一种用于自行走设备的散热器件

By combining thermally conductive materials and heat dissipation fins, the problems of low heat dissipation efficiency and complex assembly of lidar are solved, achieving efficient heat dissipation and simplified assembly.

CN224521441UActive Publication Date: 2026-07-17ZHEJIANG SUNSEEKER IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHEJIANG SUNSEEKER IND CO LTD
Filing Date
2025-08-11
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing lidar heat dissipation designs are inefficient, have many heat dissipation components, and are difficult to assemble, resulting in high processing costs and complex assembly.

Method used

The plate and heat sink are made of thermally conductive materials. Combined with the thermally conductive components, the heat sink fins and air duct design achieve efficient heat dissipation and simplify the installation process.

Benefits of technology

It improves heat dissipation efficiency, reduces heat dissipation costs and assembly difficulty, and simplifies the installation of components.

✦ Generated by Eureka AI based on patent content.

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Abstract

本申请提供一种用于自行走设备的散热器件,应用于自主作业设备技术领域,所述散热器件包括板体、散热件以及导热件,所述板体由导热材料制成,所述板体上部限定上连接区域,用于连接第一待散热模组,散热件连接于所述板体上部,所述散热件邻近所述上连接区域构置,导热件连接于所述板体下部,所述导热件下部限定下连接区域,用于连接第二待散热模组,所述导热件由所述板体的下表面向下凸出形成,所述散热件一体成型于所述板体的上表面上,所述导热件与上连接区域在垂直于板体的方向上错开布置,通过上述散热器件的构造,可同时连接两个待散热模组并对二者进行散热,从而提高散热效能。
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Claims

1. A heat dissipating device for a self-propelled apparatus, characterized by, include: The plate is made of thermally conductive material, and the upper part of the plate defines an upper connection area for connecting the first module to be cooled. A heat sink is connected to the upper part of the plate body, and the heat sink is configured adjacent to the upper connection area; as well as A heat-conducting component is connected to the lower part of the plate body. The lower part of the heat-conducting component defines a lower connection area for connecting a second module to be cooled.

2. The heat dissipating device for a self- walking device according to claim 1, characterized by, The heat-conducting element is formed by protruding downward from the lower surface of the plate.

3. The heat dissipating device for a self- walking device according to claim 1 or 2, characterized in that, The heat sink is integrally formed on the upper surface of the plate.

4. The heat dissipating device for a self- walking device according to claim 1, characterized by, The heat-conducting component and the upper connecting area are staggered in a direction perpendicular to the plate.

5. The heat dissipating device for a self- walking device according to claim 1, characterized by, The first heat dissipation module is connected to the board and / or heat sink.

6. The heat dissipating device for a self- walking device according to claim 1, characterized by, The heat sink includes multiple heat sink fins, and a heat sink duct is formed between adjacent heat sink fins. The heat sink duct is at least partially opposite to the upper connecting area along the duct direction.

7. The heat dissipating device for a self- walking device according to claim 1, wherein The heat dissipation component includes a first row of heat dissipation fins; The first heat dissipation fin array contains multiple first heat dissipation air ducts arranged at intervals, and the first heat dissipation air ducts are arranged parallel to the traveling direction of the self-propelled device.

8. The heat dissipating device for a self- walking device according to claim 7, wherein The heat dissipation component includes a second heat dissipation fin array, within which a plurality of second heat dissipation air ducts are arranged at intervals, and the second heat dissipation air ducts are arranged perpendicular to the traveling direction of the self-propelled device.

9. The heat dissipating device for a self- walking device according to claim 8, wherein The heat sink includes two rows of second heat sink fins, which are arranged opposite each other on both sides of the upper connecting area, and the corresponding second heat sink ducts on both sides are adapted to form air convection.

10. The heat dissipating device for a self- walking device according to claim 7, wherein The first heat dissipation fin row includes end heat dissipation fins and inner heat dissipation fins. The end heat dissipation fins include a first fin portion and at least one second fin portion connected to each other. The extension direction of the first fin portion is parallel to the travel direction of the self-propelled device, and the extension direction of the second fin portion is perpendicular to the travel direction of the self-propelled device.

11. The heat dissipating device for a self- walking device according to claim 1, characterized by, The heat-conducting element is positioned on the plate to at least partially correspond to the heat-dissipating element in a direction perpendicular to the plate.

12. The heat dissipating device for a self- walking device according to claim 1, characterized by, The heat sink includes multiple airfoil-shaped heat sink fins.

13. The heat dissipating device for a self- walking device according to claim 1, characterized by, It further includes a support member connected to the lower part of the plate.

14. The heat dissipating device for a self- walking device according to claim 13, wherein The support member is an annular support member arranged around the edge of the plate.

15. The heat dissipating device for a self- walking device according to claim 1, characterized by, The lower connecting area is fixedly connected to the second heat dissipation module by thermally conductive silicone, and / or the upper connecting area is fixedly connected to the first heat dissipation module by thermally conductive silicone.