一种用于主辅通道温度变送器的内嵌式散热机构
By using the embedded heat dissipation mechanism with the guide block and guide groove plugging and external thread connection, combined with the fan and guide plate design, the problems of insufficient heat dissipation capacity and inconvenient fin installation of the main and auxiliary channel temperature transmitters are solved, achieving efficient and uniform heat dissipation and long service life of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING TIANPU ELECTRICAL SYST ENG CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-17
Smart Images

Figure CN224521445U_ABST
Abstract
Claims
1. An embedded heat dissipation mechanism for a main and auxiliary channel temperature transmitter, comprising a temperature transmitter body (1), a housing (2), and a rear cover (3), characterized in that: A data analysis component (12) is fixedly installed on the inner wall of the outer shell (2). An installation groove (6) is provided between the outer shell (2) and the data analysis component (12). An installation sleeve (7) is provided on the inner wall of the installation groove (6). A heat dissipation fin (8) and a guide block (10) are fixedly installed on the side of the installation sleeve (7) away from the data analysis component (12). An air hole (9) is provided on the outer wall of the heat dissipation fin (8). A guide block (11) is fixedly installed on the side of the installation sleeve (7) close to the data analysis component (12). A guide groove (13) is provided on the inner wall of the outer shell (2). A guide groove (14) is provided on the outer wall of the data analysis component (12). A baffle plate (15) is fixedly installed on the end of the data analysis component (12) close to the rear cover (3). A fan (16) is fixedly installed on the inner wall of the rear cover (3). An air outlet (17) is provided on the outer wall of the outer shell (2) away from the rear cover (3).
2. The in-line heat sink mechanism for a primary / secondary channel temperature transmitter of claim 1, wherein: The first guide block (10) and the first guide groove (13) are connected by a plug-in joint, and the second guide block (11) and the second guide groove (14) are connected by a plug-in joint.
3. The in-line heat sink mechanism for a primary / secondary channel temperature transmitter of claim 1, wherein: The outer shell (2) has an external thread (4) at one end near the rear cover (3), and the rear cover (3) has an internal thread (5) at one end near the outer shell (2). The external thread (4) and the internal thread (5) are compatible.
4. The in-line heat sink mechanism for a primary / secondary channel temperature transmitter of claim 1, wherein: The air outlet (17) is connected to the mounting groove (6), and the center line of the mounting sleeve (7) and the fan (16) are on the same horizontal line.
5. The in-line heat sink mechanism for a primary / secondary channel temperature transmitter of claim 1, wherein: The air holes (9) are provided in multiple identical manner, and the multiple air holes (9) are distributed at equal intervals.
6. The in-line heat sink mechanism for a primary / secondary channel temperature transmitter of claim 1, wherein: The heat dissipation fins (8) are provided in multiple identical manner, and the multiple heat dissipation fins (8) are arranged in a ring.
7. The in-line heat sink mechanism for a primary / secondary channel temperature transmitter of claim 1, wherein: The cross-section of the guide plate (15) is in the shape of a frustum, and the center line of the guide plate (15) and the fan (16) are on the same horizontal line.