its top four corners.
6. The multi-layer printed PCB circuit board of claim 1, wherein: The heat sink (4) and heat sink fins (5) are both made of aluminum, and the heat sink fins (5) are all corrugated.